Plasma etching apparatus
    2.
    发明申请
    Plasma etching apparatus 审中-公开
    等离子刻蚀装置

    公开(公告)号:US20050022934A1

    公开(公告)日:2005-02-03

    申请号:US10823547

    申请日:2004-04-14

    CPC分类号: H01J37/32082 H01J37/32541

    摘要: A plasma etching apparatus having an upper electrode, a lower electrode corresponding to the upper electrode, to place a substrate on, and a high frequency power generator to generate plasma by applying high frequency power to the upper electrode or the lower electrode, wherein a distance between the upper electrode and the lower electrode varies discontinuously on a portion of opposite surfaces of the electrodes by varying the shape of the upper electrode.

    摘要翻译: 一种等离子体蚀刻装置,其具有上电极,与上电极对应的下电极,以将基板放置在其上,高频发电机通过向上电极或下电极施加高频电力而产生等离子体, 通过改变上电极的形状,在上电极和下电极之间的电极的相对表面的一部分上不连续地变化。

    SUBSTRATE PROCESSING APPARATUS
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号:US20080017317A1

    公开(公告)日:2008-01-24

    申请号:US11735549

    申请日:2007-04-16

    IPC分类号: C23F1/00 C23C16/00

    摘要: A substrate processing apparatus. The substrate processing apparatus includes a vacuum chamber having a reaction space to generate plasma in which a target substrate is located, a low frequency antenna unit located outside the reaction space to generate plasma in the reaction space, a low frequency power supply to apply low frequency power to the low frequency antenna unit, a high frequency antenna unit located outside the reaction space to generate plasma in the reaction space, and a high frequency power supply to apply high frequency power to the high frequency antenna unit. The apparatus allows the ignition of plasma to be performed efficiently via the high frequency antenna unit, and improves efficiency of inductive coupling between plasma and a low frequency antenna via the low frequency antenna unit, thereby improving plasma generation efficiency.

    摘要翻译: 基板处理装置。 基板处理装置包括具有反应空间以产生目标基板的等离子体的真空室,位于反应空间外侧的低频天线单元,用于在反应空间中产生等离子体;低频电源,以施加低频 低频天线单元的功率,位于反应空间外部的高频天线单元,以在反应空间中产生等离子体;以及高频电源,向高频天线单元施加高频功率。 该装置允许通过高频天线单元有效地执行等离子体的点火,并且通过低频天线单元提高等离子体和低频天线之间的电感耦合的效率,从而提高等离子体产生效率。

    Apparatus to treat a substrate
    6.
    发明授权
    Apparatus to treat a substrate 有权
    用于处理基材的装置

    公开(公告)号:US08404080B2

    公开(公告)日:2013-03-26

    申请号:US11417043

    申请日:2006-05-04

    IPC分类号: C23C16/00 H01L21/306

    摘要: An apparatus to treat a substrate includes a processing chamber including a reaction space where a substrate to be treated is placed and a plasma is formed, a ferrite core having a plurality of poles disposed outside the reaction space and a connector facing the reaction space across the plurality of poles and connecting the plurality of the poles each other, a coil winding around the plurality of poles, and an electric power unit supplying electric power to the coil.

    摘要翻译: 处理基板的装置包括处理室,其包括反应空间,其中放置待处理的基板和形成等离子体;铁氧体磁芯,其具有设置在反应空间外侧的多个极和面向反应空间的连接器 多个极并且将多个极彼此连接,围绕多个极的线圈绕组,以及向线圈供电的电力单元。

    Substrate processing apparatus
    7.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US08343309B2

    公开(公告)日:2013-01-01

    申请号:US11735549

    申请日:2007-04-16

    IPC分类号: H01L21/306 C23C16/00

    摘要: A substrate processing apparatus. The substrate processing apparatus includes a vacuum chamber having a reaction space to generate plasma in which a target substrate is located, a low frequency antenna unit located outside the reaction space to generate plasma in the reaction space, a low frequency power supply to apply low frequency power to the low frequency antenna unit, a high frequency antenna unit located outside the reaction space to generate plasma in the reaction space, and a high frequency power supply to apply high frequency power to the high frequency antenna unit. The apparatus allows the ignition of plasma to be performed efficiently via the high frequency antenna unit, and improves efficiency of inductive coupling between plasma and a low frequency antenna via the low frequency antenna unit, thereby improving plasma generation efficiency.

    摘要翻译: 基板处理装置。 基板处理装置包括具有反应空间以产生目标基板的等离子体的真空室,位于反应空间外侧的低频天线单元,用于在反应空间中产生等离子体;低频电源,以施加低频 低频天线单元的功率,位于反应空间外部的高频天线单元,以在反应空间中产生等离子体;以及高频电源,向高频天线单元施加高频功率。 该装置允许通过高频天线单元有效地执行等离子体的点火,并且通过低频天线单元提高等离子体和低频天线之间的电感耦合的效率,从而提高等离子体产生效率。

    Plasma generating apparatus
    10.
    发明授权
    Plasma generating apparatus 有权
    等离子体发生装置

    公开(公告)号:US08169148B2

    公开(公告)日:2012-05-01

    申请号:US12149450

    申请日:2008-05-01

    IPC分类号: H01J7/24

    CPC分类号: H01J37/32165 H01J37/321

    摘要: A plasma generating apparatus having superior plasma generation efficiency that uses a single reaction chamber. The plasma generating apparatus includes a RF generator for providing a RF power, an antenna for generating an electromagnetic field upon receiving the RF power, a reaction chamber for exciting/ionizing a reaction gas via the electromagnetic field, and generating a plasma, and a plasma channel for absorbing the RF power, and allowing a current signal to be induced to the plasma.

    摘要翻译: 一种等离子体发生装置,其具有使用单个反应室的优异的等离子体产生效率。 等离子体发生装置包括:RF发生器,用于提供RF功率;天线,用于在接收到RF功率时产生电磁场;反应室,用于经由电磁场激发/电离反应气体,产生等离子体;以及等离子体 通道,用于吸收RF功率,并允许电流信号被感应到等离子体。