公开(公告)号：US06995616B2

公开(公告)日：2006-02-07

申请号：US10799837

申请日：2004-03-12

申请人： Arya Reza Behzad ,  Akira Ito

发明人： Arya Reza Behzad ,  Akira Ito

IPC分类号： H03F3/04

CPC分类号： H03F1/223 ,  H03F2200/372

摘要： A power amplifier includes a transconductance stage, a cascode stage, and may include a signal level detection and bias determination module. The transconductance stage is operable to receive an input voltage signal and to produce an output current signal. The cascode stage communicatively couples to the transconductance stage and is operable to receive the output current signal and to produce an output voltage signal based thereupon. The cascode stage includes a Metal Oxide Silicon (MOS) transistor and a corresponding parasitic bipolar junction transistor, each of the gate of the MOS transistor and the base of the parasitic bipolar junction transistor available for voltage control. The signal level detection and bias determination module operably couples to the cascode stage and is operable to controllably bias the gate of the MOS transistor and to controllably bias the base of the corresponding parasitic bipolar junction transistor.

摘要翻译： 功率放大器包括跨导级，共源共栅级，并且可以包括信号电平检测和偏置确定模块。 跨导级可操作以接收输入电压信号并产生输出电流信号。 共源共栅级通信耦合到跨导级并且可操作以接收输出电流信号并且基于此产生输出电压信号。 共源共栅级包括金属氧化物硅（MOS）晶体管和相应的寄生双极结型晶体管，MOS晶体管的栅极和寄生双极结型晶体管的基极可用于电压控制。 信号电平检测和偏置确定模块可操作地耦合到共源共栅级，并且可操作地可控制地偏置MOS晶体管的栅极并且可控地偏置相应的寄生双极结型晶体管的基极。

公开(公告)号：US06894558B2

公开(公告)日：2005-05-17

申请号：US10760492

申请日：2004-01-21

申请人： Arya Reza Behzad

发明人： Arya Reza Behzad

IPC分类号： H03G1/00 ,  H03G3/00 ,  H03G3/30 ,  H03G5/10 ,  H03H11/24 ,  H03K5/00

CPC分类号： H03G5/10 ,  H03G1/0088 ,  H03G3/001 ,  H03G3/3036 ,  H03H11/245

摘要： Often programmable gain attenuators (PGAs) are combined with high pass filters. Adjustment of the highpass filter however can have unintended effects, such as changing the step size of the PGA. By placing the resistance of the highpass filter in parallel with a programmable attenuator divider, the steps of the PGA can be minimally affected as the highpass frequency is adjusted.

摘要翻译： 通常可编程增益衰减器（PGA）与高通滤波器组合。 然而，高通滤波器的调整可能会产生意想不到的影响，例如改变PGA的步长。 通过将高通滤波器的电阻与可编程衰减器分压器并联，PGA的步骤可以在高通滤波器调整时受到最小的影响。

公开(公告)号：US06696892B1

公开(公告)日：2004-02-24

申请号：US09712410

申请日：2000-11-13

申请人： Arya Reza Behzad

发明人： Arya Reza Behzad

IPC分类号： H03F114

CPC分类号： H03G1/0088 ,  H03G3/001 ,  H03G3/3036

摘要： A design of integrated circuit components to prevent accidental turn on when large input signals are accepted. With integrated circuits operated at lower power supply voltages, input signals having large peak values can tend to turn on devices within the integrated circuit erroneously. By placing amplifiers within the integrated circuits where input signals are received and removing the power of such amplifiers, accidental turn on can be minimized.

