公开(公告)号：US20040185749A1

公开(公告)日：2004-09-23

申请号：US10477675

申请日：2003-11-12

Inventor： Peter Lenard ,  Ernst Beck

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B23D63/001 ,  B23D63/123

Abstract: A grinding machine (10) for double-sided grinding of tooth flanks, in particular hard-metal tipped circular saw blades (14) is described. The grinding machine comprises two grinding units (16, 18) each with a grinding body, a first drive to move at least one of the two grinding units (16, 18) along a first axis (x1, x2) running perpendicular to a plane containing the saw blade (14) and also a second drive (36) to move at least one of the two grinding units (16, 18) along a second axis (z) running parallel to axes of rotation of the grinding bodies. Furthermore a third drive (38) is provided to move at least one of the two grinding units (16, 18) along a third axis (y) running parallel to the first (x1, x2) and the second (y) axis. A control method according to the invention for the grinding machine (10) provides that a tangential clearance angle of a tooth is varied along a tooth flank during the grinding of the tooth.

Abstract translation: 描述了用于齿面双面研磨的研磨机（10），特别是硬金属尖端的圆锯片（14）。 研磨机包括两个磨削单元（16,18），每个研磨单元具有研磨体，第一驱动器沿着垂直于平面运动的第一轴线（x1，x2）移动两个研磨单元（16,18）中的至少一个 包含锯片（14）以及第二驱动器（36），以沿着平行于研磨体旋转轴线延伸的第二轴线（z）移动两个研磨单元（16,18）中的至少一个。 此外，提供第三驱动器（38）以沿着平行于第一（x1，x2）和第二（y）轴线延伸的第三轴线（y）移动两个研磨单元（16,18）中的至少一个。 根据本发明的用于研磨机（10）的控制方法提供了在磨削齿期间齿的切向间隙角沿着齿面变化。

公开(公告)号：US20040176015A1

公开(公告)日：2004-09-09

申请号：US10248950

申请日：2003-03-05

Inventor： Peter Lahnor ,  Olaf Kuehn ,  Andreas Roemer ,  Alexander Simpson

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B49/00

Abstract: A method of determining the endpoint of a planarizing process is disclosed. An endpoint detection signal is selectively sampled from at least one predetermined location within a planarizing region defined on a planarizing web. Planarization is stopped when the endpoint criterion based on the endpoint detection signal is detected.

Abstract translation: 公开了一种确定平坦化工艺终点的方法。 端点检测信号从在平坦化网上限定的平坦化区域内的至少一个预定位置选择性地采样。 当检测到基于端点检测信号的端点标准时，停止平面化。

公开(公告)号：US20040166767A1

公开(公告)日：2004-08-26

申请号：US10774528

申请日：2004-02-10

Applicant: NISSAN MOTOR CO., LTD.

Inventor： Kiyoshi Hasegawa ,  Masahiko Iizumi ,  Masahiro Omata ,  Takashi Ogino ,  Tomohiro Kondo ,  Kazuo Takeda ,  Takafumi Watanabe ,  Yoshiyuki Chida ,  Yasushi Matsushita

IPC: B24B051/00

CPC classification number: B24B49/16 ,  B24B5/42 ,  B24B19/12 ,  B24B21/00

Abstract: A lapping apparatus lapping a work having a pre-machined surface comprises a lapping film which includes a thin substrate having a surface provided with abrasive grains, a shoe disposed at a back surface side of the lapping film, a shoe driving unit which drives the shoe toward the work in order to press the abrasive-grained surface of the lapping film to the pre-machined surface of the work, a rotational driving unit which drives the work rotationally, a detecting unit which detects the position of the rotating work in the rotating direction, and a controlling unit which controls the pressing force of the shoe driving unit so as to drive the shoe correspondingly to the position of the work in the rotating direction during machining.

Abstract translation: 研磨具有预加工表面的工件的研磨装置包括研磨膜，其包括具有设置有磨粒的表面的薄基材，设置在研磨膜的背面侧的鞋，驱动鞋的鞋驱动单元 朝向工作以将研磨膜的磨粒表面压到工件的预加工表面上，旋转驱动单元，其旋转地驱动工作;检测单元，其检测旋转工件在旋转中的位置 方向和控制单元，其控制鞋驱动单元的按压力，以便在加工期间相应于工件在旋转方向上的位置驱动鞋。

公开(公告)号：US20040157530A1

公开(公告)日：2004-08-12

申请号：US10772593

申请日：2004-02-06

Applicant: NISSAN MOTOR, CO., LTD.

