公开(公告)号：US20130157066A1

公开(公告)日：2013-06-20

申请号：US13325318

申请日：2011-12-14

Applicant: Liao-Ping CHENG ,  Ching-Chung Chen ,  Feng-Hsi Huang ,  Hsu-Hsien Chang

Inventor： Liao-Ping CHENG ,  Ching-Chung Chen ,  Feng-Hsi Huang ,  Hsu-Hsien Chang

IPC: B32B9/04 ,  B05D3/06 ,  B32B9/00 ,  B05D5/06

CPC classification number: G02B1/14 ,  C08J7/045 ,  G02B1/105 ,  G02B1/18 ,  G02B27/0006

Abstract: The present invention relates to a method for manufacturing a hard, water-resistant anti-fog coating, and particularly relates to a method for manufacturing a hard, water-resistant anti-fog coating on plastic material. In this method, an organic-inorganic hard adhesion layer and a hydrophilic anti-fog coating film are prepared for manufacturing a hard, water-resistant anti-fog coating. Both of the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating have C=C double bonds. Therefore, the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating are adhered to each other tightly. It brings high hardness, high water resistance and good anti-fog effect.

Abstract translation: 本发明涉及一种制造硬质防水防雾涂料的方法，特别涉及一种在塑料材料上制造硬质防水防雾涂料的方法。 在该方法中，制备有机 - 无机硬粘合层和亲水性防雾涂膜，用于制造硬质防水防雾涂料。 有机 - 无机硬粘合层和亲水性防雾涂层都具有C = C双键。 因此，有机 - 无机硬粘合层和亲水性防雾涂层紧密地粘合。 它具有高硬度，高耐水性和良好的防雾效果。

公开(公告)号：US20070001181A1

公开(公告)日：2007-01-04

申请号：US11161363

申请日：2005-08-01

Applicant: Ching-Chung Chen

Inventor： Ching-Chung Chen

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/44 ,  H01L33/641 ,  H01L2933/0091

Abstract: A light emitting diode comprising a semiconductor layer, a first electrode, a second electrode and a diamond-like carbon layer is provided. The semiconductor layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. Wherein, the light emitting layer locates between the first type doped semiconductor layer and the second type doped semiconductor layer. The first electrode is electrically connected to the first type doped semiconductor layer. The second electrode is electrically connected to the second type doped semiconductor layer. The diamond-like carbon layer covers on the semiconductor layer and exposes at least a portion of the first electrode. Moreover, the exposed outer surface of the diamond-like carbon layer is a rough surface. Alternatively, other passivation layer with rough surface can be substituted for the diamond-like carbon layer.

Abstract translation: 提供了包括半导体层，第一电极，第二电极和类金刚石碳层的发光二极管。 半导体层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 其中，发光层位于第一掺杂半导体层和第二掺杂半导体层之间。 第一电极电连接到第一类型的掺杂半导体层。 第二电极电连接到第二类型掺杂半导体层。 类金刚石碳层覆盖在半导体层上并暴露第一电极的至少一部分。 此外，金刚石状碳层的露出的外表面是粗糙的表面。 或者，具有粗糙表面的其它钝化层可以代替类金刚石碳层。

公开(公告)号：US20060278884A1

公开(公告)日：2006-12-14

申请号：US11148606

申请日：2005-06-08

Applicant: Ching-Chung Chen

Inventor： Ching-Chung Chen

IPC: H01L29/22

CPC classification number: H01L33/0079 ,  H01L21/6835 ,  H01L24/27 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2224/06102 ,  H01L2224/274 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/12041

Abstract: A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material.

Abstract translation: 提供了一种无基板的LED器件。 LED器件包括衬底，设置在衬底上的外延层，设置在外延层的一部分上的第一电极，设置在外延层的另一部分上的第二电极以及设置在外延层上的保护层。 注意，在LED器件中，衬底包括例如但不限于高散热衬底，并且保护层包括例如但不限于高散热器，高透明材料。

公开(公告)号：US06566160B2

公开(公告)日：2003-05-20

申请号：US09885044

申请日：2001-06-21

Applicant: Cheng-Pang Yeh ,  Ching-Chung Chen

Inventor： Cheng-Pang Yeh ,  Ching-Chung Chen

IPC: H01L2100

CPC classification number: H01L27/14685 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14643 ,  H01L27/14687

Abstract: The present invention provides a method for increasing adhesion of color filters and preventing cross talk effects on a semiconductor wafer. The method first involves forming a dielectric layer on the semiconductor wafer, which covers each MOS transistor sensor formed on the surface of the semiconductor wafer. Then, a plurality of metal layers are formed on the dielectric layer, each two metal layers positioned approximately above two ends of one MOS transistor sensor. Next, a passivation layer is formed, followed by the formation of a first color filter on the passivation layer. The two ends of the first color filter are aligned approximately above the two metal layers. Thereafter, a second color filter and a third color filter are sequentially formed on the passivation layer, and portions of both the second color filter and the third color filter cover one end of the first color filter. The portions of each color filter covering one other are used to enhance adhesion of the color filters, and simultaneously to function as barriers to prevent cross talk effects.

公开(公告)号：US10936028B2

公开(公告)日：2021-03-02

申请号：US15854828

申请日：2017-12-27

Applicant: Chih-Chin Chien ,  I-Feng Hsu ,  Ching-Chung Chen ,  Tse-Yang Lin ,  Tse-An Chu ,  Ching-Ya Tu ,  Chang-Yuan Wu ,  Hao-Wu Yang ,  Huan-Yang Yeh ,  Chin-Hsien Chang ,  Chin-Yuan Chuang ,  Chia-Hung Lin

Inventor： Chih-Chin Chien ,  I-Feng Hsu ,  Ching-Chung Chen ,  Tse-Yang Lin ,  Tse-An Chu ,  Ching-Ya Tu ,  Chang-Yuan Wu ,  Hao-Wu Yang ,  Huan-Yang Yeh ,  Chin-Hsien Chang ,  Chin-Yuan Chuang ,  Chia-Hung Lin

IPC: G06F1/20 ,  H05K7/20 ,  H05K5/00 ,  F04D27/00 ,  F04D25/08

Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.