摘要翻译： 集成电路组件的设计，以防止在大输入信号被接受时意外接通。 利用在较低电源电压下工作的集成电路，具有大峰值的输入信号可能会错误地打开集成电路内的器件。 通过将放大器放置在接收输入信号的集成电路中，并且去除这种放大器的功率，可以最小化意外导通。

公开(公告)号：US06667654B2

公开(公告)日：2003-12-23

申请号：US10360810

申请日：2003-02-10

申请人： Arya Reza Behzad ,  Frank Wayne Singor

发明人： Arya Reza Behzad ,  Frank Wayne Singor

IPC分类号： G05F110

CPC分类号： H03F3/45183 ,  G05F3/262 ,  H03F2203/45508

摘要： Methods and apparatus for improving the current matching within current mirror circuits in applications such as low voltage integrated circuits. Embodiments of the present invention attempt to maintain the proper current ratio between reference and output supplies by adjusting the reference output of the current mirror. An existing reference voltage on the output side of the mirror can be used or a reference voltage can be created to be used for the voltage regulation of the reference side of the current mirror.

公开(公告)号：US06396335B1

公开(公告)日：2002-05-28

申请号：US09712413

申请日：2000-11-13

申请人： Arya Reza Behzad ,  Frank Wayne Singor

发明人： Arya Reza Behzad ,  Frank Wayne Singor

IPC分类号： G05F110

CPC分类号： H03F3/45183 ,  G05F3/262 ,  H03F2203/45508

摘要： Methods and apparatus for improving the current matching within current mirror circuits in applications such as low voltage integrated circuits. Embodiments of the present invention attempt to maintain the proper current ratio between reference and output supplies by adjusting the reference output of the current mirror. An existing reference voltage on the output side of the mirror can be used or a reference voltage can be created to be used for the voltage regulation of the reference side of the current mirror.

摘要翻译： 用于改善电流镜像电路内的电流匹配的方法和装置，例如低压集成电路。 本发明的实施例通过调节电流镜的参考输出来尝试维持参考电压和输出电源之间的适当电流比。 可以使用反射镜的输出侧上的现有参考电压，或者可以创建用于电流镜的参考侧的电压调节的参考电压。

公开(公告)号：US09772880B2

公开(公告)日：2017-09-26

申请号：US12877729

申请日：2010-09-08

申请人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： H04W80/04 ,  G06F9/50 ,  H04B7/10 ,  H04B5/00 ,  H04W4/00 ,  H04W84/18 ,  H04B7/26

CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

摘要： Embodiments of the present invention are directed to a wireless bus for intra-chip and inter-chip communication having adaptable links and routes among wireless-enabled components (WECs) of the wireless bus. Links and routes may be adapted according to one or more of, among other factors, the relative position of WECs, available capabilities (e.g., communication capabilities) at WECs, availability of resources at WECs, and the physical environment.

公开(公告)号：US09209508B2

公开(公告)日：2015-12-08

申请号：US13248787

申请日：2011-09-29

申请人： Ahmadreza Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Ahmadreza Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： H01P1/18 ,  H01P1/06 ,  H01P3/00 ,  H01L23/522 ,  H01L23/66 ,  H01L25/065 ,  B81B7/00 ,  H01L41/09 ,  H01H59/00

摘要： Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

公开(公告)号：US09000558B2

公开(公告)日：2015-04-07

申请号：US12534640

申请日：2009-08-03

申请人： Ali Sarfaraz ,  Arya Reza Behzad

发明人： Ali Sarfaraz ,  Arya Reza Behzad

IPC分类号： H01L23/485 ,  H01L23/522 ,  H01L23/31

CPC分类号： H01L23/5227 ,  H01L23/3114 ,  H01L23/3192 ,  H01L23/5223 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2924/0002 ,  H01L2224/05552

摘要： A packaged integrated circuit includes an integrated circuit having a Radio Frequency (RF) passive element formed therein and a wafer level chip scale flip chip package that contains the integrated circuit. The wafer level chip scale flip chip package includes at least one dielectric layer isolating a top metal layer of the integrated circuit and a package signal connection upon the at least one dielectric layer, wherein the package signal connection partially overlays the RF passive element with respect to a surface of the integrated circuit. The RF passive element may be an inductor, a transformer, a capacitor, or another passive element. The package signal connection may be a conductive ball, a conductive bump, a conductive pad, or a conductive spring, for example. A conductive structure may reside upon the at least one dielectric layer to provide shielding to the RF passive element and may include a plurality of conductive elements or a mesh.

