公开(公告)号：US08648232B2

公开(公告)日：2014-02-11

申请号：US12281265

申请日：2007-08-14

申请人： Takanari Ichikawa ,  Mika Kawashima ,  Haruko Iizumi ,  Hirofumi Kuroda ,  Youichi Kondou ,  Motoaki Seki ,  Yukako Hasegawa ,  Minami Matsui ,  Akie Ishikawa ,  Miki Nakazawa ,  Kumiko Suzuki

发明人： Takanari Ichikawa ,  Mika Kawashima ,  Haruko Iizumi ,  Hirofumi Kuroda ,  Youichi Kondou ,  Motoaki Seki ,  Yukako Hasegawa ,  Minami Matsui ,  Akie Ishikawa ,  Miki Nakazawa ,  Kumiko Suzuki

IPC分类号： A01H5/00 ,  A01H5/10 ,  A01H1/00 ,  C12N15/82

CPC分类号： C07K14/415 ,  C12N15/8261 ,  Y02A40/146

摘要： The present invention provides an early-maturing transgenic plant, which comprises a nucleic acid that encodes a protein having activity of causing early maturation of a plant, so that the gene can be expressed.

摘要翻译： 本发明提供了早熟的转基因植物，其包含编码具有引起植物早熟的活性的蛋白质的核酸，从而可以表达该基因。

公开(公告)号：US20140020134A1

公开(公告)日：2014-01-16

申请号：US14007813

申请日：2011-03-30

申请人： Nobuyo Itou ,  Hirofumi Kuroda ,  Ken-ichi Takane ,  Kou Aoki ,  Daisuke Shibata ,  Hiroshi Ezura ,  Kyoko Tanase

发明人： Nobuyo Itou ,  Hirofumi Kuroda ,  Ken-ichi Takane ,  Kou Aoki ,  Daisuke Shibata ,  Hiroshi Ezura ,  Kyoko Tanase

IPC分类号： C12N15/113

CPC分类号： C12N15/113 ,  C07K14/415 ,  C12N15/8235

摘要： The present invention relates to a fruit-specific promoter, which is suitable for the expression in a broader range of developmental stages of a fruit. Provided is a fruit-specific promoter DNA, which consists of a nucleotide sequence having 85% or more identity with the nucleotide sequence as shown in SEQ ID NO: 1 or 2 and has promoter activity in mature-green fruits.

摘要翻译： 本发明涉及一种水果特异性启动子，其适用于在更广泛的发育阶段的水果中表达。 提供了一种水果特异性启动子DNA，其由与SEQ ID NO：1或2所示的核苷酸序列具有85％以上同一性的核苷酸序列组成，并且在成熟 - 绿色果实中具有启动子活性。

公开(公告)号：US20100058497A1

公开(公告)日：2010-03-04

申请号：US12281265

申请日：2007-08-14

申请人： Takanari Ichikawa ,  Mika Kawashima ,  Haruko Iizumi ,  Hirofumi Kuroda ,  Youichi Kondou ,  Motoaki Seki ,  Yukako Hasegawa ,  Minami Matsui ,  Akie Ishikawa ,  Miki Nakazawa ,  Kumiko Suzuki

发明人： Takanari Ichikawa ,  Mika Kawashima ,  Haruko Iizumi ,  Hirofumi Kuroda ,  Youichi Kondou ,  Motoaki Seki ,  Yukako Hasegawa ,  Minami Matsui ,  Akie Ishikawa ,  Miki Nakazawa ,  Kumiko Suzuki

IPC分类号： A01H5/00 ,  C12N15/82

CPC分类号： C07K14/415 ,  C12N15/8261 ,  Y02A40/146

摘要： The present invention provides an early-maturing transgenic plant, which comprises a nucleic acid that encodes a protein having activity of causing early maturation of a plant, so that the gene can be expressed.

摘要翻译： 本发明提供了早熟的转基因植物，其包含编码具有引起植物早熟的活性的蛋白质的核酸，从而可以表达该基因。

公开(公告)号：US20080246008A1

公开(公告)日：2008-10-09

申请号：US12053455

申请日：2008-03-21

申请人： Hirofumi Kuroda

发明人： Hirofumi Kuroda

IPC分类号： H01B1/12 ,  H01B1/00

CPC分类号： C08L63/00 ,  C08G59/621 ,  C08G59/688 ,  H01L23/295 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/20655 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175° C. and a measurement frequency of about 100 Hz, minimum ion viscosity appears at about 5 seconds or later and within about 40 seconds from a measurement starting point. The minimum ion viscosity is at least about 4.0 and at most about 7.0. A maximum slope of the ion viscosity appears at about 10 seconds or later and within about 60 seconds from the measurement starting point. The maximum slope is at least about 2.0 and at most about 6.0.

