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    E-BEAM DEFECT REVIEW SYSTEM
    1.
    发明申请
    E-BEAM DEFECT REVIEW SYSTEM 有权
    电子束缺陷评估系统

    公开(公告)号：US20100150429A1

    公开(公告)日：2010-06-17

    申请号：US12335458

    申请日：2008-12-15

    申请人： Jack JAU ,  Zhongwei CHEN ,  Yi Xiang WANG ,  Chung-Shih PAN ,  Joe WANG ,  Xuedong LIU ,  Weiming REN ,  Wei FANG

    发明人： Jack JAU ,  Zhongwei CHEN ,  Yi Xiang WANG ,  Chung-Shih PAN ,  Joe WANG ,  Xuedong LIU ,  Weiming REN ,  Wei FANG

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N23/04 ,  G01N2223/102 ,  G01N2223/426 ,  G01N2223/611 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： The present invention relates to a defect review system, and/or particularly, to an apparatus and method of defect review sampling, review method and classification on a semiconductor wafer or a pattern lithography reticle during integrated circuit fabrication. These objects are achieved in comparing a reviewed image with a reference image pick-up through a smart sampling filter. A clustering computer system base on high speed network will provide data cache and save operation time and memory. A smart review sampling filter automatically relocate abnormal pattern or defects and classify the device location extracted from design database and/or from golden die image on the same substrate. The column of the present defect review system is comprised of the modified SORIL type objective lens. This column provides solution of improving throughput during sample review, material identification better image quality, and topography image of defect. One embodiment of the present invent adopts an optical auto focusing system to compromise micro height variation due wafer surface topography. And another embodiment adopts surface charge control system to regulate the charge accumulation due to electron irradiation during the review process.

    摘要翻译： 本发明涉及一种缺陷评估系统，和/或特别涉及在集成电路制造期间对半导体晶片或图案光刻掩模版进行缺陷评估抽样，评估方法和分类的装置和方法。 通过智能采样滤波器将经检查的图像与参考图像拾取进行比较，实现了这些目的。 基于高速网络的集群计算机系统将提供数据缓存，节省操作时间和内存。 智能检查采样过滤器自动重新定位异常模式或缺陷，并将从设计数据库中提取的设备位置和/或从相同基板上的金色模具图像分类。 本缺陷检查系统的列由改进的SORIL型物镜组成。 该栏提供了在样本审查期间提高吞吐量，材料识别更好的图像质量和缺陷的地形图像的解决方案。 本发明的一个实施例采用光学自动聚焦系统来破坏由晶片表面形貌引起的微高度变化。 另一个实施例采用表面电荷控制系统来调节在检查过程中由电子辐射引起的电荷累积。

    E-beam defect review system
    4.
    发明授权
    E-beam defect review system 有权
    电子束缺陷检查系统

    公开(公告)号：US08094924B2

    公开(公告)日：2012-01-10

    申请号：US12335458

    申请日：2008-12-15

    申请人： Jack Jau ,  Zhongwei Chen ,  Yi Xiang Wang ,  Chung-Shih Pan ,  Joe Wang ,  Xuedong Liu ,  Weiming Ren ,  Wei Fang

    发明人： Jack Jau ,  Zhongwei Chen ,  Yi Xiang Wang ,  Chung-Shih Pan ,  Joe Wang ,  Xuedong Liu ,  Weiming Ren ,  Wei Fang

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N23/04 ,  G01N2223/102 ,  G01N2223/426 ,  G01N2223/611 ,  G06T2207/10061 ,  G06T2207/30148

    摘要： An apparatus comprises an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column. The modified SORIL column includes a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus; and a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam. The modified SORIL column further includes a storage unit for storing wafer design database; and a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.

    摘要翻译： 一种装置包括成像单元以对待审查的晶片进行成像，其中成像单元是经修改的SORIL柱。 改进的SORIL柱包括由于晶片表面拓扑而进行微聚焦的聚焦子系统，其中聚焦子系统验证从晶片表面反射的光栅图像的位置以调整焦点; 以及表面电荷控制，用于调节在复查过程期间由于电子辐射引起的电荷累积，其中气体分子在洪水枪光束下而不是在主光束下方注入。 改进的SORIL列还包括用于存储晶片设计数据库的存储单元; 以及用于管理缺陷定位，缺陷采样和缺陷分类的主计算机，其中主计算机和存储单元通过高速网络链接。