公开(公告)号：US07550319B2

公开(公告)日：2009-06-23

申请号：US11510170

申请日：2006-08-25

申请人： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

发明人： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

摘要翻译： 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。

公开(公告)号：US07808097B2

公开(公告)日：2010-10-05

申请号：US12467604

申请日：2009-07-28

申请人： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

发明人： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC分类号： H01L23/053 ,  H01L31/0232

CPC分类号： H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

摘要翻译： 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。

公开(公告)号：US20090278162A1

公开(公告)日：2009-11-12

申请号：US12467604

申请日：2009-07-28

申请人： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

发明人： Carl B. Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC分类号： H01L33/00 ,  C03C8/14

CPC分类号： H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

摘要翻译： 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。

公开(公告)号：US20090040418A1

公开(公告)日：2009-02-12

申请号：US11891347

申请日：2007-08-10

申请人： Shin-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

发明人： Shin-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC分类号： H01L29/22 ,  G02F1/1335 ,  H01L21/02

CPC分类号： H05K1/053 ,  H01L33/641 ,  H01L2224/48091 ,  H05K2201/0179 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2203/0315 ,  H01L2924/00014

摘要： A LED device of the present invention includes a substrate comprising a Cu and/or Al; a diamond-like carbon layer disposed on the substrate; an electric circuit formed on the diamond-like carbon layer; and a LED chip electrically connected to the electric circuit. The LED can be used as a light source of back light of liquid crystal display.

摘要翻译： 本发明的LED器件包括：包含Cu和/或Al的衬底; 设置在基板上的类金刚石碳层; 形成在类金刚石碳层上的电路; 以及与电路电连接的LED芯片。 LED可用作液晶显示器的背光源。

公开(公告)号：US20070057364A1

公开(公告)日：2007-03-15

申请号：US11510170

申请日：2006-08-25

申请人： Carl Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

发明人： Carl Wang ,  Shih-Ming Kao ,  Yu-Cheng Lin ,  Jaw-Shin Cheng

IPC分类号： H01L23/12

CPC分类号： H01L33/486 ,  C03C8/02 ,  C03C8/10 ,  C04B35/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0306 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.

摘要翻译： 本发明提供了LTCC（低温共烧陶瓷）胶带组合物，并展示了所述LTCC胶带在形成用于各种照明应用的发光二极管（LED）芯片载体和模块中的用途。 本发明还提供了（LTCC）带和LED模块在形成照明装置中的应用，包括但不限于LED装置，高亮度（HB）LED背光，显示器相关光源，汽车照明，装饰 照明，标牌和广告照明，以及信息显示照明。