摘要翻译： 封装的集成电路包括其中形成有射频（RF）无源元件的集成电路和包含集成电路的晶片级芯片级倒装芯片封装。 晶片级芯片尺寸倒装芯片封装包括隔离集成电路的顶部金属层和至少一个电介质层上的封装信号连接的至少一个电介质层，其中封装信号连接部分地覆盖RF无源元件相对于 集成电路的表面。 RF无源元件可以是电感器，变压器，电容器或另一无源元件。 封装信号连接例如可以是导电球，导电凸块，导电垫或导电弹簧。 导电结构可以位于至少一个电介质层上，以提供对RF无源元件的屏蔽，并且可以包括多个导电元件或网状物。

公开(公告)号：US08971806B2

公开(公告)日：2015-03-03

申请号：US12877723

申请日：2010-09-08

申请人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

发明人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC分类号： H04B7/00 ,  G06F13/42 ,  H04B7/10 ,  G06F13/364 ,  H04W84/18

CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

摘要： Embodiments of the present invention are directed to a scalable wireless bus for intra-chip and inter-chip communication. The scalable wireless bus includes a plurality of wireless-enabled components (WECs). In an embodiment, the scalable wireless bus may have at least one of the number of links among WECs and the capacity of said links adapted based on one or more factors. For example, the number of links and the capacity of the links may be adapted according to one or more of, among other factors, expected activity level over the wireless bus, desired power consumption, delay, and interference levels.

摘要翻译： 本发明的实施例涉及用于片内和芯片间通信的可扩展无线总线。 可扩展无线总线包括多个无线使能组件（WEC）。 在一个实施例中，可扩展无线总线可以具有基于一个或多个因素的WEC之间的链路数量和所述链路的容量中的至少一个链路。 例如，链路的数量和链路的容量可以根据无线总线上的预期活动级别，期望的功率消耗，延迟和干扰级别中的一个或多个来调整。

公开(公告)号：US08855025B2

公开(公告)日：2014-10-07

申请号：US12264472

申请日：2008-11-04

申请人： Vinko Erceg ,  Brima B. Ibrahim ,  Jeyhan Karaoguz ,  John Walley ,  Arya Reza Behzad ,  David Rosmann

发明人： Vinko Erceg ,  Brima B. Ibrahim ,  Jeyhan Karaoguz ,  John Walley ,  Arya Reza Behzad ,  David Rosmann

IPC分类号： H04B7/005 ,  H04W28/18 ,  H04W92/02 ,  H04B7/04 ,  H04W88/06 ,  H04W72/02

CPC分类号： H04W28/18 ,  H04B7/0413 ,  H04W72/02 ,  H04W88/06 ,  H04W92/02

摘要： A management unit includes a communication device interface for facilitating a bidirectional data communication with multiservice communication devices via a wireless control channel, the bidirectional data communication including outbound control data sent to at least one of the multiservice communication devices and inbound control data received from at least one of the multiservice communication devices. At least one of the multiservice communication devices includes a collaboration module. A network interface receives network resource data from a plurality of networks. A management processing unit processes the inbound control data and the network resource data and that generates the outbound control data in response thereto to collaboratively establish at least one device setting of at least one of the multiservice communication devices via the collaboration module. The wireless control channel may be separate from the communication between the multiservice communication devices and the networks or embedded in network communications.

摘要翻译： 管理单元包括通信设备接口，用于经由无线控制信道促进与多业务通信设备的双向数据通信，所述双向数据通信包括发送到多业务通信设备中的至少一个的出站控制数据以及从至少接收到的入站控制数据 多业务通信设备之一。 多业务通信设备中的至少一个包括协作模块。 网络接口从多个网络接收网络资源数据。 管理处理单元处理入站控制数据和网络资源数据，并且响应于此产生出站控制数据，以通过协作模块协作地建立多业务通信设备中的至少一个的至少一个设备设置。 无线控制信道可以与多业务通信设备和网络之间的通信分离或嵌入在网络通信中。