Non-volatile semiconductor memory device and method of manufacturing the same
    1.
    发明授权
    Non-volatile semiconductor memory device and method of manufacturing the same 失效
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08409949B2

    公开(公告)日:2013-04-02

    申请号:US12822157

    申请日:2010-06-23

    IPC分类号: H01L21/336

    摘要: Provided is a nonvolatile semiconductor memory device highly integrated and highly reliable. A plurality of memory cells are formed in a plurality of active regions sectioned by a plurality of isolations (silicon oxide films) extending in the Y direction and deeper than a well (p type semiconductor region). In each memory cell, a contact is provided in the well (p type semiconductor region) so as to penetrate through a source diffusion layer (n+ type semiconductor region), and the contact that electrically connects bit lines (metal wirings) and the source diffusion layer (n+ type semiconductor region) is also electrically connected to the well (p type semiconductor region).

    摘要翻译: 提供了高度集成且高度可靠的非易失性半导体存储器件。 多个存储单元形成在由在Y方向上延伸并且比阱(p型半导体区域)更深的多个隔离(氧化硅膜)分割的多个有源区域中。 在每个存储单元中,在阱(p型半导体区域)中提供接触以穿透源极扩散层(n +型半导体区域),并且将位线(金属布线)和源极扩散 层(n +型半导体区)也与阱(p型半导体区)电连接。

    Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC
    2.
    发明授权
    Semiconductor LED, opto-electronic integrated circuits (OEIC), and method of fabricating OEIC 有权
    半导体LED,光电集成电路(OEIC)以及制造OEIC的方法

    公开(公告)号:US08030668B2

    公开(公告)日:2011-10-04

    申请号:US11935904

    申请日:2007-11-06

    IPC分类号: H01L27/15

    摘要: A light emitting diode demonstrating high luminescence efficiency and comprising a Group IV semiconductor such as silicon or germanium equivalent thereto as a basic component formed on a silicon substrate by a prior art silicon process, and a fabricating method of waveguide thereof are provided. The light emitting diode of the invention comprises a first electrode for implanting electrons, a second electrode for implanting holes, and a light emitting section electrically connected to the first and the second electrode, wherein the light emitting section is made out of single crystalline silicon and has a first surface and a second surface facing the first surface, wherein with respect to plane orientation (100) of the first and second surfaces, the light emitting section crossing at right angles to the first and second surfaces is made thinner, and wherein a material having a high refractive index is arranged around the thin film section.

    摘要翻译: 提供了高发光效率的发光二极管,并且包括通过现有技术的硅工艺在硅衬底上形成的等价于其的硅或锗等IV族半导体作为基底部件,以及其波导管的制造方法。 本发明的发光二极管包括用于注入电子的第一电极,用于注入孔的第二电极和与第一和第二电极电连接的发光部分,其中发光部分由单晶硅制成, 具有面向第一表面的第一表面和第二表面,其中相对于第一表面和第二表面的平面取向(100),使与第一表面和第二表面成直角交叉的发光部分变薄,并且其中 具有高折射率的材料设置在薄膜部分周围。

    Semiconductor device and manufacturing method of the same
    3.
    发明授权
    Semiconductor device and manufacturing method of the same 有权
    半导体器件及其制造方法相同

    公开(公告)号:US07935597B2

    公开(公告)日:2011-05-03

    申请号:US12912609

    申请日:2010-10-26

    IPC分类号: H01L21/336

    摘要: Performance and reliability of a semiconductor device including a non-volatile memory are improved. A memory cell of the non-volatile memory includes, over an upper portion of a semiconductor substrate, a select gate electrode formed via a first dielectric film and a memory gate electrode formed via a second dielectric film formed of an ONO multilayered film having a charge storing function. The first dielectric film functions as a gate dielectric film, and includes a third dielectric film made of silicon oxide or silicon oxynitride and a metal-element-containing layer made of a metal oxide or a metal silicate formed between the select gate electrode and the third dielectric film. A semiconductor region positioned under the memory gate electrode and the second dielectric film has a charge density of impurities lower than that of a semiconductor region positioned under the select gate electrode and the first dielectric film.

    摘要翻译: 提高了包括非易失性存储器的半导体器件的性能和可靠性。 非易失性存储器的存储单元包括在半导体衬底的上部上的经由第一电介质膜形成的选择栅电极和通过由具有电荷的ONO多层膜形成的第二电介质膜形成的存储栅电极 存储功能。 第一电介质膜用作栅极电介质膜,并且包括由氧化硅或氮氧化硅制成的第三电介质膜和由选择栅电极和第三电极之间形成的金属氧化物或金属硅酸盐构成的含金属元素层 电介质膜。 位于存储栅电极下方的半导体区域和第二电介质膜的电荷密度低于位于选择栅电极和第一电介质膜下方的半导体区域的电荷密度。

    INTEGRATED SEMICONDUCTOR NONVOLATILE STORAGE DEVICE
    4.
    发明申请
    INTEGRATED SEMICONDUCTOR NONVOLATILE STORAGE DEVICE 有权
    集成半导体非易失存储器件

    公开(公告)号:US20100203697A1

    公开(公告)日:2010-08-12

    申请号:US12763402

    申请日:2010-04-20

    IPC分类号: H01L21/336

    摘要: An object of the present invention is to provide an integrated semiconductor nonvolatile storage device that can be read at high speed and reprogrammed an increased number of times.In the case of conventional nonvolatile semiconductor storage devices having a split-gate structure, there is a tradeoff between the read current and the maximum allowable number of reprogramming operations. To overcome this problem, an integrated semiconductor nonvolatile storage device of the present invention is configured such that memory cells having different memory gate lengths are integrated on the same chip. This allows the device to be read at high speed and reprogrammed an increased number of times.

