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公开(公告)号：US08094465B2
公开(公告)日：2012-01-10
申请号：US12218668
申请日：2008-07-16
IPC分类号： H05K9/00
CPC分类号： G01P1/023 , H01L23/057 , H01L2224/32245 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.
摘要翻译： 模块，特别是传感器模块，具有模块壳体，载体元件，连接元件和至少一个部件，模块壳体完全包围至少一个部件并且位于载体元件上，并且至少 一个部件也安装在连接元件上并且位于连接元件和载体元件之间。
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公开(公告)号：US20100252939A1
公开(公告)日：2010-10-07
申请号：US12721785
申请日：2010-03-11
申请人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
发明人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
IPC分类号： H01L23/488 , H01L21/78 , H01L21/60
CPC分类号： H01L21/568 , B81B7/0074 , B81C2203/0154 , G01R33/0206 , H01L21/561 , H01L23/3107 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L2224/04105 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/181 , H01L2924/00
摘要： A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing.
摘要翻译： 提供了一种具有基板和至少一个连接到该基板的芯片的芯片模块，该基板具有第一主平面延伸部分，该芯片具有第二主平面延伸部分，并且锐角设置在第一主平面 延伸部分和第二主延伸平面，并且基板还包括模具壳体。
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3.发明授权Chip module and method for producing a chip module having plains of extensions for chip and substrate 有权芯片模块和用于制造芯片模块的方法，该芯片模块具有用于芯片和衬底的延伸平面公开(公告)号：US08198130B2
公开(公告)日：2012-06-12
申请号：US12721785
申请日：2010-03-11
申请人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
发明人： Stefan Finkbeiner , Frieder Haag , Hans-Peter Baer
IPC分类号： H01L21/00
CPC分类号： H01L21/568 , B81B7/0074 , B81C2203/0154 , G01R33/0206 , H01L21/561 , H01L23/3107 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L2224/04105 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/181 , H01L2924/00
摘要： A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing.
摘要翻译： 提供了一种具有基板和至少一个连接到该基板的芯片的芯片模块，该基板具有第一主平面延伸部分，该芯片具有第二主平面延伸部分，并且锐角设置在第一主平面 延伸部分和第二主延伸平面，并且基板还包括模具壳体。
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4.发明申请METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES 审中-公开制造半导体芯片的方法，安装方法和用于垂直安装到电路基板上的半导体芯片公开(公告)号：US20120126352A1
公开(公告)日：2012-05-24
申请号：US13291278
申请日：2011-11-08
申请人： Hans-Peter Baer , Paul Farber , Stefan Weiss , Lutz Rauscher
发明人： Hans-Peter Baer , Paul Farber , Stefan Weiss , Lutz Rauscher
CPC分类号： H01L24/94 , H01L24/05 , H01L24/16 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2224/02313 , H01L2224/02371 , H01L2224/0401 , H01L2224/04042 , H01L2224/05569 , H01L2224/05571 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/81801 , H01L2224/85186 , H01L2224/94 , H01L2924/00014 , H01L2924/10253 , H01L2224/0231 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2224/45099
摘要： A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.
摘要翻译： 在平行于晶片平面的上侧具有接触表面的半导体芯片在垂直于上侧的端子焊盘侧具有端子焊盘，每个端子焊盘导电地连接到分配的接触表面。 这允许将芯片垂直安装在基板上并借助常规的接合技术进行接触。 描述制造方法和两种安装方法。
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公开(公告)号：US20140117471A1
公开(公告)日：2014-05-01
申请号：US14058550
申请日：2013-10-21
申请人： Heiko STAHL , Christoph Duenn , Hans-Peter Baer
发明人： Heiko STAHL , Christoph Duenn , Hans-Peter Baer
CPC分类号： B81B7/0006
摘要： A micromechanical component includes a substrate and a first oxide layer on the substrate, the first oxide layer having an aperture. The component further includes a conductive functional layer, which is provided on the first oxide layer in the region of the aperture, and a metal layer, which is provided on the functional layer, for producing a bond joint. A second oxide layer is provided on lateral faces of the functional layer for insulating the functional layer.
摘要翻译： 微机械部件包括衬底和衬底上的第一氧化物层，第一氧化物层具有孔。 所述部件还包括设置在所述开口区域中的所述第一氧化物层上的导电功能层和设置在所述功能层上的用于产生接合接头的金属层。 在功能层的侧面上设置第二氧化物层，用于使功能层绝缘。
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公开(公告)号：US09206034B2
公开(公告)日：2015-12-08
申请号：US14058550
申请日：2013-10-21
申请人： Heiko Stahl , Christoph Duenn , Hans-Peter Baer
发明人： Heiko Stahl , Christoph Duenn , Hans-Peter Baer
IPC分类号： B81B7/00
CPC分类号： B81B7/0006
摘要： A micromechanical component includes a substrate and a first oxide layer on the substrate, the first oxide layer having an aperture. The component further includes a conductive functional layer, which is provided on the first oxide layer in the region of the aperture, and a metal layer, which is provided on the functional layer, for producing a bond joint. A second oxide layer is provided on lateral faces of the functional layer for insulating the functional layer.
