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57 条记录 (耗时 0.024 秒)

    Method of sharing usage information, and apparatus and system thereof
    1.
    发明授权
    Method of sharing usage information, and apparatus and system thereof 有权

    公开(公告)号：US09825774B2

    公开(公告)日：2017-11-21

    申请号：US12271266

    申请日：2008-11-14

    申请人： Jung-shin Park ,  Kwang-hyuk Kim ,  Jun-ho Jang ,  Jin-yong Ahn

    发明人： Jung-shin Park ,  Kwang-hyuk Kim ,  Jun-ho Jang ,  Jin-yong Ahn

    IPC分类号： G06F17/30 ,  H04L12/28 ,  H04L29/08

    CPC分类号： H04L12/2825 ,  G06F17/30038 ,  H04L67/125 ,  H04L67/22 ,  H04L2012/2849 ,  H04L2012/285

    摘要： Provided are a method, apparatus, and system for sharing usage information of daily life. Usage information sharing system includes: a first home network including at least one electronic device generating metadata with respect to human behavior; a first collecting device collecting metadata with respect to usage information from first home network; a second collecting device transmitting metadata of first home network that is received from the first collecting device to a second home network; and a second home network comprising at least one electronic device receiving the metadata from the second collecting device and performing an operation corresponding to the metadata. Accordingly, behavioral actions of a person in daily life can be dynamically recognized via a home network and home electronic devices and converted into metadata, and transmitted to another home network in real-time via a network. Thus, the experiences and feelings of a user can be dynamically shared.

    Method and apparatus for storing broadcast program
    2.
    发明授权
    Method and apparatus for storing broadcast program 有权
    用于存储广播节目的方法和装置

    公开(公告)号：US08739211B2

    公开(公告)日：2014-05-27

    申请号：US13292936

    申请日：2011-11-09

    申请人： Jin-yong Ahn ,  Soo-kang Bae ,  Jung-min Kang ,  Du-il Kim

    发明人： Jin-yong Ahn ,  Soo-kang Bae ,  Jung-min Kang ,  Du-il Kim

    IPC分类号： G06F3/00 ,  G06F13/00 ,  H04N5/445

    CPC分类号： H04N21/4147 ,  G11B27/329 ,  H04N5/781 ,  H04N5/907 ,  H04N9/8042 ,  H04N9/8205 ,  H04N21/4307 ,  H04N21/435 ,  H04N21/47217

    摘要： A method and apparatus for storing a broadcast program are provided. The apparatus includes: a signal processing unit which generates an audio/video (A/V) file, an application file, and a first electronic program guide (EPG) file by appropriately processing a plurality of A/V signals, application information, and EPG information, respectively, which are included in an input broadcast program transport stream; a synchronization unit which receives the A/V file, the application file, and the first EPG file from the signal processing unit, generates storage information for the A/V file and storage information for the application file, and converts the first EPG file into a second EPG file comprising the storage information for the A/V file and the storage information for the application file; and a storage unit which stores the A/V file, the application file, and the second EPG file.

    摘要翻译： 提供一种用于存储广播节目的方法和装置。 该装置包括：信号处理单元，通过适当地处理多个A / V信号，应用信息和/或数据，生成音频/视频（A / V）文件，应用文件和第一电子节目指南（EPG） 分别包括在输入广播节目传输流中的EPG信息; 从信号处理单元接收A / V文件，应用文件和第一EPG文件的同步单元生成用于A / V文件的存储信息和应用文件的存储信息，并将第一EPG文件转换为 包括用于A / V文件的存储信息和应用文件的存储信息的第二EPG文件; 以及存储单元，其存储A / V文件，应用文件和第二EPG文件。

    Method and apparatus for storing broadcast program
    3.
    发明授权
    Method and apparatus for storing broadcast program 有权
    用于存储广播节目的方法和装置

    公开(公告)号：US08091104B2

    公开(公告)日：2012-01-03

    申请号：US11443172

    申请日：2006-05-31

    申请人： Jin-Yong Ahn ,  Soo-Kang Bae ,  Jung-Min Kang ,  Du-il Kim

    发明人： Jin-Yong Ahn ,  Soo-Kang Bae ,  Jung-Min Kang ,  Du-il Kim

    IPC分类号： G06F3/00 ,  G06F13/00 ,  H04N5/445

    CPC分类号： H04N21/4147 ,  G11B27/329 ,  H04N5/781 ,  H04N5/907 ,  H04N9/8042 ,  H04N9/8205 ,  H04N21/4307 ,  H04N21/435 ,  H04N21/47217

    摘要： A method and apparatus for storing a broadcast program are provided. The apparatus includes: a signal processing unit which generates an audio/video (A/V) file, an application file, and a first electronic program guide (EPG) file by appropriately processing a plurality of A/V signals, application information, and EPG information, respectively, which are included in an input broadcast program transport stream; a synchronization unit which receives the A/V file, the application file, and the first EPG file from the signal processing unit, generates storage information for the A/V file and storage information for the application file, and converts the first EPG file into a second EPG file comprising the storage information for the A/V file and the storage information for the application file; and a storage unit which stores the A/V file, the application file, and the second EPG file.