摘要翻译： 半导体封装树脂组合物包括固化剂和具有多个缩水甘油醚基团的化合物（A）。 当在约175℃的测量温度和约100Hz的测量频率的条件下测量树脂组合物的离子粘度时，在测量起始点的约5秒或更长时间和约40秒内出现最小离子粘度 。 最小离子粘度为至少约4.0和至多约7.0。 离子粘度的最大斜率出现在测量起点约10秒或更长时间和约60秒内。 最大斜率为至少约2.0，最多为6.0。

公开(公告)号：US07431990B2

公开(公告)日：2008-10-07

申请号：US11137820

申请日：2005-05-25

申请人： Hirofumi Kuroda

发明人： Hirofumi Kuroda

IPC分类号： B32B27/38 ,  B32B27/18 ,  B32B27/04 ,  C08L63/00 ,  H01L23/29 ,  H01L21/56

CPC分类号： C08G59/3209 ,  C08G59/68 ,  Y10T428/31511

摘要： An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor chip, which is excellent in flowability and moldability without deterioration in crack resistance during soldering and flame retardance. Specifically, this invention provides a resin composition for encapsulating a semiconductor chip comprises an epoxy resin (A) containing the specific structure; a phenolic resin (B) containing the specific structure; an inorganic filler (C); a curing accelerator (D); a silane coupling agent (E); and Compound (F) containing an aromatic ring in which at least two adjacent carbon atoms of the ring member carbon atoms are coupled to a hydroxyl group, respectively.

摘要翻译： 本发明的目的是提供一种用于封装半导体芯片的环氧树脂组合物，其在流动性和成型性方面优异，而不会在焊接和阻燃期间的抗龟裂性劣化。 具体地说，本发明提供了一种用于封装半导体芯片的树脂组合物，该半导体芯片包括含有特定结构的环氧树脂（A） 含有特定结构的酚醛树脂（B） 无机填料（C）; 固化促进剂（D）; 硅烷偶联剂（E）; 和含有环成员碳原子的至少两个相邻碳原子与羟基偶合的芳香环的化合物（F）。

公开(公告)号：US08138266B2

公开(公告)日：2012-03-20

申请号：US12053455

申请日：2008-03-21

申请人： Hirofumi Kuroda

发明人： Hirofumi Kuroda

IPC分类号： C08F8/00

CPC分类号： C08L63/00 ,  C08G59/621 ,  C08G59/688 ,  H01L23/295 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/20655 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175° C. and a measurement frequency of about 100 Hz, minimum ion viscosity appears at about 5 seconds or later and within about 40 seconds from a measurement starting point. The minimum ion viscosity is at least about 4.0 and at most about 7.0. A maximum slope of the ion viscosity appears at about 10 seconds or later and within about 60 seconds from the measurement starting point. The maximum slope is at least about 2.0 and at most about 6.0.

摘要翻译： 半导体封装树脂组合物包括固化剂和具有多个缩水甘油醚基团的化合物（A）。 当在约175℃的测量温度和约100Hz的测量频率的条件下测量树脂组合物的离子粘度时，在测量起始点的约5秒或更长时间和约40秒内出现最小离子粘度 。 最小离子粘度为至少约4.0和至多约7.0。 离子粘度的最大斜率出现在测量起点约10秒或更长时间和约60秒内。 最大斜率为至少约2.0，最多为6.0。

公开(公告)号：US20110265225A1

公开(公告)日：2011-10-27

申请号：US13124544

申请日：2009-10-16

申请人： Takeshi Yoshizumi ,  Minami Matsui ,  Tomoko Kuriyama ,  Hirofumi Kuroda ,  Shinya Takahashi ,  Hirohiko Hirochika

发明人： Takeshi Yoshizumi ,  Minami Matsui ,  Tomoko Kuriyama ,  Hirofumi Kuroda ,  Shinya Takahashi ,  Hirohiko Hirochika

IPC分类号： C12N15/82 ,  C12N15/63 ,  A01H5/10 ,  A01H5/00 ,  C12N5/10

CPC分类号： C07K14/415 ,  C12N15/8261 ,  Y02A40/146

摘要： The present invention relates to a transgenic plant having increased seed size prepared via introduction of DNA encoding a protein consisting of a specific amino acid sequence derived from a plant, such as rice, and a method for producing the same.

