摘要:
A reconstituted electronic device including: a first face and a second face; a plurality of individual chips placed perpendicular to the faces, each individual chip carrying, on one of its surfaces, at least one component, tracks, and a connection mechanism that are flush with one or other of the faces of the reconstituted electronic device; and an encapsulant that encapsulates the individual chips.
摘要:
A structure including a sequence of elements for sending or receiving a signal along an axis. Two successive elements along the direction of the axis are offset with respect to each other along the direction perpendicular to the axis. The structure includes at least two layers of material deposited on a reception substrate using the layer transfer technique. The structure particularly relates to any type of structure for which elements must have a high density, such as a print bead, networks of optical components, antenna networks, etc.
摘要:
The invention provides a device for the gravimetric detection of particles in a fluid medium, comprising a flat electromechanical oscillator (1), means for supporting the oscillator, means (15a, 15b, 15c, 15d) for actuating said oscillator and, on either side of the plane of the oscillator (1), two cavities (3, 5) enabling the oscillator (1) to vibrate when it is activated by the actuation means (15a, 15b, 15c, 15d), characterized in that at least one of the two cavities (3, 5) forms an integral part of a channel (2, 4) for the passage of a fluid over at least one of the faces (1a, 1b) of the oscillator and in that said actuation means (15a, 15b, 15c, 15d) take the form of at least one electrode (15a, 15b, 15c, 15d) lying in the same plane as that of the electromechanical oscillator and at a defined distance (g) from the oscillator, so as to ensure that the oscillator vibrates in its plane.
摘要:
The invention relates to a system comprising a first substrate (100) with at least one bonding area (110a, 110b), liable to be assembled with a second substrate (200), the bonding area (110a, 110b) comprising an area made of a material (104) that can be wetted with a meltable material. According to the invention, the bonding area (110a, 110b) comprises at least one cavity (120) to receive meltable material.
摘要:
The invention relates to a test socket (10) for an electronic component, comprising a embossed support layer (12) comprising several embossments (16) with projecting relief, the embossments being provided with at least one conducting test area (14) near the top of the embossment, that may be brought into electrical contact with a terminal of the component. Application to testing bare or packaged electronic components.