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    MOLDING THERMAL EXPANSION STRUCTURE AND MOLDING METHOD THEREOF
    1.
    发明申请
    MOLDING THERMAL EXPANSION STRUCTURE AND MOLDING METHOD THEREOF 有权

    公开(公告)号：US20210197427A1

    公开(公告)日：2021-07-01

    申请号：US17022980

    申请日：2020-09-16

    申请人： FENG TAY ENTERPRISES CO., LTD.

    发明人： CHIN-TE SU

    IPC分类号： B29C44/12 ,  B29C44/34

    摘要： A molding thermal expansion structure includes a thermoplastic material and a thermal expansion material, wherein the thermoplastic material is 50 wt % to 90 wt % based on a weight of the molding thermal expansion structure; the thermal expansion material is 50 wt % to 10 wt % based on a weight of the molding thermal expansion structure; wherein, the thermal expansion material is expanded from a foaming original material through a pre-foaming process; the thermoplastic material and the thermal expansion material are mixed to form a mixed material; the mixed material is thermally expanded to form a thermal expansion structure in a molding apparatus. The molding thermal expansion structure provided in the present invention could satisfy various needs of light-weighted products. A molding method of the thermal expansion structure is also provided herein.

    THREE-DIMENSIONAL PRINTED THERMAL EXPANSION STRUCTURE AND MANUFACTURING METHOD OF THE SAME
    2.
    发明申请
    THREE-DIMENSIONAL PRINTED THERMAL EXPANSION STRUCTURE AND MANUFACTURING METHOD OF THE SAME 有权

    公开(公告)号：US20210101331A1

    公开(公告)日：2021-04-08

    申请号：US16780351

    申请日：2020-02-03

    申请人： FENG TAY ENTERPRISES CO., LTD.

    发明人： CHIN-TE SU

    IPC分类号： B29C64/118

    摘要： A 3D printed thermal expansion structure includes a thermoplastic material and a thermal expansion material, wherein the thermoplastic material is in a range from 50 to 90 wt % based on a weight of the 3D printed thermal expansion structure, and the thermal expansion material is in a range from 10 to 50 wt % based on the weight of the 3D printed thermal expansion structure. The thermoplastic material and the thermal expansion material are mixed to form a mixed material, and the mixed material is utilized by a 3D printing apparatus to form a solid object, and the solid object is heated to form the 3D printed thermal expansion structure in a manufacturing method of a 3D printed thermal expansion structure provided herein.

    RECLAIMED MATERIAL FOR MANUFACTURING SHOES AND METHOD OF PRODUCING RECLAIMED RUBBER BY PROCESSING RECYCLED SHOE MATERIAL WASTE
    4.
    发明申请
    RECLAIMED MATERIAL FOR MANUFACTURING SHOES AND METHOD OF PRODUCING RECLAIMED RUBBER BY PROCESSING RECYCLED SHOE MATERIAL WASTE 有权

    公开(公告)号：US20220403146A1

    公开(公告)日：2022-12-22

    申请号：US17488871

    申请日：2021-09-29

    申请人： FENG TAY ENTERPRISES CO., LTD.

    发明人： CHI-YUAN HUNG

    IPC分类号： C08L17/00 ,  C08K3/36 ,  B29B17/04

    摘要： A method of producing a reclaimed rubber made of recycled shoe material waste includes the following steps. Step S1: collect a scrap rubber which is the shoe material waste. Step S2: grind the scrap rubber to form scrap rubber granules. Step S3: devulcanize the scrap rubber granules to form a reclaimed rubber. A reclaimed material for manufacturing shoes includes a reclaimed rubber formulation and a crosslinking agent, wherein the reclaimed rubber formulation is constituted by compounding a basic rubber formulation and the reclaimed rubber, wherein the reclaimed material for manufacturing shoes includes 65-94.8 wt % of the basic rubber formulation, 5-30 wt % of the reclaimed rubber, and 0.2 wt % to 5 wt % of crosslinking agent. Mechanical properties of the reclaimed material for manufacturing shoes meet required standards of shoe outsole material. A method of consuming rubber waste produced during the shoe manufacturing process is disclosed herein.

    LIGHT-CURED ANTI-SLIP STRUCTURE OF SHOE SOLE AND MANUFACTURING METHOD THEREOF
    9.
    发明申请
    LIGHT-CURED ANTI-SLIP STRUCTURE OF SHOE SOLE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20230051022A1

    公开(公告)日：2023-02-16

    申请号：US17388348

    申请日：2021-07-29

    申请人： FENG TAY ENTERPRISES CO., LTD.

    发明人： CHIEN-HSIN CHOU

    IPC分类号： G03F7/20 ,  A43B13/22 ,  B32B3/30 ,  B32B25/14 ,  C08L35/02

    摘要： A light-cured anti-slip structure includes an anti-slip layer fixed onto a substrate surface. The anti-slip layer is composed of the light-curing composite, wherein the light-curing composite includes 50 wt % to 100 wt % of photopolymer, 0.5 wt % to 20 wt % of photoinitiator, 5 wt % to 50 wt % of thermosetting polymer, less than or equal to 5 wt % of thermal curing initiator, which are mixed. The photoinitiator receives light energy to trigger a light-curing reaction of the photopolymer. Simultaneously the photoinitiator releases heat to activate the thermal curing initiator, the thermal curing initiator induces a curing reaction of the thermosetting polymer to form the anti-slip layer. The light-cured anti-slip structure provided by the present invention could be quickly cured on the substrate surface, and the manufacturing time and the cost of material could be significantly reduced. A manufacturing method of a light-cured anti-slip structure is provided as well.