公开(公告)号：US09318411B2

公开(公告)日：2016-04-19

申请号：US14514360

申请日：2014-10-14

申请人： BRIDGE SEMICONDUCTOR CORPORATION

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L23/34 ,  H01L23/36 ,  H01L23/00 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/552 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498

CPC分类号： H01L25/105 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2225/1094 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/15793 ,  H01L2924/16153 ,  H01L2924/16172 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/1676 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.

摘要翻译： 本发明涉及制造具有封装封装堆叠能力的半导体封装的方法。 根据优选实施例，该方法的特征在于将芯片插入器子组件附接到金属载体上，其中芯片插入金属载体的空腔中，并且选择性地去除金属载体的部分的步骤 为芯片定义散热器。 散热器可以提供散热，电磁屏蔽和防潮，而插入器为芯片提供了CTE匹配的接口和扇出路由。