摘要翻译： 本发明涉及通过引入编码由来自植物如水稻的特定氨基酸序列组成的蛋白质的DNA制备的具有增加的种子大小的转基因植物及其制备方法。

公开(公告)号：US20110021665A1

公开(公告)日：2011-01-27

申请号：US12690274

申请日：2010-01-20

申请人： Hirofumi Kuroda

发明人： Hirofumi Kuroda

IPC分类号： C08L63/00

CPC分类号： H01L23/293 ,  C08G59/245 ,  C08G59/621 ,  C08K3/013 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20752

摘要： A resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The resin composition for semiconductor encapsulation includes (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).

摘要翻译： 一种用于半导体封装的树脂组合物，具有优异的耐焊接性和阻燃性并且具有优异的流动性和固化性，以及半导体器件。 用于半导体封装的树脂组合物包括（A）环氧树脂，其包含（a）由式（1）表示的环氧树脂，（B）分子中具有两个或更多个酚羟基的化合物，（C）无机填料， 和（D）固化促进剂：其中R1和R2各自表示氢原子或碳原子数为4以下的烃基，可以相同或不同; 'n'表示0〜5的正数的平均值。 在式（1）中。

公开(公告)号：US20070232728A1

公开(公告)日：2007-10-04

申请号：US11729656

申请日：2007-03-29

申请人： Masashi Endo ,  Hirofumi Kuroda

发明人： Masashi Endo ,  Hirofumi Kuroda

IPC分类号： C08L63/02 ,  C08G59/68

CPC分类号： C08G59/621 ,  C08G59/245 ,  C08G59/30 ,  C08G59/3218 ,  C08G59/3254 ,  H01L23/293 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00

摘要： An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which exhibit high flame resistance, and high soldering resistance after humidified, and has an advantage of low material and production costs.A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1), and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H. for 168 hours:

摘要翻译： 本发明的目的是提供一种表现出高阻燃性，加湿后耐焊接性高的半导体封装用环氧树脂组合物，具有材料成本低廉的优点。 用于半导体封装的树脂组合物含有环氧树脂（A）; 含有两个或多个酚羟基的酚类化合物（B）; 无机填料（C）; 和固化促进剂（D）。 环氧树脂（A）含有由式（1）表示的环氧树脂（a1），当组合物在85℃和85％RH下变湿时，树脂组合物的吸湿率为0.22重量％以下 168小时：

公开(公告)号：US06313303B1

公开(公告)日：2001-11-06

申请号：US09462180

申请日：2000-01-03

申请人： Katsuya Tagami ,  Nobuo Niikawa ,  Akio Kayano ,  Hirofumi Kuroda

发明人： Katsuya Tagami ,  Nobuo Niikawa ,  Akio Kayano ,  Hirofumi Kuroda

IPC分类号： C07D40100

CPC分类号： C07D401/12

摘要： Processes for preparing sulfoxides useful as drugs such as acid secretion inhibitors or antiulcer drugs or intermediates for the preparation of drugs in high yields, at high purities, and with safety. Specifically, a process for the preparation of sulfoxides (II) by oxidizing a thio ether (I) with a peroxoborate salt in the presence of an acid anhydride or a metal catalyst; and a process for the preparation of sulfoxides (II) by oxidizing a thio ether (I) with an N-halosuccinimide, 1,3-dihalo-5,5-dimethyl-hydantoin or dichloroisocyanuric acid salt in the presence of a base. In said formulae R1 is hydrogen, methoxy or difluoromethoxy; R2 is methyl or methoxy; R3 is 3-methoxypropoxy, methoxy or 2,2,2-trifluoroethoxy; and R4 is hydrogen or methyl

摘要翻译： 用于制备用作药物的亚砜的方法，例如酸分泌抑制剂或抗溃疡药物或用于以高产率，高纯度和安全性制备药物的中间体。 具体地说，在酸酐或金属催化剂存在下，用过氧硼酸盐氧化硫醚（I），制备亚砜（Ⅱ）的方法; 和通过在碱存在下用N-卤代琥珀酰亚胺，1,3-二卤代-5,5-二甲基 - 乙内酰脲或二氯异氰脲酸盐氧化硫醚（I）来制备亚砜（II）的方法。 在所述式中，R 1是氢，甲氧基或二氟甲氧基; R2是甲基或甲氧基; R3是3-甲氧基丙氧基，甲氧基或2,2,2-三氟乙氧基; R4为氢或甲基