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    Colloidal dispersions of inorganic particles in liquid phases comprising ampholytic copolymers
    1.
    发明授权
    Colloidal dispersions of inorganic particles in liquid phases comprising ampholytic copolymers 有权
    包含两性共聚物的液相中的无机颗粒的胶体分散体

    公开(公告)号：US08293829B2

    公开(公告)日：2012-10-23

    申请号：US12742095

    申请日：2008-10-29

    申请人： Guillaume Criniere ,  Claire Pitois ,  Mathias Destarac

    发明人： Guillaume Criniere ,  Claire Pitois ,  Mathias Destarac

    IPC分类号： C08K3/00 ,  C08L33/06

    CPC分类号： B01J13/0047

    摘要： Colloidal dispersions of inorganic particles in a liquid phase include ampholytic copolymers containing at least one macromolecular chain B and a moiety A bonded to a single end thereof and in which the macromolecular chain B includes cationic units Bc, deriving from cationic monomers Bc and the moiety A is a polymeric or non-polymeric group containing at least one anionic or potentially anionic group; such dispersions may have a positive zeta potential within a pH ranging from 1 to 11.

    摘要翻译： 无机颗粒在液相中的胶体分散体包括含有至少一个大分子链B和与其单个末端键合的部分A的两性共聚物，其中大分子链B包含阳离子单元Bc，衍生自阳离子单体Bc和部分A 是含有至少一个阴离子或潜在阴离子基团的聚合物或非聚合基团; 这种分散体可以在1至11的pH范围内具有正的ζ电位。

    ABRASIVE COMPOSITIONS FOR CHEMICAL POLISHING AND METHODS FOR USING SAME
    2.
    发明申请
    ABRASIVE COMPOSITIONS FOR CHEMICAL POLISHING AND METHODS FOR USING SAME 有权
    用于化学抛光的磨料组合物及其使用方法

    公开(公告)号：US20130122705A1

    公开(公告)日：2013-05-16

    申请号：US13733580

    申请日：2013-01-03

    申请人： Suryadevara V. BABU ,  Pradeepa DANDU ,  Vamsi K. DEVARAPALLI ,  Guillaume CRINIERE ,  Claire PITOIS

    发明人： Suryadevara V. BABU ,  Pradeepa DANDU ,  Vamsi K. DEVARAPALLI ,  Guillaume CRINIERE ,  Claire PITOIS

    IPC分类号： H01L21/306

    CPC分类号： H01L21/30625 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

    摘要： A colloidal dispersion for chemical mechanical polishing comprising: (a) an abrasive component; and (b) from about 0.05% to about 10% by weight of the abrasive component, a water-soluble amphoteric polymer comprising at least one macromolecular chain B and a part A bonded to a single end of the at least one macromolecular chain B, wherein the macromolecular chain B is derived from one or more ethylenically unsaturated monomers having quaternary ammonium groups or inium groups, and wherein the part A is a polymeric or nonpolymeric group comprising at least one anionic group; wherein the dispersion has a pH of between about 1.5 and about 6. The colloidal dispersion is capable of polishing a substrate comprising silicon nitride and silicon oxide with a reverse selectivity ratio of at least about 27, typically at least 50 the reverse selectivity ratio being the ratio of the rate of removal of the silicon nitride to the rate of removal of the silicon oxide.

    摘要翻译： 一种用于化学机械抛光的胶体分散体，包括：（a）磨料组分; 和（b）约0.05重量％至约10重量％的所述磨料组分，水溶性两性聚合物，其包含至少一个大分子链B和与所述至少一个大分子链B的单个末端键合的部分A， 其中所述大分子链B衍生自具有季铵基或鎓基的一种或多种烯属不饱和单体，并且其中所述A部分为包含至少一个阴离子基团的聚合物或非聚合物基团; 其中分散体的pH为约1.5至约6.胶体分散体能够以至少约27的反向选择比（通常为至少50）来抛光包含氮化硅和氧化硅的基底，反向选择比为 氮化硅去除速率与氧化硅去除速率之比。

