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公开(公告)号:US09171818B2
公开(公告)日:2015-10-27
申请号:US13323843
申请日:2011-12-13
申请人: Da-Jung Chen , Wen-Hsiung Liao , Chun-Fu Hu
发明人: Da-Jung Chen , Wen-Hsiung Liao , Chun-Fu Hu
IPC分类号: H05K1/16 , H01L23/00 , H01L23/498 , H01L23/31
CPC分类号: H01L24/32 , H01L23/3121 , H01L23/498 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/0556 , H01L2224/06181 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/16245 , H01L2224/16505 , H01L2224/16507 , H01L2224/2902 , H01L2224/29034 , H01L2224/29111 , H01L2224/29116 , H01L2224/29118 , H01L2224/29139 , H01L2224/30181 , H01L2224/32225 , H01L2224/32505 , H01L2224/32507 , H01L2224/81815 , H01L2224/8192 , H01L2224/83411 , H01L2224/83416 , H01L2224/83418 , H01L2224/83439 , H01L2224/83815 , H01L2224/8392 , H01L2924/00014 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , Y10T29/49155 , H01L2924/00012 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要: The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.
摘要翻译: 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料,第一焊盘,第二焊盘,第一电极和第二电极的暴露区域,其中暴露区域包括具有比第二金属材料低的熔点的金属材料。
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公开(公告)号:US08922312B2
公开(公告)日:2014-12-30
申请号:US13853083
申请日:2013-03-29
申请人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号: H01F27/02
CPC分类号: H01F3/08 , H01F41/0246 , H01F2017/048
摘要: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.
摘要翻译: 提供包括第一磁粉,第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。 导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。 第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度,第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。 通过第一磁性粉末和第二磁性粉末的硬度差,将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体 点绝缘密封剂。
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公开(公告)号:US08771436B2
公开(公告)日:2014-07-08
申请号:US13561266
申请日:2012-07-30
申请人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
IPC分类号: H01F1/22 , H01F1/153 , H01F27/255
CPC分类号: H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译: 提供了包括磁体和电线的电子设备。 磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。 第一磁粉的维氏硬度大于第二磁粉的硬度,第一磁粉的平均粒径大于第二磁粉的平均粒径。
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公开(公告)号:US20130229251A1
公开(公告)日:2013-09-05
申请号:US13853083
申请日:2013-03-29
申请人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
CPC分类号: H01F3/08 , H01F41/0246 , H01F2017/048
摘要: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.
摘要翻译: 提供包括第一磁粉,第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。 导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。 第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度,第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。 通过第一磁性粉末和第二磁性粉末的硬度差,将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体 点绝缘密封剂。
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公开(公告)号:US20130271251A1
公开(公告)日:2013-10-17
申请号:US13571381
申请日:2012-08-10
CPC分类号: H01F41/042 , H01F17/0013 , H01F2017/0066
摘要: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.
摘要翻译: 本发明公开了一种无基板电子部件。 导电元件设置在多个绝缘层中,其中多个绝缘层不被衬底支撑。 可以在去除衬底之前,在衬底上的多个导电层或绝缘层上执行膜工艺来制造无衬底电子部件。 在一个实施例中,可以在衬底上形成缓冲层。 在该过程完成之后,可以容易地去除缓冲层以使衬底与衬底上的层分离。
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公开(公告)号:US08183976B2
公开(公告)日:2012-05-22
申请号:US12779656
申请日:2010-05-13
申请人: Ta-Wen Lo , Wen-Hsiung Liao , Wu-Liang Chu , Yen-Ting Lin
发明人: Ta-Wen Lo , Wen-Hsiung Liao , Wu-Liang Chu , Yen-Ting Lin
IPC分类号: H01C1/012
CPC分类号: H01C1/148 , H01C7/003 , H01C7/13 , Y10T29/49082
摘要: A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture.
摘要翻译: 电阻器装置包括具有分别设置在其第一侧,第二侧,第三侧和第四侧上的第一孔,第二孔,第三孔和第四孔的电阻板。 第一电极板耦合到电阻器板的第一侧,并且包括设置在第一孔的相对侧的第一测量区和第二测量区; 并且第二电极板耦合到电阻器板的第三侧,并且包括设置在第三孔的相对侧的第三测量区和第四测量区,其中第一测量区和第三测量区设置在相对的两侧 并且第二测量区和第四测量区设置在第四孔的相对侧。
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公开(公告)号:US08018318B2
公开(公告)日:2011-09-13
申请号:US12482948
申请日:2009-06-11
申请人: Chung-Hsiung Wang , Hideo Ikuta , Wu-Liang Chu , Yen-Ting Lin , Chih Sheng Kuo , Wen-Hsiung Liao
发明人: Chung-Hsiung Wang , Hideo Ikuta , Wu-Liang Chu , Yen-Ting Lin , Chih Sheng Kuo , Wen-Hsiung Liao
IPC分类号: H01C7/18
CPC分类号: B32B38/0032 , B32B38/10 , H01C7/003 , H01C7/06 , H01C17/006 , H01C17/02 , H01C17/06533 , Y10T156/1052
摘要: A resistive component suitable for detecting electric current in a circuit and a method of manufacturing the resistive component are provided. The resistive component includes a carrier, a resistive layer, an electrode unit, an upper oxide layer and a protective layer. The resistive layer comprises copper alloy and is disposed on the carrier. The electrode unit is electrically connected to the resistive layer. The upper oxide layer is disposed on a part of a surface of the resistive layer and includes oxides of the resistive layer. The protective layer covers at least a part of the upper oxide layer.
