Colloidal dispersions of inorganic particles in liquid phases comprising ampholytic copolymers
    1.
    发明授权
    Colloidal dispersions of inorganic particles in liquid phases comprising ampholytic copolymers 有权
    包含两性共聚物的液相中的无机颗粒的胶体分散体

    公开(公告)号:US08293829B2

    公开(公告)日:2012-10-23

    申请号:US12742095

    申请日:2008-10-29

    IPC分类号: C08K3/00 C08L33/06

    CPC分类号: B01J13/0047

    摘要: Colloidal dispersions of inorganic particles in a liquid phase include ampholytic copolymers containing at least one macromolecular chain B and a moiety A bonded to a single end thereof and in which the macromolecular chain B includes cationic units Bc, deriving from cationic monomers Bc and the moiety A is a polymeric or non-polymeric group containing at least one anionic or potentially anionic group; such dispersions may have a positive zeta potential within a pH ranging from 1 to 11.

    摘要翻译: 无机颗粒在液相中的胶体分散体包括含有至少一个大分子链B和与其单个末端键合的部分A的两性共聚物,其中大分子链B包含阳离子单元Bc,衍生自阳离子单体Bc和部分A 是含有至少一个阴离子或潜在阴离子基团的聚合物或非聚合基团; 这种分散体可以在1至11的pH范围内具有正的ζ电位。

    Abrasive compositions for chemical mechanical polishing and methods for using same
    5.
    发明申请
    Abrasive compositions for chemical mechanical polishing and methods for using same 有权
    用于化学机械抛光的磨料组合物及其使用方法

    公开(公告)号:US20100081281A1

    公开(公告)日:2010-04-01

    申请号:US12586651

    申请日:2009-09-25

    IPC分类号: H01L21/304 C09K13/00

    摘要: A colloidal dispersion for chemical mechanical polishing comprising: (a) an abrasive component; and (b) from about 0.05% to about 10% by weight of the abrasive component, a water-soluble amphoteric polymer comprising at least one macromolecular chain B and a part A bonded to a single end of the at least one macromolecular chain B, wherein the macromolecular chain B is derived from one or more ethylenically unsaturated monomers having quaternary ammonium groups or inium groups, and wherein the part A is a polymeric or nonpolymeric group comprising at least one anionic group; wherein the dispersion has a pH of between about 1.5 and about 6. The colloidal dispersion is capable of polishing a substrate comprising silicon nitride and silicon oxide with a reverse selectivity ratio of at least about 27, typically at least 50 the reverse selectivity ratio being the ratio of the rate of removal of the silicon nitride to the rate of removal of the silicon oxide.

    摘要翻译: 一种用于化学机械抛光的胶体分散体,包括:(a)磨料组分; 和(b)约0.05重量%至约10重量%的所述磨料组分,水溶性两性聚合物,其包含至少一个大分子链B和与所述至少一个大分子链B的单个末端键合的部分A, 其中所述大分子链B衍生自具有季铵基或鎓基的一种或多种烯属不饱和单体,并且其中所述A部分为包含至少一个阴离子基团的聚合物或非聚合物基团; 其中分散体的pH为约1.5至约6.胶体分散体能够以至少约27的反向选择比(通常为至少50)来抛光包含氮化硅和氧化硅的基底,反向选择比为 氮化硅去除速率与氧化硅去除速率之比。

    ABRASIVE COMPOSITIONS FOR CHEMICAL POLISHING AND METHODS FOR USING SAME
    6.
    发明申请
    ABRASIVE COMPOSITIONS FOR CHEMICAL POLISHING AND METHODS FOR USING SAME 有权
    用于化学抛光的磨料组合物及其使用方法

    公开(公告)号:US20130122705A1

    公开(公告)日:2013-05-16

    申请号:US13733580

    申请日:2013-01-03

    IPC分类号: H01L21/306

    摘要: A colloidal dispersion for chemical mechanical polishing comprising: (a) an abrasive component; and (b) from about 0.05% to about 10% by weight of the abrasive component, a water-soluble amphoteric polymer comprising at least one macromolecular chain B and a part A bonded to a single end of the at least one macromolecular chain B, wherein the macromolecular chain B is derived from one or more ethylenically unsaturated monomers having quaternary ammonium groups or inium groups, and wherein the part A is a polymeric or nonpolymeric group comprising at least one anionic group; wherein the dispersion has a pH of between about 1.5 and about 6. The colloidal dispersion is capable of polishing a substrate comprising silicon nitride and silicon oxide with a reverse selectivity ratio of at least about 27, typically at least 50 the reverse selectivity ratio being the ratio of the rate of removal of the silicon nitride to the rate of removal of the silicon oxide.

    摘要翻译: 一种用于化学机械抛光的胶体分散体,包括:(a)磨料组分; 和(b)约0.05重量%至约10重量%的所述磨料组分,水溶性两性聚合物,其包含至少一个大分子链B和与所述至少一个大分子链B的单个末端键合的部分A, 其中所述大分子链B衍生自具有季铵基或鎓基的一种或多种烯属不饱和单体,并且其中所述A部分为包含至少一个阴离子基团的聚合物或非聚合物基团; 其中分散体的pH为约1.5至约6.胶体分散体能够以至少约27的反向选择比(通常为至少50)来抛光包含氮化硅和氧化硅的基底,反向选择比为 氮化硅去除速率与氧化硅去除速率之比。

    Liquid suspensions and powders of cerium oxide particles and polishing applications thereof
    7.
    发明授权
    Liquid suspensions and powders of cerium oxide particles and polishing applications thereof 有权
    液体悬浮液和二氧化铈颗粒粉末及其抛光应用

    公开(公告)号:US08317888B2

    公开(公告)日:2012-11-27

    申请号:US12444746

    申请日:2007-10-04

    IPC分类号: B24D3/02 C09C1/68 C09K3/14

    摘要: Suspensions of cerium oxide particles in which the particles (secondary particles) have an average size not exceeding 200 nm, such secondary particles being comprised of primary particles having an average size not exceeding 100 nm with a standard deviation having a value not exceeding 30% of the value of this average size, are prepared from a solution of a cerium-III salt, including cerium IV or hydrogen peroxide, which is contacted with a base in the presence of nitrate ions and in an inert atmosphere; the medium thus obtained is subjected to a thermal processing in an inert atmosphere, then acidified and scrubbed and the powder is obtained by drying and calcining of the suspension, which suspension and powder are useful for polishing applications.

    摘要翻译: 其中颗粒(二次颗粒)的平均尺寸不超过200nm的二氧化铈颗粒的悬浮液,这种二次颗粒由平均尺寸不超过100nm的一次颗粒组成,标准偏差值不超过100nm 该平均尺寸的值由在硝酸根离子存在下和惰性气氛中与碱接触的铈-III盐(包括铈IV或过氧化氢)的溶液制备; 将如此获得的介质在惰性气氛中进行热处理,然后酸化和洗涤,并通过干燥和煅烧悬浮液获得粉末,该悬浮液和粉末可用于抛光应用。