    摘要翻译： 提供一种用于存储广播节目的方法和装置。 该装置包括：信号处理单元，通过适当地处理多个A / V信号，应用信息和/或数据，生成音频/视频（A / V）文件，应用文件和第一电子节目指南（EPG） 分别包括在输入广播节目传输流中的EPG信息; 从信号处理单元接收A / V文件，应用文件和第一EPG文件的同步单元生成用于A / V文件的存储信息和应用文件的存储信息，并将第一EPG文件转换为 包括用于A / V文件的存储信息和应用文件的存储信息的第二EPG文件; 以及存储单元，其存储A / V文件，应用文件和第二EPG文件。

    Mounting substrate and manufacturing method thereof
    4.
    发明授权
    Mounting substrate and manufacturing method thereof 有权
    安装基板及其制造方法

    公开(公告)号：US08022553B2

    公开(公告)日：2011-09-20

    申请号：US12155555

    申请日：2008-06-05

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01L23/48

    CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

    摘要： A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

    摘要翻译： 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。

    PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME 审中-公开
    具有BUMP的印刷电路板及其制造方法

    公开(公告)号：US20110048786A1

    公开(公告)日：2011-03-03

    申请号：US12870137

    申请日：2010-08-27

    申请人： Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

    发明人： Suk Hyeon Cho ,  Jin Yong Ahn ,  Soon Oh Jung ,  Dong Ju Jeon ,  Ki Hwan Kim ,  Byung Moon Kim

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/4015 ,  H05K3/007 ,  H05K3/20 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2203/0338 ,  Y10T29/49155

    摘要： Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.

    摘要翻译： 这里公开了具有凹凸的印刷电路板及其制造方法。 具有凸块的印刷电路板包括绝缘层，内部电路层被浸渍到该绝缘层中; 形成在所述绝缘层之下并具有暴露所述内部电路层的焊盘单元的开口的保护层; 以及与所述垫单元一体形成并从所述保护层的内侧通过所述开口突出到所述保护层的外侧的凸块。 凸块与焊盘单元一体地形成，从而提高凸块和印刷电路板之间的接合强度，并且凸块的表面积形成为宽，从而提高焊球和印刷电路板之间的接合强度。

    Mounting substrate and manufacturing method thereof
    10.
    发明申请
    Mounting substrate and manufacturing method thereof 有权
    安装基板及其制造方法

    公开(公告)号：US20080315431A1

    公开(公告)日：2008-12-25

    申请号：US12155555

    申请日：2008-06-05

    申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K1/113 ,  H01L23/13 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09472 ,  H01L2224/0401

    摘要： A mounting substrate and a method of manufacturing the mounting substrate. The mounting substrate can include an insulation layer, a bonding pad buried in one side of the insulation layer in correspondence with a mounting position of a chip, and a circuit pattern electrically connected to the bonding pad. By utilizing certain embodiments of the invention, the process for stacking a solder resist layer can be omitted, as the bonding pads can be implemented in a form recessed from the surface of the insulation layer. In this way, the manufacturing process can be simplified and manufacturing costs can be reduced. Since the surface of the mounting-substrate on which to mount a chip can be kept flat without any protuberances, the occurrence of voids in the underfill can be minimized. This is correlated to obtaining a high degree of reliability, and leads to a greater likelihood of successful mounting.

    摘要翻译： 一种安装基板及其制造方法。 安装基板可以包括绝缘层，与绝缘层的一侧相对应于芯片的安装位置的接合焊盘以及电连接到焊盘的电路图案。 通过利用本发明的某些实施例，可以省略堆叠阻焊层的工艺，因为焊盘可以以从绝缘层的表面凹陷的形式来实施。 以这种方式，可以简化制造过程，并且可以降低制造成本。 由于安装芯片的安装基板的表面可以保持平坦而没有任何突起，所以可以使底部填充物中的空隙的发生最小化。 这与获得高可靠性相关，并且导致成功安装的可能性更大。