公开(公告)号：US5840402A

公开(公告)日：1998-11-24

申请号：US265649

申请日：1994-06-24

申请人： Sidney J. Roberts ,  Eugene T. Selbitschka ,  Glenn W. Gengel ,  Brent N. Sweitzer

发明人： Sidney J. Roberts ,  Eugene T. Selbitschka ,  Glenn W. Gengel ,  Brent N. Sweitzer

IPC分类号： B32B15/08 ,  H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  B32B3/00

CPC分类号： H05K3/426 ,  H05K1/0287 ,  H05K1/0393 ,  H05K3/0017 ,  H05K3/022 ,  H05K3/064 ,  H05K3/388 ,  H05K3/4076 ,  Y10S428/901 ,  Y10T29/49167 ,  Y10T428/24273 ,  Y10T428/24347 ,  Y10T428/264 ,  Y10T428/31681 ,  Y10T428/31688

摘要： A metallized laminate material for the manufacture of high performance, high density printed wiring boards and the like includes an ordered distribution of via holes electrically interconnecting opposing conductive layers on a dielectric polymeric film substrate. Furthermore, opposing photoresist layers substantially cover the conductive layers and vias. The conductive material in the conductive layers and the vias is bonded adhesivelessly to the substrate to provide a high degree of delamination resistance. The production of metallized laminate material is preferably carried out in a roll-to-roll process suitable for high volume, low cost production. In use, an end user may manufacture customized printed wiring boards in small volume runs from the laminate material with a reduced amount of equipment, expertise and cost.

摘要翻译： 用于制造高性能，高密度印刷线路板等的金属化层压材料包括将电介质聚合物膜基底上相对的导电层电连接的通孔的有序分布。 此外，相对的光致抗蚀剂层基本上覆盖导电层和通孔。 导电层和通孔中的导电材料无粘合地粘合到基底上以提供高度的耐分层性。 金属化层压材料的生产优选以适于大批量，低成本生产的卷对卷方法进行。 在使用中，最终用户可以以较少量的设备，专业知识和成本从层压材料制造具有小体积运行的定制印刷线路板。

公开(公告)号：US5615477A

公开(公告)日：1997-04-01

申请号：US644585

申请日：1996-05-10

申请人： Brent N. Sweitzer

发明人： Brent N. Sweitzer

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46

CPC分类号： H01L24/81 ,  H01L23/49827 ,  H01L23/4985 ,  H05K1/112 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3484 ,  H05K3/4614 ,  H05K3/4623 ,  Y10T29/49144

摘要： A printed circuit assembly and a method of manufacturing therefor are provided for directly connecting unpackaged integrated circuit chips such as flip chips to a footprint of active contact pads on a printed circuit substrate. A reduction in packaging density is obtained by electrically interconnecting one or more of the active contact pads with circuit traces formed on different layers of the printed circuit substrate. In a preferred embodiment, at least one of the active contact pads includes an electrically conductive through hole electrically connecting the contact pad and a circuit trace located on the back side of a double-sided printed circuit substrate. In another embodiment, the printed circuit substrate is a multilayer construction, which enables active contact pads to be electrically interconnected with circuit traces on a plurality of circuit layers.

摘要翻译： 提供一种印刷电路组件及其制造方法，用于将未封装的集成电路芯片（例如倒装芯片）直接连接到印刷电路基板上的有源接触焊盘的占位面积。 通过将一个或多个有源接触焊盘与形成在印刷电路基板的不同层上的电路迹线电连接来获得封装密度的降低。 在优选实施例中，至少一个有源接触焊盘包括电连接接触焊盘和位于双面印刷电路基板的背侧的电路迹线的导电通孔。 在另一个实施例中，印刷电路基板是多层结构，其使得有源接触垫能够与多个电路层上的电路迹线电互连。