Inventor： Masahiro Omata ,  Masahiko Iizumi ,  Kiyoshi Hasegawa ,  Takashi Ogino ,  Tomohiro Kondo ,  Kazuo Takeda ,  Takafumi Watanabe ,  Yoshiyuki Chida ,  Yasushi Matsushita

IPC: B24B049/00 ,  B24B051/00 ,  B24B021/00

CPC classification number: B24B19/12 ,  B24B5/42 ,  B24B21/00 ,  B24B53/007

Abstract: A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film(1), a shoe set handler (40) handles the shoe set (2) to press the film (1) against the work (W), and a deterioration delayer (C) is configured to delay an abrasivity deterioration of the film (1).

Abstract translation: 胶片馈送器（FF1）馈送胶片（1），第一驱动器（20）旋转工件（W），第二驱动器（30）相对于胶片（1）移动工件（W），鞋套处理器 （40）处理鞋套（2）将薄膜（1）压靠在工件（W）上，劣化延迟器（C）被构造成延迟薄膜（1）的磨损性劣化。

公开(公告)号：US20040137823A1

公开(公告)日：2004-07-15

申请号：US10750823

申请日：2004-01-05

Inventor： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

IPC: B24B049/00 ,  B24B051/00 ,  B24B007/00

CPC classification number: B24B37/345 ,  B24B37/042 ,  H01L21/30625

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract translation: 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

公开(公告)号：US20040121705A1

公开(公告)日：2004-06-24

申请号：US10729913

申请日：2003-12-09

Applicant: NSK LTD.

Inventor： Kazumi Matsuzaki ,  Etsuo Kanakubo

IPC: B24B049/00 ,  B24B051/00 ,  B24B005/00

CPC classification number: B24B35/00 ,  B24B19/06

Abstract: The superfinishing apparatus according to the present invention includes a frame 51 for holding the entirety of the apparatus, a cam shaft 52 attached to the frame 51 so as to rotate freely, first and second eccentric cams 53, 54 which are attached to the cam shaft 52 and rotate with a phase difference of 180 degrees therebetween, a first vibrator 55 having a polygonal shape in its section which moves in a sliding manner in accordance with the rotation of the first eccentric cam 53, a second vibrator 57 having a polygonal shape in its section which is disposed so as to oppose to the first vibrator 55 through the cam shaft 52 and moves in a sliding manner in accordance with the rotation of the second eccentric cam 54, air bearings 59, 60 for supporting the first vibrator 55 and the second vibrator 57, and a superfinishing stone 61 attached to the first vibrator 55 or the second vibrator 57.

Abstract translation: 根据本发明的超精加工装置包括用于保持整个装置的框架51，安装到框架51以便自由旋转的凸轮轴52，安装到凸轮轴的第一和第二偏心凸轮53,54 并且在其间以180度的相位差旋转，在其截面中具有多边形形状的第一振动器55，其根据第一偏心凸轮53的旋转以滑动方式移动，具有多边形形状的第二振动器57 其部分设置成通过凸轮轴52与第一振动器55相对，并且根据第二偏心凸轮54的旋转以滑动方式移动，用于支撑第一振动器55的空气轴承59,60和 第二振动器57和连接到第一振动器55或第二振动器57的超精加工石61。

公开(公告)号：US20040110448A1

公开(公告)日：2004-06-10

申请号：US10346720

申请日：2003-01-17

Inventor： Yury Polikov ,  Louis M. Sardella

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B26D7/20 ,  B24B53/04 ,  B24D9/04 ,  B26D2007/202 ,  B31B50/146 ,  B31B50/16

Abstract: A rotary die cutter mechanism for cutting and/or creasing corrugated boards including a rotatable die cylinder with a cutting die, and a rotatable anvil against which the corrugated boards are cut as they pass between the die cylinder and the anvil. A computer is used to determine how much the speed of the anvil should be changed to compensate for changes in the diameter of the anvil so that the boards are cut to the desired dimension. A fine adjustment of the size of the boards to be cut is made by providing information to the computer representative of the specific die being used. The computer then calculates an adjusted speed of the anvil to cut the boards to the desired dimension, and then sends a signal to a motor for changing the speed of the anvil to the adjusted speed calculated by the computer.

Abstract translation: 一种用于切割和/或压缩波纹板的旋转模切机器，包括具有切割模的可旋转模具缸和可旋转的砧座，当瓦楞纸板在模具滚筒和砧座之间通过时可旋转砧座。 计算机用于确定砧座的速度应该改变多少以补偿砧座直径的变化，从而将板切割成所需的尺寸。 通过向代表所使用的具体模具的计算机提供信息来进行要切割的板的尺寸的微调。 计算机然后计算砧座的调整速度以将板切割成所需尺寸，然后将信号发送到电动机，以将砧座的速度改变为由计算机计算的调整速度。

公开(公告)号：US20040082272A1

公开(公告)日：2004-04-29

申请号：US10686590

申请日：2003-10-17

Applicant: NISSAN MOTOR CO., LTD.