    COLLOIDAL DISPERSIONS OF INORGANIC PARTICLES IN LIQUID PHASES COMPRISING AMPHOLYTIC COPOLYMERS
    6.
    发明申请
    COLLOIDAL DISPERSIONS OF INORGANIC PARTICLES IN LIQUID PHASES COMPRISING AMPHOLYTIC COPOLYMERS 有权
    在包含AMPHOLYTIC共聚物的液相中的无机颗粒的胶体分散体

    公开(公告)号：US20110009552A1

    公开(公告)日：2011-01-13

    申请号：US12742095

    申请日：2008-10-29

    申请人： Guillaume Criniere ,  Claire Pitois ,  Mathias Destarac

    发明人： Guillaume Criniere ,  Claire Pitois ,  Mathias Destarac

    IPC分类号： C08K3/22 ,  C08L33/02 ,  C08L27/04 ,  C08L33/26

    CPC分类号： B01J13/0047

    摘要： Colloidal dispersions of inorganic particles in a liquid phase include ampholytic copolymers containing at least one macromolecular chain B and a moiety A bonded to a single end thereof and in which the macromolecular chain B includes cationic units Bc, deriving from cationic monomers Bc and the moiety A is a polymeric or non-polymeric group containing at least one anionic or potentially anionic group; such dispersions may have a positive zeta potential within a pH ranging from 1 to 11.

    摘要翻译： 无机颗粒在液相中的胶体分散体包括含有至少一个大分子链B和与其单个末端键合的部分A的两性共聚物，其中大分子链B包含阳离子单元Bc，衍生自阳离子单体Bc和部分A 是含有至少一个阴离子或潜在阴离子基团的聚合物或非聚合基团; 这种分散体可以在1至11的pH范围内具有正的ζ电位。

    Abrasive compositions for chemical mechanical polishing and methods for using same
    9.
    发明授权
    Abrasive compositions for chemical mechanical polishing and methods for using same 有权
    用于化学机械抛光的磨料组合物及其使用方法

    公开(公告)号：US08366959B2

    公开(公告)日：2013-02-05

    申请号：US12586651

    申请日：2009-09-25

    申请人： Suryadevara V. Babu ,  Pradeepa Dandu ,  Vamsi K Devarapalli ,  Guillaume Crinière ,  Claire Pitois

    发明人： Suryadevara V. Babu ,  Pradeepa Dandu ,  Vamsi K Devarapalli ,  Guillaume Crinière ,  Claire Pitois

    IPC分类号： C09K13/06

    CPC分类号： H01L21/30625 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  H01L21/31053

    摘要： A colloidal dispersion for chemical mechanical polishing comprising: (a) an abrasive component; and (b) from about 0.05% to about 10% by weight of the abrasive component, a water-soluble amphoteric polymer comprising at least one macromolecular chain B and a part A bonded to a single end of the at least one macromolecular chain B, wherein the macromolecular chain B is derived from one or more ethylenically unsaturated monomers having quaternary ammonium groups or inium groups, and wherein the part A is a polymeric or nonpolymeric group comprising at least one anionic group; wherein the dispersion has a pH of between about 1.5 and about 6. The colloidal dispersion is capable of polishing a substrate comprising silicon nitride and silicon oxide with a reverse selectivity ratio of at least about 27, typically at least 50 the reverse selectivity ratio being the ratio of the rate of removal of the silicon nitride to the rate of removal of the silicon oxide.

    摘要翻译： 一种用于化学机械抛光的胶体分散体，包括：（a）磨料组分; 和（b）约0.05重量％至约10重量％的所述磨料组分，水溶性两性聚合物，其包含至少一个大分子链B和与所述至少一个大分子链B的单个末端键合的部分A， 其中所述大分子链B衍生自具有季铵基或鎓基的一种或多种烯属不饱和单体，并且其中所述A部分为包含至少一个阴离子基团的聚合物或非聚合物基团; 其中分散体的pH为约1.5至约6.胶体分散体能够以至少约27的反向选择比（通常为至少50）来抛光包含氮化硅和氧化硅的衬底，反向选择比为 氮化硅去除速率与氧化硅去除速率之比。