摘要翻译: 提供了适合于检测电路中的电流的电阻元件和制造电阻元件的方法。 电阻元件包括载体,电阻层,电极单元,上氧化物层和保护层。 电阻层包括铜合金,并设置在载体上。 电极单元电连接到电阻层。 上部氧化物层设置在电阻层的表面的一部分上并且包括电阻层的氧化物。 保护层覆盖上部氧化物层的至少一部分。
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公开(公告)号:US20100102917A1
公开(公告)日:2010-04-29
申请号:US12683448
申请日:2010-01-07
申请人: Chun-Tiao Liu , Gwo-Tswin Wu , Roger Hsieh , Wen-Hsiung Liao
发明人: Chun-Tiao Liu , Gwo-Tswin Wu , Roger Hsieh , Wen-Hsiung Liao
IPC分类号: H01F17/04
CPC分类号: H01F17/04 , H01F27/027 , H01F27/255 , H01F27/2828 , H01F27/292 , H01F2017/046 , H01F2017/048
摘要: An inductor includes a first core, a second core, a protruding structure, at least two gaps and a conducting wire. The first core has a protruding portion. The second core is disposed opposite to the first core. The protruding structure protrudes from the protruding portion of the first core and toward the second core. The at least two gaps are between the protruding portion of the first core and the second core. The conducting wire winds around at least one of the first and second cores. The conducting wire has a specific resistance value of 1.42 μΩm or lower.
摘要翻译: 电感器包括第一芯,第二芯,突出结构,至少两个间隙和导线。 第一芯具有突出部分。 第二芯与第一芯相对设置。 突出结构从第一芯的突出部分朝向第二芯突出。 所述至少两个间隙位于所述第一芯和所述第二芯的突出部分之间。 导线缠绕在第一和第二芯中的至少一个上。 导线的电阻值为1.42μ&OHgr,m以下。
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公开(公告)号:US20120263978A1
公开(公告)日:2012-10-18
申请号:US13445856
申请日:2012-04-12
CPC分类号: H01M10/4257 , H01G2/06 , H01G11/74 , H01G11/82 , H01M2/0202 , H01M2/08 , Y02E60/13 , Y10T29/43 , Y10T29/4911
摘要: An energy storage device and a method of manufacturing the same are disclosed. The energy storage device includes a circuit board, a conductive cover disposed above the circuit board, a sealing structure, a metal coating layer, and an electrochemical cell. The sealing structure is disposed between the circuit board and the circumference of the conductive cover such that the circuit board, the conductive cover, and the sealing structure together form a sealed space where the electrochemical cell is disposed. The metal coating layer continuously covers a part of the conductive cover, an exposed portion of the sealing structure, and a part of the circuit board. Therefore, even if the energy storage device needs to be heated during a product assembly, the metal coating layer can keep the sealing structure structurally stable, and the electrolyte of the electrochemical cell will not leak; the whole energy storage device therefore can keeps undamaged.
摘要翻译: 公开了一种储能装置及其制造方法。 能量存储装置包括电路板,布置在电路板上方的导电盖,密封结构,金属涂层和电化学电池。 密封结构设置在电路板和导电盖的圆周之间,使得电路板,导电盖和密封结构一起形成电化学电池设置的密封空间。 金属涂层连续地覆盖导电盖的一部分,密封结构的暴露部分和电路板的一部分。 因此,即使在产品组装时需要对能量储存装置进行加热,金属涂层也可以使结构稳定地保持密封结构,电解池的电解液不会泄漏; 因此,整个储能装置可以保持不损坏。
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公开(公告)号:US08518190B2
公开(公告)日:2013-08-27
申请号:US12703495
申请日:2010-02-10
申请人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
发明人: Wen-Hsiung Liao , Roger Hsieh , Hideo Ikuta , Yueh-Lang Chen
CPC分类号: H01F27/255 , B22F3/12 , B22F3/16 , B22F5/00 , B22F7/08 , H01F1/22 , H01F17/04 , H01F27/24 , H01F27/2823 , H01F27/292 , H01F27/32 , H01F41/0246 , H01F2017/048 , H05K1/18
摘要: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.
摘要翻译: 提供了包括磁体和电线的电子设备。 磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。 第一磁粉的维氏硬度大于第二磁粉的硬度,第一磁粉的平均粒径大于第二磁粉的平均粒径。
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