Envelope packet architecture for broadband engine
    5.
    发明授权
    Envelope packet architecture for broadband engine 有权
    宽带引擎的信封包架构

    公开(公告)号:US07975064B2

    公开(公告)日:2011-07-05

    申请号:US10942422

    申请日:2004-09-16

    IPC分类号: G06F15/16

    CPC分类号: H04L1/188

    摘要: A mechanism provides for sending an envelope and replying to an envelope. A transmitter is configured to send an envelope. A receiver is coupled to the transmitter, wherein the receiver is configured to receive the envelope and generate a reply envelope. A send buffer is coupled to the transmitter. A receive buffer is coupled to the receiver. A retry timer is coupled to the transmitter, wherein the retry timer is configured to reset upon the receipt of a reply envelope correlated to the transmit envelope. The transmitter is configured to retransmit an envelope if the transmitter does not receive a corresponding reply envelope within a selected time period as determined by the retry timer. This leads to a decrease in the total number of envelopes, transmitted from both the transmitter and the receiver.

    摘要翻译: 一种机制用于发送信封并回复信封。 发射机被配置为发送信封。 接收机耦合到发射机,其中接收机被配置为接收信封并产生回复信封。 发送缓冲器耦合到发送器。 接收缓冲器耦合到接收器。 重试定时器耦合到发射机,其中重试定时器被配置为在接收到与发射包络相关的应答包络时复位。 如果发射机在由重试定时器确定的选定时间段内没有接收到对应的应答包络,则发射机被配置为重发信封。 这导致从发射机和接收机两者发送的信封总数的减少。

    Device for enhancing the visibility of portable computer display screens by shielding direct and indirect light from the display screen and the eyes of the user
    6.
    发明授权
    Device for enhancing the visibility of portable computer display screens by shielding direct and indirect light from the display screen and the eyes of the user 失效
    用于通过屏蔽来自显示屏幕和用户眼睛的直接和间接光线来增强便携式计算机显示屏的可视性的装置

    公开(公告)号:US06394615B1

    公开(公告)日:2002-05-28

    申请号:US09574319

    申请日:2000-05-19

    IPC分类号: G02B508

    摘要: A collapsible-light shield for a portable computer shields direct and indirect light from the computer display and from the eyes of the user. The light shield has four flexible panels that form a tubular shape when in use. One end of the light shield has a contoured viewing port through which the user may view the screen. The other end of the light shield has a ring-like elastic fastener that detachably secures to three sides of the computer display. Each panel has two bisecting fold lines about which the tubular light shield may be collapsed into a substantially flat profile that is a small fraction of its original size.

    摘要翻译: 用于便携式计算机的可折叠防护罩屏蔽来自计算机显示器和用户眼睛的直接和间接光。 防护罩具有四个柔性板,在使用时形成管状。 遮光罩的一端具有轮廓的观察端口,用户可以通过该端口观看屏幕。 遮光罩的另一端具有可拆卸地固定到计算机显示器的三侧的环状弹性紧固件。 每个面板具有两个平分折叠线,管状遮光罩围绕该折叠线折叠成基本上平坦的轮廓,其为其原始尺寸的一小部分。

    Method for making Group III nitride devices and devices produced thereby
    9.
    发明授权
    Method for making Group III nitride devices and devices produced thereby 失效
    制造III族氮化物器件的方法及其制造的器件

    公开(公告)号:US07033858B2

    公开(公告)日:2006-04-25

    申请号:US10803467

    申请日:2004-03-18

    IPC分类号: C30B25/18

    摘要: A method is for making at least one semiconductor device including providing a sacrificial growth substrate of Lithium Aluminate (LiAlO2); forming at least one semiconductor layer including a Group III nitride adjacent the sacrificial growth substrate; attaching a mounting substrate adjacent the at least one semiconductor layer opposite the sacrificial growth substrate; and removing the sacrificial growth substrate. The method may further include adding at least one contact onto a surface of the at least one semiconductor layer opposite the mounting substrate, and dividing the mounting substrate and at least one semiconductor layer into a plurality of individual semiconductor devices. To make the final devices, the method may further include bonding the mounting substrate of each individual semiconductor device to a heat sink. The step of removing the sacrificial substrate may include wet etching the sacrificial growth substrate.

    摘要翻译: 一种方法是制造至少一种半导体器件,包括提供铝酸铝(LiAlO 2)的牺牲生长衬底; 在所述牺牲生长衬底附近形成包含III族氮化物的至少一个半导体层; 将安装基板附接到与所述牺牲生长衬底相对的所述至少一个半导体层; 并去除牺牲生长衬底。 该方法还可以包括将至少一个触点添加到与安装基板相对的至少一个半导体层的表面上,以及将安装基板和至少一个半导体层分成多个单独的半导体器件。 为了制造最终装置,该方法还可以包括将每个单独的半导体器件的安装衬底接合到散热器。 去除牺牲衬底的步骤可以包括湿蚀刻牺牲生长衬底。