公开(公告)号：US20070154631A1

公开(公告)日：2007-07-05

申请号：US11684679

申请日：2007-03-12

Applicant: Krishna Sachdev ,  Michael Berger ,  Gregg Monjeau ,  Robert Rita ,  Kathleen Wiley

Inventor： Krishna Sachdev ,  Michael Berger ,  Gregg Monjeau ,  Robert Rita ,  Kathleen Wiley

IPC: B05D3/00 ,  B05D3/02

CPC classification number: H05K3/386 ,  C03C17/32 ,  C04B41/009 ,  C04B41/488 ,  C04B41/83 ,  C04B2111/00844 ,  C08G73/10 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1067 ,  C08G73/1075 ,  H01L21/4807 ,  H05K1/0306 ,  H05K3/225 ,  H05K2201/0154 ,  C04B41/455 ,  C04B35/00

Abstract: A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

Abstract translation: 公开了一种修复陶瓷基板的方法，该方法具有高热稳定性，耐焊剂和焊剂残留物清洗溶剂和工艺的良好的机械性能，对所有接触表面的良好粘合性，具有低吸湿性和良好的流动性能，适用于 修复切屑陶瓷，填充深沟或通孔，并用自动化工艺写入钝化线聚酰亚胺聚合物是通过使化学计量偏移的芳族二酐和芳族二胺单体反应制得的，并在反应完成时封端所得聚合物。 使用摩尔过量的二胺制成优选的聚酰亚胺，其使用酸酐封端。

公开(公告)号：US20050176255A1

公开(公告)日：2005-08-11

申请号：US11099161

申请日：2005-04-05

Applicant: Jon Casey ,  James Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David Long ,  Lori Maiorino ,  Arthur Merryman ,  Glenn Pomerantz ,  Robert Rita ,  Krystyna Semkow ,  Patrick Spencer ,  Brian Sundlof ,  Richard Surprenant ,  Donald Wall ,  Thomas Wassick ,  Kathleen Wiley

Inventor： Jon Casey ,  James Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David Long ,  Lori Maiorino ,  Arthur Merryman ,  Glenn Pomerantz ,  Robert Rita ,  Krystyna Semkow ,  Patrick Spencer ,  Brian Sundlof ,  Richard Surprenant ,  Donald Wall ,  Thomas Wassick ,  Kathleen Wiley

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22 ,  H01L21/311 ,  H01L21/00 ,  H01L21/302 ,  H01L21/461 ,  H01L29/745 ,  H01L29/76

CPC classification number: H05K3/225 ,  H01L21/4846 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4629 ,  H05K2203/173 ,  Y10T29/49124 ,  Y10T29/49135 ,  H01L2924/00

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.