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公开(公告)号：US09171818B2
公开(公告)日：2015-10-27
申请号：US13323843
申请日：2011-12-13
申请人： Da-Jung Chen , Wen-Hsiung Liao , Chun-Fu Hu
发明人： Da-Jung Chen , Wen-Hsiung Liao , Chun-Fu Hu
IPC分类号： H05K1/16 , H01L23/00 , H01L23/498 , H01L23/31
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/498 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/0556 , H01L2224/06181 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/16245 , H01L2224/16505 , H01L2224/16507 , H01L2224/2902 , H01L2224/29034 , H01L2224/29111 , H01L2224/29116 , H01L2224/29118 , H01L2224/29139 , H01L2224/30181 , H01L2224/32225 , H01L2224/32505 , H01L2224/32507 , H01L2224/81815 , H01L2224/8192 , H01L2224/83411 , H01L2224/83416 , H01L2224/83418 , H01L2224/83439 , H01L2224/83815 , H01L2224/8392 , H01L2924/00014 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , Y10T29/49155 , H01L2924/00012 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要： The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.
摘要翻译： 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料，第一焊盘，第二焊盘，第一电极和第二电极的暴露区域，其中暴露区域包括具有比第二金属材料低的熔点的金属材料。
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公开(公告)号：US20130146341A1
公开(公告)日：2013-06-13
申请号：US13323843
申请日：2011-12-13
申请人： DA-JUNG CHEN , WEN-HSIUNG LIAO , CHUN-FU HU
发明人： DA-JUNG CHEN , WEN-HSIUNG LIAO , CHUN-FU HU
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/498 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/0556 , H01L2224/06181 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/16245 , H01L2224/16505 , H01L2224/16507 , H01L2224/2902 , H01L2224/29034 , H01L2224/29111 , H01L2224/29116 , H01L2224/29118 , H01L2224/29139 , H01L2224/30181 , H01L2224/32225 , H01L2224/32505 , H01L2224/32507 , H01L2224/81815 , H01L2224/8192 , H01L2224/83411 , H01L2224/83416 , H01L2224/83418 , H01L2224/83439 , H01L2224/83815 , H01L2224/8392 , H01L2924/00014 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , Y10T29/49155 , H01L2924/00012 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要： The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.
摘要翻译： 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料，第一焊盘，第二焊盘，第一电极和第二电极的暴露区域，其中暴露区域包括具有比第二金属材料低的熔点的金属材料。
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