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公开(公告)号：US12074133B1
公开(公告)日：2024-08-27
申请号：US18597172
申请日：2024-03-06
发明人： Guoqiang Li , Xinyan Yi
CPC分类号： H01L24/74 , H01L23/32 , H01L2224/74 , H01L2224/7565 , H01L2224/7665 , H01L2224/7765 , H01L2224/7865 , H01L2224/7965 , H01L2224/951 , H01L2224/9511 , H01L2924/40
摘要： A chip bonding apparatus and a securing assembly therefor are disclosed. The securing assembly includes a securing bracket, a sliding bracket, and a slide. A first open slot is arranged in the securing bracket, wherein the sliding bracket is slidably mounted on the first open slot, a snap-fitting portion is arranged on a side portion of the sliding bracket, and at least one catch slot that is engageable with the snap-fitting portion to secure the sliding bracket is arranged in the securing bracket. A second open slot is arranged in the sliding bracket, wherein a slideway is arranged in each of two side walls of the second open slot, and the slide is inserted into the slideway and hence mounted in the second open slot.
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公开(公告)号：US12112928B1
公开(公告)日：2024-10-08
申请号：US18435545
申请日：2024-02-07
发明人： Guoqiang Li , Xinyan Yi
IPC分类号： H01J37/32 , C23C16/02 , C23C16/458 , C23C16/50 , H01L21/67 , H01L21/677
CPC分类号： H01J37/32715 , C23C16/0227 , C23C16/4583 , C23C16/50 , H01J37/32743 , H01J37/32899 , H01L21/67028 , H01L21/67034 , H01L21/6704 , H01L21/67196 , H01L21/67706 , H01J2237/2007 , H01J2237/20214 , H01J2237/3321
摘要： A PECVD apparatus includes a transfer chamber, a load lock, a cleaning chamber, a spin-drying chamber, a deposition chamber, and an unload lock; wherein the load lock, the cleaning chamber, the spin-drying chamber, the deposition chamber, and the unload lock are successively spirally arranged on a side wall of the transfer chamber; and a spiral conveyor device is arranged in the transfer chamber, wherein the spiral conveyor device includes a conveyor rod, a spiral drive mechanism, and a plurality of conveyor assemblies; wherein the conveyor rod is vertically arranged in the transfer chamber, and the plurality of conveyor assemblies are spirally arranged on the conveyor rod, and wherein the spiral drive mechanism is configured to drive the conveyor rod to undergo a spiral ascending or descending movement.
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公开(公告)号：US11996379B1
公开(公告)日：2024-05-28
申请号：US18472244
申请日：2023-09-22
发明人： Guoqiang Li
CPC分类号： H01L24/13 , H01L23/3121 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2224/13078 , H01L2224/16227 , H01L2224/81815 , H01L2224/97
摘要： A filter package structure includes: a die substrate, a substrate, a solder resist layer, a package layer, and a conductive structure disposed; wherein the solder resist layer is disposed on the substrate, and a plurality of channels are formed in the solder resist layer, each of the channels being provided with a solder; the conductive structure includes a seal wall and a support electrode, the seal wall and one terminal of the support electrode being connected to the substrate via the solder; and the die substrate is provided with a filter, wherein the seal wall is disposed around a periphery of the filter, the die substrate, the substrate and the seal wall enclose to define an enclosed chamber, the support electrode is disposed in the enclosed chamber, and the package layer is disposed on a periphery, far away from the enclosed chamber, of the die substrate.
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