Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same
    81.
    发明申请
    Metal Wiring and Method of Manufacturing the Same, and Metal Wiring Substrate and Method of Manufacturing the Same 有权
    金属配线及其制造方法以及金属配线基板及其制造方法

    公开(公告)号:US20120211796A1

    公开(公告)日:2012-08-23

    申请号:US13465398

    申请日:2012-05-07

    IPC分类号: H01L33/00 H01L29/78

    摘要: A metal wiring suitable for a substrate of large size is provided. The present invention is characterized in that at least one layer of conductive film is formed on an insulating surface, a resist pattern is formed on the conductive film, and the conductive film having the resist pattern is etched to form a metal wiring while controlling its taper angle α in accordance with the bias power density, the ICP power density, the temperature of lower electrode, the pressure, the total flow rate of etching gas, or the ratio of oxygen or chlorine in etching gas. The thus formed metal wiring has less fluctuation in width or length and can satisfactorily deal with an increase in size of substrate.

    摘要翻译: 提供适合于大尺寸基板的金属布线。 本发明的特征在于,在绝缘表面上形成至少一层导电膜,在导电膜上形成抗蚀剂图案,并且蚀刻具有抗蚀剂图案的导电膜以形成金属布线,同时控制其锥度 根据偏置功率密度,ICP功率密度,下部电极的温度,压力,蚀刻气体的总流量,或蚀刻气体中的氧气或氯气的比例来确定角度α。 这样形成的金属布线的宽度或长度波动较小,并且可以令人满意地处理基板尺寸的增加。

    Semiconductor Device and Manufacturing Method Thereof
    84.
    发明申请
    Semiconductor Device and Manufacturing Method Thereof 有权
    半导体器件及其制造方法

    公开(公告)号:US20110254008A1

    公开(公告)日:2011-10-20

    申请号:US13169224

    申请日:2011-06-27

    IPC分类号: H01L33/16

    摘要: By providing appropriate TFT structures arranged in various circuits of the semiconductor device in response to the functions required by the circuits, it is made possible to improve the operating performances and the reliability of a semiconductor device, reduce power consumption as well as realizing reduced manufacturing cost and increase in yield by lessening the number of processing steps. An LDD region of a TFT is formed to have a concentration gradient of an impurity element for controlling conductivity which becomes higher as the distance from a drain region decreases. In order to form such an LDD region having a concentration gradient of an impurity element, the present invention uses a method in which a gate electrode having a taper portion is provided to thereby dope an ionized impurity element for controlling conductivity accelerated in the electric field so that it penetrates through the gate electrode and a gate insulating film into a semiconductor layer.

    摘要翻译: 通过根据电路所要求的功能,在半导体器件的各种电路中设置适当的TFT结构,可以提高半导体器件的工作性能和可靠性,降低功耗并降低制造成本 并通过减少处理步骤的数量来提高产量。 TFT的LDD区域形成为具有用于控制导电性的杂质元素的浓度梯度,该杂质元素随着与漏极区的距离减小而变高。 为了形成具有杂质元素的浓度梯度的这样的LDD区域,本发明使用了具有锥形部的栅电极的方法,从而掺杂电离杂质元素,以控制在电场中加速的电导率,从而 其穿过栅电极和栅绝缘膜进入半导体层。

    Semiconductor device and manufacturing method thereof
    85.
    发明授权
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US07968890B2

    公开(公告)日:2011-06-28

    申请号:US12009754

    申请日:2008-01-22

    IPC分类号: H01L29/04

    摘要: By providing appropriate TFT structures arranged in various circuits of the semiconductor device in response to the functions required by the circuits, it is made possible to improve the operating performances and the reliability of a semiconductor device, reduce power consumption as well as realizing reduced manufacturing cost and increase in yield by lessening the number of processing steps. An LDD region of a TFT is formed to have a concentration gradient of an impurity element for controlling conductivity which becomes higher as the distance from a drain region decreases. In order to form such an LDD region having a concentration gradient of an impurity element, the present invention uses a method in which a gate electrode having a taper portion is provided to thereby dope an ionized impurity element for controlling conductivity accelerated in the electric field so that it penetrates through the gate electrode and a gate insulating film into a semiconductor layer.

