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公开(公告)号：US20120258919A1
公开(公告)日：2012-10-11
申请号：US13523438
申请日：2012-06-14
申请人： Fumihito SUGIHARA , Naoki INOUE , Seiko KOIZUMI , Chinfang LIU , Hajime TAKASAKI , Hisayuki KOBAYASHI , Hiroshi MANO , Sachie NAKATANI , Masahiro WADA
发明人： Fumihito SUGIHARA , Naoki INOUE , Seiko KOIZUMI , Chinfang LIU , Hajime TAKASAKI , Hisayuki KOBAYASHI , Hiroshi MANO , Sachie NAKATANI , Masahiro WADA
CPC分类号： C07K5/06139 , A61K38/05 , C07K5/06165
摘要： A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.
摘要翻译： 本发明要解决的问题是提供：对于抑制诸如骨质疏松症，骨关节炎和压力性溃疡等各种疾病的肽分子的主体，特别是容易吸收到体内的二肽 肠 包含二肽作为必需二肽的胶原肽; 以及包含二肽作为基本有效成分的疾病抑制剂。 作为解决上述问题的方法，本发明的胶原肽的特征在于，含有具有Hyp-Gly结构的二肽作为必需二肽的二肽。 根据本发明的二肽的特征在于具有Hyp-Gly的结构。 根据本发明的疾病抑制剂的特征在于包含具有Hyp-Gly结构作为必需有效成分的二肽。
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公开(公告)号：US08227424B2
公开(公告)日：2012-07-24
申请号：US12443298
申请日：2008-11-14
申请人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
发明人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
CPC分类号： C07K5/06139 , A61K38/05 , C07K5/06165
摘要： A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.
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3.发明授权Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion 有权半导体装置包括布线基板上的第一焊盘和密封部分上的第二焊盘公开(公告)号：US08076770B2
公开(公告)日：2011-12-13
申请号：US12190010
申请日：2008-08-12
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。
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公开(公告)号：US08410062B2
公开(公告)日：2013-04-02
申请号：US13523438
申请日：2012-06-14
申请人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
发明人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
IPC分类号： A61K38/05
CPC分类号： C07K5/06139 , A61K38/05 , C07K5/06165
摘要： A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.
摘要翻译： 本发明要解决的问题是提供：对于抑制诸如骨质疏松症，骨关节炎和压力性溃疡等各种疾病的肽分子的主体，特别是容易吸收到体内的二肽 肠 包含二肽作为必需二肽的胶原肽; 以及包含二肽作为基本有效成分的疾病抑制剂。 作为解决上述问题的方法，本发明的胶原肽的特征在于，含有具有Hyp-Gly结构的二肽作为必需二肽的二肽。 根据本发明的二肽的特征在于具有Hyp-Gly的结构。 根据本发明的疾病抑制剂的特征在于包含具有Hyp-Gly结构作为必需有效成分的二肽。
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公开(公告)号：US20120032353A1
公开(公告)日：2012-02-09
申请号：US13274971
申请日：2011-10-17
IPC分类号： H01L23/488
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。
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公开(公告)号：US20090045497A1
公开(公告)日：2009-02-19
申请号：US12190010
申请日：2008-08-12
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。
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公开(公告)号：US20110166365A1
公开(公告)日：2011-07-07
申请号：US12443298
申请日：2008-11-14
申请人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
发明人： Fumihito Sugihara , Naoki Inoue , Seiko Koizumi , Chinfang Liu , Hajime Takasaki , Hisayuki Kobayashi , Hiroshi Mano , Sachie Nakatani , Masahiro Wada
IPC分类号： C07D207/12
CPC分类号： C07K5/06139 , A61K38/05 , C07K5/06165
摘要： A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.
摘要翻译： 本发明要解决的问题是提供：对于抑制诸如骨质疏松症，骨关节炎和压力性溃疡等各种疾病的肽分子的主体，特别是容易吸收到体内的二肽 肠 包含二肽作为必需二肽的胶原肽; 以及包含二肽作为基本有效成分的疾病抑制剂。 作为解决上述问题的方法，本发明的胶原肽的特征在于，含有具有Hyp-Gly结构的二肽作为必需二肽的二肽。 根据本发明的二肽的特征在于具有Hyp-Gly的结构。 根据本发明的疾病抑制剂的特征在于包含具有Hyp-Gly结构作为必需有效成分的二肽。
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8.发明授权Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board 有权具有将芯片连接到布线板焊盘的第一导电构件和将布线板焊盘连接到覆盖芯片和布线板的绝缘体上的焊盘的半导体器件公开(公告)号：US08710647B2
公开(公告)日：2014-04-29
申请号：US13274971
申请日：2011-10-17
CPC分类号： H01L23/3128 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/105 , H01L2224/32145 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48599 , H01L2224/49171 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19107 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes a wiring board having connection pads thereon and a semiconductor chip mounted on the wiring board. The wiring board and the semiconductor chip are covered with a sealing portion. Conductive members are extended upward from the connection pads and are exposed from the sealing portion. Rewiring lines are connected to the exposed conductive members. Land portions are arranged on the sealing portion and are electrically connected to the conductive members through the rewiring lines.
摘要翻译： 半导体器件包括其上具有连接焊盘的布线板和安装在布线板上的半导体芯片。 接线板和半导体芯片被密封部分覆盖。 导电构件从连接垫向上延伸并从密封部分露出。 再生线连接到暴露的导电构件。 接地部设置在密封部上，并通过再布线与导电部件电连接。
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9.发明申请公开(公告)号：US20100068342A1
公开(公告)日：2010-03-18
申请号：US12312513
申请日：2007-11-15
IPC分类号： A23L1/305 , A23L1/0562
CPC分类号： C07K14/78 , A23J3/06 , A23J3/341 , A23L2/52 , A23L29/284 , A23L33/18 , A23V2002/00 , A61K38/014 , A23V2200/316 , A23V2250/5422
摘要： An object of the present invention is to elucidate a collagen peptide composed of oligopeptides having ability to enter the blood higher than that of conventional collagen peptides and thus to provide a food or beverage mixed with the collagen peptide. The present invention provides a collagen peptide composition obtainable by digesting a collagen or gelatin with protease, which comprises 70% to 100% by weight of peptides with a molecular weight 500 or more to 3000 or less, less than 10% by weight of peptides with a molecular weight of less than 500, and less than 20% by weight of peptides with a molecular weight of more than 3000, based on the total weight of the composition, wherein the ratio of N-terminal glycine residues to total of the N-terminal amino acid residues of the peptides in the composition is 33 mol % or more to 65 mol % or less.
摘要翻译： 本发明的目的是阐明由具有比常规胶原肽更高的进入血液的能力的寡肽构成的胶原肽，从而提供与胶原肽混合的食品或饮料。 本发明提供了一种通过用蛋白酶消化胶原蛋白或明胶获得的胶原肽组合物，其包含70％至100％重量的分子量为500或更多至3000或更小，少于10重量％ 基于组合物的总重量，分子量小于500且小于20重量％的分子量大于3000的肽，其中N-末端甘氨酸残基与N- 组合物中肽的末端氨基酸残基为33摩尔％以上至65摩尔％以下。
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