摘要:
Methods, circuits, devices, and systems are provided, including a low voltage data path and current sense amplifier. One data path includes a local input/output (LIO) line and a global input/output (GIO) line each having first and second signal lines. A source follower circuit, coupled between the LIO line and the GIO line, includes first and second n-channel MOS (NMOS) transistors having a drain coupled to the first and the second signal lines of the GIO and a gate coupled to the first and the second signal lines of the LIO. A third NMOS transistor has a source coupled to the source of the first and the second NMOS transistors, a gate coupled to a reference voltage supply and a drain coupled to a drain of a fourth NMOS transistor. The fourth NMOS has a gate to which a selection signal is applied and a source coupled to a ground.
摘要:
Circuits and methods are provided for precharging pairs of memory digit lines. The final precharge voltage of the digit lines is different from the average of the digit line voltages prior to precharging. The final precharge voltage can be set by appropriately selecting the size of a capacitor in the precharge circuit.
摘要:
A system and method to reduce standby leakage current in the event of row-to-column shorts in a memory chip or in an electronic device having memory or data storage elements is disclosed. In case of memory rows or wordlines precharged to a negative wordline voltage (VNWL), the standby leakage current through Psense-amplifiers in the memory is substantially eliminated when the gates of isolation (ISO) transistors associated with the shorted wordline and digitline(s) are held at the VNWL level by an isolation signal driven to the VNWL level during the memory row standby state. The reduction in the standby leakage current further reduces the overall Icc current consumption from the memory circuit's supply or operating voltage Vcc, thereby reducing circuit's standby power consumption. Because the ISO gates are already fabricated with thick oxides, the present negative voltage driving methodology does not require modifying the sense amplifier layout or the configuration of existing isolation transistors in a memory chip. A different standby voltage level (Vcc/2 level) at the sense amplifier activation (ACT) signal may also be implemented. Because of the rules governing abstracts, this abstract should not be used to construe the claims.
摘要:
An internal power supply potential generation circuit includes an overcharge prevention circuit connected to an internal power supply node. The overcharge prevention circuit includes a circuit outputting a signal to be determined that is determined by an internal power supply potential, a differential amplification circuit amplifying a difference in potential between the signal to be determined and a reference potential for output to a node as a signal indicating that current should be drawn, and a current draw circuit drawing current from the internal power supply node in response to the signal indicating that current should be drawn. Thus the semiconductor integrated circuit device of interest can provide a steady internal power supply potential.
摘要:
This semiconductor device is provided with a wiring called a body line (BDL), a body section of a memory cell transistor is connected to this body line (BDL), and a potential of the body section is controlled by a body section controller connected to the body line. As a result, it is possible to propose a novel structure capable of keeping the potential of the body section low and to provide a semiconductor device and a manufacturing method therefor, capable of improving operation performance by contriving circuit operation.
摘要:
A memory array is divided into a plurality of memory sub blocks in row and column directions. A column selection line is provided in the column direction in a region between blocks. A block decoding circuit generating a local column selection signal is arranged corresponding to each of the memory sub blocks. A main I/O line pair group is provided for each of the memory sub blocks and each column of the memory sub block is connected to the corresponding main I/O line pair in accordance with the local column selection line. Thus, data with a desired bit width can be produced without any increase in area occupied by the array nor decrease in the speed of column access.
摘要:
For a write operation, a synchronous semiconductor memory device in a single-data-rate SDRAM operation mode selects a memory cell column in accordance with a column select signal produced from a write clock produced in synchronization with an external clock signal without shifting the write clock. In a double-data-rate SDRAM operation mode, the synchronous semiconductor memory device selects the memory cell column in accordance with the column select signal produced from the write clock produced in synchronization with the external clock signal and shifted by selected clocks.
摘要:
An input protective circuit in a semiconductor integrated circuit device includes a bipolar transistor arranged for an interconnection layer. An N-type active region in the bipolar transistor is connected to an electrode of a program element. The electrode is connected to the interconnection layer. The interconnection layer supplies a high voltage for breaking a dielectric of a program element. A voltage on a P-type well is externally adjusted via a resistance element. Thereby, erroneous program due to serge entering at the interconnection layer can be avoided.
摘要:
A driver circuit applies a write data whose level is inverted for every write cycle to a selected memory cell in accordance with a write data held by a latch circuit when a writing operation in a test operation mode is designated in the test operation mode. A read driver circuit applies a comparison result of sequentially read data to a latch circuit in accordance with a read clock signal in the test operation mode. Data input and output buffers operate in synchronization with an external clock signal.
摘要:
First and second memory banks are provided with M memory blocks each having first and second memory regions, M representing an even number of no less than two, and (M+1) sense amplifier bands arranged on opposite sides of each memory block, and have first and second select lines arranged therefor to select the first and second memory regions, respectively, the first select line being connected to an odd-numbered sense amplifier band of the first memory bank and an even-numbered sense amplifier band of the second memory bank, the second select line being connected to an even-numbered sense amplifier band of the first memory bank and an odd-numbered sense amplifier band of the second memory bank.