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公开(公告)号：US20200082984A1
公开(公告)日：2020-03-12
申请号：US16197734
申请日：2018-11-21
发明人： Byung Gyun KIM , Ji Hong JO , Jong Ho LEE , Myung Jun PARK
摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on an exterior of the body. The external electrode includes an electrode layer connected to the internal electrode and a plating portion including a nickel (Ni) plating layer, a nickel-tin (Ni—Sn) intermetallic compound layer, and a tin (Sn) plating layer, sequentially disposed on the electrode layer. The Ni-Sn intermetallic compound layer has a thickness of 0.1 μm or more.
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公开(公告)号：US20190244885A1
公开(公告)日：2019-08-08
申请号：US16105289
申请日：2018-08-20
发明人： Eun Jin KIM , Han KIM
IPC分类号： H01L23/498 , H01L23/31 , H01L23/043
摘要： A semiconductor package includes a connection member having a first surface and a second surface disposed to oppose each other and including an insulating member having a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively; a semiconductor chip disposed on the first surface of the connection member and having connection pads electrically connected to the plurality of redistribution layers; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein at least one of the plurality of redistribution layers includes a dummy electrode pattern in which a plurality of holes are arranged, and each of the plurality of holes has a shape including a plurality of protruding regions that protrude externally from different positions.
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公开(公告)号：US20240212934A1
公开(公告)日：2024-06-27
申请号：US18387659
申请日：2023-11-07
发明人： Sung Yong Kang
IPC分类号： H01G4/12 , C04B35/468 , H01G4/248 , H01G4/30
CPC分类号： H01G4/1227 , C04B35/4682 , H01G4/248 , H01G4/30 , C04B2235/3236 , C04B2235/3293 , C04B2235/781 , C04B2235/786 , C04B2235/87
摘要： A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.
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公开(公告)号：US20200118763A1
公开(公告)日：2020-04-16
申请号：US16201607
申请日：2018-11-27
发明人： Ki Young KIM , Beom Joon CHO , Sang Soo PARK , Woo Chul SHIN
摘要： A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies.
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公开(公告)号：US20190074137A1
公开(公告)日：2019-03-07
申请号：US16004830
申请日：2018-06-11
发明人： Jong Pil LEE , Hyo Youn LEE , Sung Kwon AN , Seung Woo SONG , Taek Jung LEE , Jin Kyung JOO
摘要： A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to amounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
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公开(公告)号：US20240365467A1
公开(公告)日：2024-10-31
申请号：US18407677
申请日：2024-01-09
发明人： Tae Hong MIN , Jong Eun PARK
CPC分类号： H05K1/0306 , H05K1/0298 , H05K1/036 , H05K1/115 , H05K3/46 , H05K2201/096 , H05K2201/09827
摘要： The present disclosure relates to a printed circuit board include: a core layer including an inorganic insulating layer, a resin layer covering at least a portion of an external side surface of the inorganic insulating layer, and a second insulating layer covering at least a portion of a lower surface of each of the inorganic insulating layer and the resin layer and having an interlayer boundary with the resin layer; a first wiring layer disposed on an upper surface of the core layer; and a second wiring layer disposed on a lower surface of the core layer. The external side surface of the inorganic insulating layer is substantially perpendicular to at least one of the upper surface and the lower surface of the inorganic insulating, and a manufacturing method therefor.
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公开(公告)号：US20240364299A1
公开(公告)日：2024-10-31
申请号：US18608106
申请日：2024-03-18
发明人： Jong Woon KIM , Jeonga KIM , Jeong Hoon RYOU , Won HAN , Sang Uk SON , Tae Kyung LEE
CPC分类号： H03H9/02157 , H03H9/02023 , H03H9/132
摘要： A bulk acoustic resonator includes an active region in which a first electrode disposed on a substrate, a piezoelectric layer disposed on the first electrode in a height direction, and a second electrode disposed on the piezoelectric layer in the height direction overlap each other in the height direction; a peripheral region in which the first electrode or the second electrode extends outwardly from the active region so that the first electrode and the second electrode do not overlap each other in the height direction in the peripheral region; and an auxiliary layer disposed in the peripheral region, wherein a first cutoff frequency of the active region is substantially equal to a second cutoff frequency of the peripheral region.
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公开(公告)号：US20240363286A1
公开(公告)日：2024-10-31
申请号：US18671314
申请日：2024-05-22
发明人： Kyung Ryul Lee , Jong Suk Jeong , Chang Hak Choi
CPC分类号： H01G4/0085 , H01G4/1227 , H01G4/30
摘要： A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax)(Ti1-y (Zr, Hf)y)O3 (where, 0≤x≤1, 0≤y≤0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.
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公开(公告)号：US20240363281A1
公开(公告)日：2024-10-31
申请号：US18404270
申请日：2024-01-04
发明人： Byeongcheol Moon , Sangjin Kim , Han Lee , Boumseock Kim
CPC分类号： H01F27/2828 , H01F27/2804 , H01F27/29
摘要： A coil component according to an embodiment includes a body; a first coil embedded in the body and disposed to surround around a first core axis extending in a first direction, a second coil embedded in the body and disposed to surround around a second core axis parallel to the first core axis, and arranged in a second direction perpendicular to the first direction on the outside of the first coil; and a non-magnetic body disposed to surround the outer region of the first coil and the second coil.
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公开(公告)号：US20240361579A1
公开(公告)日：2024-10-31
申请号：US18770075
申请日：2024-07-11
发明人： Min Hyuk IM , Ju Hwa SON
摘要： An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed from an object side. The system satisfies TTL/f
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