    摘要翻译: 本发明的目的是提供一种可以高速读取并重新编程次数增加的集成半导体非易失性存储装置。 在具有分割栅结构的常规非易失性半导体存储器件的情况下,读取电流和最大可允许重编程操作次数之间存在权衡。 为了克服这个问题,本发明的集成半导体非易失性存储装置被配置成使得具有不同存储器栅极长度的存储单元集成在同一芯片上。 这允许以高速读取设备并重新编程增加的次数。

    NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE
    5.
    发明申请
    NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE 有权
    非挥发性半导体器件及其制造嵌入式非易失性半导体存储器件的方法

    公开(公告)号:US20100105199A1

    公开(公告)日:2010-04-29

    申请号:US12652517

    申请日:2010-01-05

    IPC分类号: H01L21/28

    摘要: A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation.

    摘要翻译: 提供一种制造非挥发性半导体存储器件的方法,其克服了由于最佳栅极高度的不同而引入的注入离子的问题,同时形成利用侧壁结构的自对准分裂栅型存储单元和 缩放MOS晶体管。 形成在存储区域中形成侧壁的选择栅电极比逻辑区域中的栅电极高,使得自对准分离栅极存储单元的侧壁栅电极的高度大于 在逻辑区域的栅电极。 栅极电极的高度降低在栅电极形成之前的逻辑区域中进行。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    6.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 审中-公开
    非易失性半导体存储器件

    公开(公告)号:US20090273014A1

    公开(公告)日:2009-11-05

    申请号:US12430088

    申请日:2009-04-26

    IPC分类号: H01L29/788 H01L29/792

    摘要: Each of a memory gate, a control gate, a source diffusion layer, and a drain diffusion layer is connected to a control circuit for controlling potential, and the control circuit operates so as to supply a first potential to the memory gate, a second potential to the control gate, a third potential to the drain diffusion layer, and a fourth potential to the source diffusion layer. Here, after setting the memory gate to be in a floating state by shifting a switch transistor from an ON state to an OFF state, the control circuit operates so as to supply a sixth potential which is higher than the second potential to the control gate to make the memory gate have a fifth potential which is higher than the first potential, thereby boosting the memory gate.

    摘要翻译: 存储器栅极,控制栅极,源极扩散层和漏极扩散层中的每一个连接到用于控制电位的控制电路,并且控制电路工作以向存储栅极提供第一电位,第二电位 到所述控制栅极,到所述漏极扩散层的第三电位,以及到所述源极扩散层的第四电位。 这里,通过将开关晶体管从导通状态切换到断开状态,在将存储栅极设定为浮置状态之后,控制电路动作以向控制栅极提供比第二电位高的第六电位, 使存储器栅极具有高于第一电位的第五电位,从而提高存储器栅极。

    Nonvolatile memory device and semiconductor device
    8.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07529126B2

    公开(公告)日:2009-05-05

    申请号:US11472993

    申请日:2006-06-23

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1iA to flow a current in the memory cell.

    摘要翻译: 这里公开了一种通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入并降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1iA的恒定电流,并且通过约1iA的恒定电流放电位线以使存储单元中的电流流动。

    SEMICONDUCTOR NONVOLATILE MEMORY DEVICE
    9.
    发明申请
    SEMICONDUCTOR NONVOLATILE MEMORY DEVICE 有权
    半导体非易失性存储器件

    公开(公告)号:US20090014775A1

    公开(公告)日:2009-01-15

    申请号:US12233670

    申请日:2008-09-19

    IPC分类号: H01L29/00

    摘要: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

    摘要翻译: 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时,使用不随时间变化的交叉点来验证热孔注入。 因此,可以验证擦除状态,而不知道任何时变变化。 此外,通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICES WITH CHARGE INJECTION CORNER
    10.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICES WITH CHARGE INJECTION CORNER 有权
    带电荷注射角的非线性半导体存储器件

    公开(公告)号:US20080290401A1

    公开(公告)日:2008-11-27

    申请号:US12124143

    申请日:2008-05-20

    IPC分类号: H01L29/792

    摘要: An erase method where a corner portion on which an electric field concentrates locally is provided on the memory gate electrode, and charges in the memory gate electrode are injected into a charge trap film in a gate dielectric with Fowler-Nordheim tunneling operation is used. Since current consumption at the time of erase can be reduced by the Fowler-Nordheim tunneling, a power supply circuit area of a memory module can be reduced. Since write disturb resistance can be improved, a memory array area can be reduced by adopting a simpler memory array configuration. Owing to both the effects, an area of the memory module can be largely reduced, so that manufacturing cost can be reduced. Further, since charge injection centers of write and erase coincide with each other, so that (program and erase) endurance is improved.

    摘要翻译: 在存储栅电极上设置有局部集中电场的角部的擦除方法,并且使用Fowler-Nordheim隧道操作将存储栅电极中的电荷注入栅极电介质中的电荷陷阱膜。 由于通过Fowler-Nordheim隧道可以减少擦除时的电流消耗,因此可以减少存储器模块的电源电路区域。 由于可以提高写入干扰电阻,所以可以通过采用更简单的存储器阵列配置来减少存储器阵列区域。 由于这两个效果,可以大大减少存储器模块的面积,从而可以降低制造成本。 此外,由于写入和擦除的电荷注入中心彼此一致,所以(编程和擦除)耐久性得到改善。