公开(公告)号：US08716734B2

公开(公告)日：2014-05-06

申请号：US13336010

申请日：2011-12-23

Applicant: Ming-Ta Tsai ,  Ching-Chung Chen

Inventor： Ming-Ta Tsai ,  Ching-Chung Chen

IPC: H01L33/38 ,  H01L33/48

CPC classification number: H01L33/385 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2933/0033 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup.

Abstract translation: LED封装包括衬底，电极层，发光芯片，反射杯和封装。 基板包括第一表面，相对的第二表面和两个侧表面。 电极层由正电极和负电极构成，每个电极通过相应的侧表面从第一表面延伸到第二表面。 发光芯片位于基板的第一表面上并电连接到电极层。 反射杯包括在基板的侧表面上覆盖电极层的第一部分，在基板的第一表面上具有碗状形状的第二部分并且围绕发光芯片。 封装填充在反射杯的第二部分中。

公开(公告)号：US20100258283A1

公开(公告)日：2010-10-14

申请号：US12757057

申请日：2010-04-09

Applicant: Ching-Chung Chen ,  Ifeng Hsu ,  Chang-Yuan Wu ,  Jenq-Haur Pan

Inventor： Ching-Chung Chen ,  Ifeng Hsu ,  Chang-Yuan Wu ,  Jenq-Haur Pan

IPC: H01L23/467

CPC classification number: H05K7/20145 ,  G06F1/203

Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

Abstract translation: 电子设备包括壳体，模块，主板和风扇。 模块，主板和风扇都安装在外壳中。 主板将壳体的内部分成第一空间和第二空间，并且在主板和模块之间存在通道开口，以将第一空间与第二空间连通。 风扇电连接到主板，具有风扇出口，并且能够将通过风扇出口的气流输出到壳体的外部。

公开(公告)号：USD531343S1

公开(公告)日：2006-10-31

申请号：US29200804

申请日：2004-03-05

Applicant: Ching-Chung Chen

Designer： Ching-Chung Chen

公开(公告)号：US09103977B2

公开(公告)日：2015-08-11

申请号：US13325318

申请日：2011-12-14

Applicant: Liao-Ping Cheng ,  Ching-Chung Chen ,  Feng-Hsi Huang ,  Hsu-Hsien Chang

Inventor： Liao-Ping Cheng ,  Ching-Chung Chen ,  Feng-Hsi Huang ,  Hsu-Hsien Chang

IPC: B32B9/04 ,  B05D3/06 ,  G02B1/14 ,  G02B1/10 ,  G02B27/00 ,  C08J7/04

CPC classification number: G02B1/14 ,  C08J7/045 ,  G02B1/105 ,  G02B1/18 ,  G02B27/0006

Abstract: The present invention relates to a method for manufacturing a hard, water-resistant anti-fog coating, and particularly relates to a method for manufacturing a hard, water-resistant anti-fog coating on plastic material. In this method, an organic-inorganic hard adhesion layer and a hydrophilic anti-fog coating film are prepared for manufacturing a hard, water-resistant anti-fog coating. Both of the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating have C═C double bonds. Therefore, the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating are adhered to each other tightly. It brings high hardness, high water resistance and good anti-fog effect.

Abstract translation: 本发明涉及一种制造硬质防水防雾涂料的方法，特别涉及一种在塑料材料上制造硬质防水防雾涂料的方法。 在该方法中，制备有机 - 无机硬粘合层和亲水性防雾涂膜，用于制造硬质防水防雾涂料。 有机 - 无机硬粘合层和亲水性防雾涂层都具有C = C双键。 因此，有机 - 无机硬粘合层和亲水性防雾涂层紧密地粘合。 它具有高硬度，高耐水性和良好的防雾效果。

公开(公告)号：US08203843B2

公开(公告)日：2012-06-19

申请号：US12540158

申请日：2009-08-12

Applicant: Ching-Chung Chen

Inventor： Ching-Chung Chen

IPC: H05K7/00

CPC classification number: G06F1/1656 ,  F16B5/0664 ,  G06F1/1613 ,  G06F1/1616 ,  Y10T292/1089

Abstract: The invention discloses an electronic device and an engaging structure thereof. The electronic device comprises a first casing and a second casing. The first casing comprises a plate portion and a plurality of hooks. Each hook is located on the plate portion. The second casing comprises a first side portion, a second side portion, an engaging portion, a first rib and a second rib. The engaging portion is between the first and the second side portions and comprises a plurality of recesses. Each recess is engaged with one of the hooks and has a front edge. A gap is between one end of the hook and the front edge of the recess. The first and second ribs are respectively located on the first and the second side portions. The plate portion is disposed on the first and second ribs. The hook can be detached from the recess by the gap.

Abstract translation: 本发明公开了一种电子设备及其接合结构。 电子设备包括第一壳体和第二壳体。 第一壳体包括板部分和多个钩。 每个钩位于板部分上。 第二壳体包括第一侧部，第二侧部，接合部，第一肋和第二肋。 接合部分在第一和第二侧部之间并且包括多个凹部。 每个凹槽与其中一个钩接合并且具有前边缘。 在钩的一端和凹部的前边缘之间存在间隙。 第一和第二肋分别位于第一和第二侧部上。 板部分设置在第一和第二肋上。 钩可以通过间隙与凹槽分离。