Removal of coating from periphery of a semiconductor wafer
    1.
    发明授权
    Removal of coating from periphery of a semiconductor wafer 失效
    从半导体晶片周边去除涂层

    公开(公告)号:US4510176A

    公开(公告)日:1985-04-09

    申请号:US535916

    申请日:1983-09-26

    CPC分类号: B05D1/42 B05C11/06 G03F7/162

    摘要: The specification describes techniques for removing the edge bead region from a coated semiconductor wafer by directing a jet of solvent at the wafer periphery while the wafer is spinning. The flow patterns of debris resulting from this removal are controlled to prevent contamination of the chip sites on the wafer.

    摘要翻译: 本说明书描述了通过在晶片旋转时在晶片周边引导溶剂射流来从涂覆的半导体晶片去除边缘焊道区域的技术。 控制由该去除产生的碎片的流动模式,以防止晶片上芯片位置的污染。