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公开(公告)号：US11504825B2
公开(公告)日：2022-11-22
申请号：US17466413
申请日：2021-09-03
发明人： Thomas Grund , Rainer Targus
IPC分类号： B25B11/00 , H01L21/683
摘要： A holding apparatus, in particular a chuck, for a substrate comprises a main body with a upper side, a carrier element arranged in a recess of the main body so as to be vertically movable such that it can be adjusted between a protruding loading position and a retracted clamping position, the carrier element comprising a support surface for placement of the substrate. The support surface has a smaller diameter than the main body. A lifting element lifts the carrier element to the loading position. The carrier element seals the recess such that a sealed cavity is provided between the main body and the carrier element, which cavity can have a negative pressure applied thereto which counteracts the effect of the lifting element.
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公开(公告)号：US20220037168A1
公开(公告)日：2022-02-03
申请号：US17388958
申请日：2021-07-29
摘要： An adapter for a liquid container of a supply system of a wet process module for the treatment of substrates has a container part for fastening to the liquid container and a channel part for fastening to the supply system. The container part has a central opening and a fastening device for fastening the container part to the liquid container. The channel part has a continuous first channel portion and a continuous second channel portion, the first and the second channel portion each opening into the central opening of the container part.
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公开(公告)号：US11075102B2
公开(公告)日：2021-07-27
申请号：US15806950
申请日：2017-11-08
发明人： Sven Hansen , Georg Fink , Henrik Petry
IPC分类号： H01L21/68 , H01L21/687 , H01L21/683 , H01L21/67 , H01L23/00
摘要： The invention relates to a positioning device for positioning a substrate, in particular a wafer, comprising: a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.
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公开(公告)号：US20210013079A1
公开(公告)日：2021-01-14
申请号：US17029635
申请日：2020-09-23
发明人： Hale Johnson , Gregory George
IPC分类号： H01L21/677 , H01L21/683 , H01L21/687 , H01L23/00 , H01L21/67
摘要： An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
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公开(公告)号：US10825701B2
公开(公告)日：2020-11-03
申请号：US14948877
申请日：2015-11-23
发明人： Gregory George , Aaron Foley , Oliver Treichel
摘要： A baking device for a wafer coated with a coating containing a solvent is described, having a baking chamber, a support for the wafer, an inlet for a purge gas, and an evacuation for the purge gas charged with solvent evaporated from the coating. The inlet is formed as a diffusion element arranged above the wafer so as to admit the purge gas evenly over substantially the entire surface of the wafer, and the evacuation is formed as an evacuation ring which radially surrounds the diffusion element and is arranged at a ceiling of the baking chamber.
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公开(公告)号：US10295063B2
公开(公告)日：2019-05-21
申请号：US15064716
申请日：2016-03-09
发明人： Dieter Albert , Michael Braun
IPC分类号： H01L21/67 , H01L21/687 , F16J15/3252 , F16J15/3268 , F16J15/3228 , F16J15/3276
摘要： A sealing ring for attaching to a cover ring of a wafer treating device has an annular carrier and a sealing lip which is releasably attached to the carrier.
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公开(公告)号：US09960061B2
公开(公告)日：2018-05-01
申请号：US15096494
申请日：2016-04-12
发明人： Omar Fakhr , Dietrich Toennies
CPC分类号： H01L21/6715 , F27B17/0025 , G03F7/004 , G03F7/38 , G03F7/40 , H01L21/67098 , H01L21/67103 , H01L21/67109 , H01L21/67115 , H05K3/1283
摘要： A method for curing at least in part a photoresist applied to a substrate comprises the following steps: The substrate coated with the photoresist is arranged on a support. The photoresist is subjected to a suitable temperature for curing the photoresist for a first predetermined time period. After the first predetermined time period has passed, the substrate is lifted from the support, rotated, re-placed onto the support and subjected to a suitable temperature for curing the photoresist for a second predetermined time period. This method can be performed with a device for curing at least in part a photoresist applied to a substrate, comprising a chamber, a support which is arranged in the chamber and on which the substrate can be arranged, and a rotating device for rotating the substrate between a first and a second phase of the curing of the photoresist.
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公开(公告)号：US09958795B2
公开(公告)日：2018-05-01
申请号：US15182945
申请日：2016-06-15
发明人： Matthias Conradi , Janusz Schulz
CPC分类号： G03F9/7003 , G03F7/70775 , H01L21/67069 , H01L21/682
摘要： A spacer displacement device for a wafer illumination unit comprises an actuator, a spacer which can be displaced between an active and an inactive position by the actuator, and a force transmission element which is coupled to the actuator. The force transmission element consists of wire.
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公开(公告)号：US09583374B2
公开(公告)日：2017-02-28
申请号：US15188189
申请日：2016-06-21
IPC分类号： B32B38/10 , H01L21/683 , H01L21/67 , B32B43/00 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/10 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/00 , H01L21/67092 , H01L21/67132 , H01L21/67282 , H01L21/6838 , H01L21/68707 , H01L21/68728 , H01L2221/683 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , Y10T156/11 , Y10T156/1142 , Y10T156/1168 , Y10T156/1179 , Y10T156/1184 , Y10T156/19 , Y10T156/1911 , Y10T156/1961 , Y10T156/1967 , Y10T156/1978
摘要： Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.
摘要翻译： 所描述的方法和装置为装置晶片和载体晶片之间的粘合剂接合提供受控的扰动。 受控的扰动可以是机械的，化学的，热的或辐射的，有助于两个晶片的分离，而不损坏器件晶片。 控制的扰动在粘合剂层（例如在剥离层和粘合剂之间）的界面处，或在晶片/粘合剂界面处在连接两个晶片的粘合剂内部引发裂纹。 然后可以使用用于引发裂纹的任何前述方法或其组合来传播裂纹。
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公开(公告)号：US08647797B2
公开(公告)日：2014-02-11
申请号：US13261175
申请日：2010-08-06
申请人： Takaaki Ishii , Tomas Hülsmann , Tobias Hickmann
发明人： Takaaki Ishii , Tomas Hülsmann , Tobias Hickmann
IPC分类号： G03F9/00
CPC分类号： G03F7/70875 , G03F7/7035 , G03F7/70783
摘要： The present application describes a method and a device for keeping the mask dimensions of a mask (6) constant in the mask plane in lithography. The mask (6) is heated due to the exposure during lithography. By means of thermal and/or mechanical methods, the dimensions of the mask (6) are kept constant. It is possible to use additional methods or devices, e.g. an air cooler (17) or an air heater (17), in order to prevent a change in the mask dimensions in the mask plane.
摘要翻译： 本申请描述了一种用于在光刻中保持掩模（6）的掩模尺寸在掩模平面中恒定的方法和装置。 掩模（6）由于在光刻期间的曝光而被加热。 通过热和/或机械方法，掩模（6）的尺寸保持恒定。 可以使用附加的方法或装置，例如 空气冷却器（17）或空气加热器（17），以防止掩模平面中的掩模尺寸的变化。
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