Inventor： Tatsuomi Nakayama ,  Minoru Ota ,  Minoru Numakura ,  Mamoru Saito ,  Hidenori Watanabe

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B19/02 ,  B23B5/40 ,  F16H15/38

Abstract: A method of forming a traction drive rolling element including: forming a preform having a working surface with an arcuate profile in section taken along a central axis; supporting the preform to be rotatable about the central axis; allowing a relative movement between the preform and a grooving tool for moving the grooving tool along the arcuate profile, simultaneously with rotating the preform about the central axis, to form microscopic recesses and projections alternately arranged in a direction perpendicular to the central axis along the arcuate profile; pressing a grindstone having a contact surface area of 25 mm2 or less, on the working surface; and allowing a relative movement between the preform and the grindstone for moving the grindstone along the arcuate profile simultaneously with rotating the preform while keeping pressing the grindstone on the working surface until a height of the microscopic projections becomes 3 nullm or less.

Abstract translation: 一种形成牵引驱动滚动元件的方法，包括：沿着中心轴线形成具有弓形轮廓的工作表面的预成型件; 支撑预成型件可围绕中心轴线旋转; 允许预成型件和用于沿着弧形轮廓移动切槽工具的切槽工具之间的相对运动，同时围绕中心轴线旋转预成型件，以形成沿着与弓形管的垂直于中心轴线的方向交替布置的微观凹槽和突起 简介 在工作面上挤压接触面积为25mm 2以下的磨石; 并且允许预成型件和砂轮之间的相对运动，用于沿着弓形轮廓同时移动砂轮，同时旋转预制件，同时保持将磨石压在工作表面上，直到微突起的高度为3μm或更小。

公开(公告)号：US20040082270A1

公开(公告)日：2004-04-29

申请号：US10280623

申请日：2002-10-25

Inventor： John Blick

IPC: B24B049/00 ,  B24B051/00 ,  B24B047/00

CPC classification number: B24B41/068

Abstract: A plurality of spaced apart supports are designed to closely support a work piece immediately adjacent the edge being worked, ground or polished. Adjacent shear forced are also eliminated by the use of a polymeric interconnections used to both generally contribute to the spacing and to transmit the vacuum in a distributed manner among the individual support units. The top and bottom surfaces of the supports are dressably machineable in place on the working table to insure that all are brought to exactly the same height to insure even support, and utilize a hardened rubber, or any other suitable machinable material which will not enable the work piece to displace significantly downwardly upon the application of vacuum. The tops and bottoms, as a group, are selectively operable. The ability to periodically dress both ends of the interconnected supports gives the user the power to continually insure that each interconnected support set is within a more exacting vertical tolerance. Further, the machineable ends can be removed and replaced.

Abstract translation: 多个间隔开的支撑件被设计成紧密地支撑紧邻正被加工，研磨或抛光的边缘的工件。 相邻的剪切强制也通过使用聚合物互连来消除，所述聚合物互连通常有助于间隔并且以分布的方式在各个支撑单元之间传递真空。 支撑件的顶部和底部表面可以适当地可加工到工作台上的位置，以确保所有的壳体都达到完全相同的高度以确保均匀的支撑，并且使用硬化橡胶或任何其他合适的可加工材料，这些材料将不能使 工件在施加真空时显着向下移位。 顶部和底部，作为一组，可选择性地可操作。 周期性地连接互连支撑的两端的能力使得用户能够不断地确保每个相互联系的支撑组在更加严格的垂直公差之内。 此外，可移除和更换可机加工端。

公开(公告)号：US20040048550A1

公开(公告)日：2004-03-11

申请号：US10327712

申请日：2002-12-19

Applicant: Strasbaugh

Inventor： David G. Halley

IPC: B24B051/00

CPC classification number: H01L21/67167 ,  B24B9/065 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30 ,  B24B37/345 ,  B24B49/02 ,  B24B49/12 ,  B24B53/017 ,  B24B57/02 ,  H01L21/67173 ,  H01L21/67219

Abstract: Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.

Abstract translation: 本发明的具体实施方案涉及操作模块化化学机械平面化方法的方法。 该方法包括操作CMP装置，其包括具有至少一个CMP模块的对接站和至少一个清洁模块，以在其中处理一个或多个基板。 多个模块可以由与模块分开关联的各个控制器分别控制。 其中一个模块从对接站脱离，并被机械地移除以将模块从对接站中释放出来，而其它模块仍可操作以处理其中的一个或多个基板。