摘要:
A process for improving uniformity across the surface of a substrate during a plasma process such as plasma etching. A conductive plane is formed at the back surface of the substrate. A plasma process is then performed to the front surface of the substrate. The conductive plane may then be removed upon completion of the plasma process and before final processing steps.
摘要:
An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.
摘要:
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.
摘要:
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
摘要:
A process for preparing a ureaform type resin fertilizer as an aqueous suspension which is stable and preferably has an Availability Index of at least 70 which, in a preferred embodiment, comprises: adding urea to an acidic solution of formaldehyde having a pH of 0.25 to 1.75 at a rate of addition to keep the temperature below 98.degree. C. until the mole ratio of formaldehyde to urea is from 3.5:1 to 2.6:1; adjusting the pH of the reaction mixture to between about 5.2 and 6.8 and the temperature from about 75.degree. C. to 92.degree. C. and adding urea until a formaldehyde to urea mole ratio of 0.5:1 to 1.8:1 is attained and the nephelometric turbidity of the reaction mixture is in the range of 200 to 800 NTU units; and then neutralizing the reaction mixture to a basic pH not exceeding about 8.5.
摘要:
In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
摘要:
A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.
摘要:
An exercise and rehabilitation device consisting of a weighted pair of gloves, each glove having a permanently affixed weighted section on the back-hand side of the glove and paired contoured weights which encircle the end of each individual finger and thumb sleeve. The digit sleeves are open ended to expose the individuals fingertips. A hook-and-pile attachment strip on the palm of the glove is operatively associated with a hook-and-pile covered cylindrical weight which can be detachably grasped by the wearer. A weighted wrist support strap detachably secures the glove to the individual's hand.
摘要:
Urea-formaldehyde precursors are produced in a two-stage process. In the first stage, urea is slowly added to an acidic solution of formaldehyde at a pH of 1.0 or less, at a rate that maintains the temperature at 50.degree. C. but not in excess of 98.degree. C. When an F/U mole ratio of 3.25:1 to 2.5:1 has been attained, the pH is adjusted to the basic side, generally from about 7.2 to about 8.0. In the second stage, additional urea is added to the condensate produced in the first stage, to attain an F/U mole ratio of 3.0:1 to 2.5:1. The condensate and precursor have fertilizer applications. The precursor is useful in urea-formaldehyde resin production.
摘要:
In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.