摘要翻译： 微机械部件包括衬底和衬底上的第一氧化物层，第一氧化物层具有孔。 所述部件还包括设置在所述开口区域中的所述第一氧化物层上的导电功能层和设置在所述功能层上的用于产生接合接头的金属层。 在功能层的侧面上设置第二氧化物层，用于使功能层绝缘。
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公开(公告)号：US20090021920A1
公开(公告)日：2009-01-22
申请号：US12218668
申请日：2008-07-16
CPC分类号： G01P1/023 , H01L23/057 , H01L2224/32245 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： A module, in particular a sensor module, has a module housing, a carrier element, a connection element, and at least one component, the module housing completely enclosing the at least one component and being situated on the carrier element, and the at least one component also being mounted on the connection element and being situated between the connection element and the carrier element.
摘要翻译： 模块，特别是传感器模块，具有模块壳体，载体元件，连接元件和至少一个部件，模块壳体完全包围至少一个部件并且位于载体元件上，并且至少 一个部件也安装在连接元件上并且位于连接元件和载体元件之间。
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公开(公告)号：US07435991B2
公开(公告)日：2008-10-14
申请号：US10588838
申请日：2004-12-20
申请人： Hans-Peter Baer , Arnim Hoechst
发明人： Hans-Peter Baer , Arnim Hoechst
IPC分类号： H01L23/58
CPC分类号： B81C1/00182 , B81B2201/0292 , B81B2203/0127 , B81B2203/0315 , B81B2203/0353 , B81C2201/0178
摘要： A micromechanical sensor and a method for manufacturing same are described. A secure diaphragm restraint, independent of fluctuations in the cavern etching process due to the process technology, and a free design of the diaphragm are made possible by designing a suitable connection of the diaphragm in an oxide layer created by local oxidation. The micromechanical sensor includes, for example, a substrate, an external oxide layer formed in a laterally external area in the substrate, a diaphragm having multiple perforation holes formed in a laterally internal diaphragm area, a cavern etched in the substrate beneath the diaphragm, whereby the diaphragm is suspended in a suspension area of the external oxide layer which tapers toward connecting points of the diaphragm and the diaphragm is situated in its vertical height between a top side and a bottom side of the external oxide layer.
摘要翻译： 描述了一种微机械传感器及其制造方法。 通过设计通过局部氧化产生的氧化物层中的隔膜的适当连接，可以实现由于工艺技术而独立于洞穴蚀刻工艺的波动和隔膜的自由设计的安全膜片约束。 微机械传感器包括例如基板，形成在基板的横向外部区域中的外部氧化物层，具有形成在横向内部隔膜区域中的多个穿孔的隔膜，在隔膜下方的基板中蚀刻的基底，由此 隔膜悬挂在外部氧化物层的悬垂区域中，该外部氧化物层朝向隔膜的连接点逐渐变细，并且隔膜位于外部氧化物层的顶侧和底侧之间的垂直高度。
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公开(公告)号：US20070138581A1
公开(公告)日：2007-06-21
申请号：US10588838
申请日：2004-12-20
申请人： Hans-Peter Baer , Araim Hoechst
发明人： Hans-Peter Baer , Araim Hoechst
IPC分类号： H01L29/82
CPC分类号： B81C1/00182 , B81B2201/0292 , B81B2203/0127 , B81B2203/0315 , B81B2203/0353 , B81C2201/0178
摘要： A micromechanical sensor and a method for manufacturing same are described. A secure diaphragm restraint, independent of fluctuations in the cavern etching process due to the process technology, and a free design of the diaphragm are made possible by designing a suitable connection of the diaphragm in an oxide layer created by local oxidation. The micromechanical sensor includes, for example, a substrate, an external oxide layer formed in a laterally external area in the substrate, a diaphragm having multiple perforation holes formed in a laterally internal diaphragm area, a cavern etched in the substrate beneath the diaphragm, whereby the diaphragm is suspended in a suspension area of the external oxide layer which tapers toward connecting points of the diaphragm and the diaphragm is situated in its vertical height between a top side and a bottom side of the external oxide layer.
摘要翻译： 描述了一种微机械传感器及其制造方法。 通过设计通过局部氧化产生的氧化物层中的隔膜的适当连接，可以实现由于工艺技术而独立于洞穴蚀刻工艺的波动和隔膜的自由设计的安全膜片约束。 微机械传感器包括例如基板，形成在基板的横向外部区域中的外部氧化物层，具有形成在横向内部隔膜区域中的多个穿孔的隔膜，在隔膜下方的基板中蚀刻的基底，由此 隔膜悬挂在外部氧化物层的悬垂区域中，该外部氧化物层朝向隔膜的连接点逐渐变细，并且隔膜位于外部氧化物层的顶侧和底侧之间的垂直高度。
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