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公开(公告)号:US08455175B2
公开(公告)日:2013-06-04
申请号:US13094629
申请日:2011-04-26
CPC分类号: G03F7/033 , G03F7/161 , G03F7/162 , H01L24/11 , H01L2224/0345 , H01L2224/03464 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/0106 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
摘要翻译: 提供了适用于在单一涂层应用中沉积厚光致抗蚀剂层的光刻胶组合物和方法。 这样的光致抗蚀剂层特别适用于芯片级封装,例如在金属凸块的形成中。
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公开(公告)号:US20110262861A1
公开(公告)日:2011-10-27
申请号:US13094629
申请日:2011-04-26
IPC分类号: G03F7/004
CPC分类号: G03F7/033 , G03F7/161 , G03F7/162 , H01L24/11 , H01L2224/0345 , H01L2224/03464 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/0106 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
摘要翻译: 提供了适用于在单一涂层应用中沉积厚光致抗蚀剂层的光刻胶组合物和方法。 这样的光致抗蚀剂层特别适用于芯片级封装,例如在金属凸块的形成中。
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公开(公告)号:US07932016B2
公开(公告)日:2011-04-26
申请号:US11594551
申请日:2006-11-08
CPC分类号: G03F7/033 , G03F7/161 , G03F7/162 , H01L24/11 , H01L2224/0345 , H01L2224/03464 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/0106 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.
摘要翻译: 提供了适用于在单一涂层应用中沉积厚光致抗蚀剂层的光刻胶组合物和方法。 这样的光致抗蚀剂层特别适用于芯片级封装,例如在金属凸块的形成中。
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公开(公告)号:US07344970B2
公开(公告)日:2008-03-18
申请号:US10408428
申请日:2003-04-07
IPC分类号: H01L21/44
CPC分类号: G03F7/32 , G03F7/162 , G03F7/405 , H01L2924/0002 , H01L2924/00
摘要: Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
摘要翻译: 提供了适用于在单一涂覆工艺中沉积非常厚的光刻胶层的光刻胶组合物和方法。 这种光致抗蚀剂层特别适用于芯片级封装。
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