    摘要翻译: 通过根据电路所要求的功能,在半导体器件的各种电路中设置适当的TFT结构,可以提高半导体器件的工作性能和可靠性,降低功耗并降低制造成本 并通过减少处理步骤的数量来提高产量。 TFT的LDD区域形成为具有用于控制导电性的杂质元素的浓度梯度,该杂质元素随着与漏极区的距离减小而变高。 为了形成具有杂质元素的浓度梯度的这样的LDD区域,本发明使用了具有锥形部的栅电极的方法,从而掺杂电离杂质元素,以控制在电场中加速的电导率,从而 其穿过栅电极和栅绝缘膜进入半导体层。

    SOLID-STATE IMAGING APPARATUS AND DIGITAL CAMERA
    86.
    发明申请
    SOLID-STATE IMAGING APPARATUS AND DIGITAL CAMERA 有权
    固态成像设备和数码相机

    公开(公告)号:US20110058077A1

    公开(公告)日:2011-03-10

    申请号:US12846414

    申请日:2010-07-29

    申请人: Koji Ono

    发明人: Koji Ono

    IPC分类号: H04N5/335 H01L31/02

    摘要: The solid-state imaging apparatus illustrates a solid-state imaging element having a light receiving portion; a package which contains the solid-state imaging element; a light-transmissive member which is provided above the solid-state imaging element; and a partitioning member which is fixed to the package to isolate the light receiving portion of the solid-state imaging element from the surrounding portion of the light receiving portion of the solid-state imaging element.

    摘要翻译: 固态成像装置示出了具有光接收部分的固态成像元件; 包含固态成像元件的封装; 设置在固体摄像元件上方的透光性部件; 以及分隔构件,其固定到所述封装以将所述固态成像元件的所述光接收部分与所述固态成像元件的光接收部分的周围部分隔离。

    DESULFURIZATION-DENITRATION APPARATUS FOR EXHAUST GAS
    88.
    发明申请
    DESULFURIZATION-DENITRATION APPARATUS FOR EXHAUST GAS 有权
    用于排气的脱硫 - 脱气装置

    公开(公告)号:US20100233044A1

    公开(公告)日:2010-09-16

    申请号:US12679426

    申请日:2008-09-16

    IPC分类号: B01D53/18

    摘要: Adsorbent dust can be recovered while spraying is prevented. An apparatus is provided with a desulfurization-denitration tower body and an adsorbent discharging device. An entrance louver and an exit louver are provided for forming a packed moving bed of an adsorbent that moves downward inside the tower body, the apparatus has a throttle portion provided with a side panel that is inclined so that a spacing gradually decreases toward a discharging device, the throttle portion being provided between the tower body and the discharging device, and first partitions are provided inside the throttle portion. A second partition extending along the incline direction of the side panel is provided at a predetermined distance from the bottom end of the exit louver above the side panel, and a gap is provided between the bottom end part of the exit louver and the side panel of the throttle portion.

    摘要翻译: 吸附剂粉尘可以回收,同时防止喷涂。 设备具有脱硫脱硝塔体和吸附剂排出装置。 提供入口百叶窗和出口百叶窗,用于形成在塔体内向下移动的吸附剂的填充移动床,该装置具有设置有侧板的节流部,该侧板倾斜使得朝向排出装置逐渐减小的间隔 所述节流部设置在所述塔体与所述排出装置之间,所述第一隔壁设置在所述节流部内。 沿着侧板的倾斜方向延伸的第二分隔件设置在距离侧板的上方的出口百叶窗的底端预定的距离处,并且在出口百叶窗的底端部分与侧板之间设置间隙 节流部分。

    Semiconductor device and manufacturing method thereof
    89.
    发明申请
    Semiconductor device and manufacturing method thereof 有权
    半导体装置及其制造方法

    公开(公告)号:US20090101901A1

    公开(公告)日:2009-04-23

    申请号:US12009754

    申请日:2008-01-22

    IPC分类号: H01L29/04

    摘要: By providing appropriate TFT structures arranged in various circuits of the semiconductor device in response to the functions required by the circuits, it is made possible to improve the operating performances and the reliability of a semiconductor device, reduce power consumption as well as realizing reduced manufacturing cost and increase in yield by lessening the number of processing steps. An LDD region of a TFT is formed to have a concentration gradient of an impurity element for controlling conductivity which becomes higher as the distance from a drain region decreases. In order to form such an LDD region having a concentration gradient of an impurity element, the present invention uses a method in which a gate electrode having a taper portion is provided to thereby dope an ionized impurity element for controlling conductivity accelerated in the electric field so that it penetrates through the gate electrode and a gate insulating film into a semiconductor layer.

    摘要翻译: 通过根据电路所要求的功能,在半导体器件的各种电路中设置适当的TFT结构,可以提高半导体器件的工作性能和可靠性,降低功耗并降低制造成本 并通过减少处理步骤的数量来提高产量。 TFT的LDD区域形成为具有用于控制导电性的杂质元素的浓度梯度,该杂质元素随着与漏极区的距离减小而变高。 为了形成具有杂质元素的浓度梯度的这样的LDD区域,本发明使用了具有锥形部的栅电极的方法,从而掺杂电离杂质元素,以控制在电场中加速的电导率,从而 其穿过栅电极和栅绝缘膜进入半导体层。