公开(公告)号：US20060243700A1

公开(公告)日：2006-11-02

申请号：US10908126

申请日：2005-04-28

Applicant: Robert Rippstein ,  Harry Cox ,  James Kuss ,  Hsichang Liu ,  Vincent LoVerso ,  Krystyna Semkow

Inventor： Robert Rippstein ,  Harry Cox ,  James Kuss ,  Hsichang Liu ,  Vincent LoVerso ,  Krystyna Semkow

IPC: B44C1/22

CPC classification number: H05K3/1225 ,  H05K3/062

Abstract: A copper core used in electroformed metal (EFM) masks is replaced with a copper/molybdenum/copper clad core (Cu/Mo/Cu). The copper cladding on the molybdenum enhances adhesion of electroplated nickel. The nickel is electro-deposited through a patterned resist template onto the copper clad molybdenum surface. The copper and molybdenum are etched by selective etchants that do not attack other non-etched layers, leaving a patterned nickel stencil on a high-strength supporting base.

Abstract translation: 用于电铸金属（EFM）掩模的铜芯被铜/钼/铜包芯（Cu / Mo / Cu）替代。 钼上的铜包层增强了电镀镍的附着力。 镍通过图案化的抗蚀剂模板电沉积到铜包覆钼表面上。 铜和钼通过不侵蚀其它未蚀刻层的选择性蚀刻剂进行蚀刻，在高强度支撑基底上留下图案化的镍网板。

公开(公告)号：US20050167284A1

公开(公告)日：2005-08-04

申请号：US10769610

申请日：2004-01-30

Applicant: Ajay Giri ,  Stephanie Kiefer ,  Patrice Raynaud ,  Krystyna Semkow

Inventor： Ajay Giri ,  Stephanie Kiefer ,  Patrice Raynaud ,  Krystyna Semkow

IPC: C25C7/00 ,  C25D17/00 ,  C25F1/00 ,  G03F7/42 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24

CPC classification number: G03F7/423 ,  C25F1/00 ,  H05K3/0073 ,  H05K3/108 ,  H05K3/243 ,  H05K2203/0264 ,  H05K2203/087 ,  H05K2203/105

Abstract: Photoresist stripping is performed by having a piecepart with a conductive layer that patterned by the photoresist immersed in a neutral solution. A voltage potential is applied to induce a current between the conductive layer and a counter electrode in neutral solution bath at a specified current density. After a short period of time, on the order of minutes, the photoresist is lifted off the piecepart. The piecepart is then removed from the bath, rinsed and dried.

Abstract translation: 通过使具有通过浸渍在中性溶液中的光致抗蚀剂图案化的导电层的片段来进行光阻剥离。 施加电压电位以在中性溶液浴中以指定的电流密度诱导导电层和对电极之间的电流。 经过很短的时间，大约数分钟，光刻胶就被提走了。 然后将该片从浴中取出，漂洗并干燥。

公开(公告)号：US20080070057A1

公开(公告)日：2008-03-20

申请号：US11865170

申请日：2007-10-01

Applicant: Harry Cox ,  Hsichang Liu ,  Nike Medahunsi ,  Krystyna Semkow

Inventor： Harry Cox ,  Hsichang Liu ,  Nike Medahunsi ,  Krystyna Semkow

IPC: B32B3/10 ,  B32B15/20

CPC classification number: C25D5/022 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  H01L21/4867 ,  H05K3/1225 ,  H05K3/245 ,  H05K2201/09736 ,  Y10T428/12063 ,  Y10T428/12361 ,  Y10T428/12486 ,  Y10T428/1291

Abstract: A structure. The structure includes a layered configuration including a copper layer, a first layer, and a second layer. The first and second layers are disposed on opposite sides of the copper layer and are in direct mechanical contact with the copper layer. The first and second layers each include a same alloy of nickel and a metal consisting of cobalt, iron, copper, manganese, or molybdenum. A first region in the first layer extends completely through the first layer. A second region in the second layer extends completely through the second layer. A third region in the first layer extends completely through the first layer. The third region does not extend into any portion of the second layer. The first, second region, and third regions each include a photoresist or an opening such that photoresist or opening extends completely through the first, second, and first layer, respectively.

Abstract translation: 一个结构。 该结构包括包括铜层，第一层和第二层的层状构造。 第一层和第二层设置在铜层的相对侧上，并与铜层直接机械接触。 第一层和第二层各自包括镍和由钴，铁，铜，锰或钼组成的金属的相同合金。 第一层中的第一区域完全延伸穿过第一层。 第二层中的第二区域完全延伸穿过第二层。 第一层中的第三区域完全延伸穿过第一层。 第三区域不延伸到第二层的任何部分。 第一，第二区域和第三区域各自包括光致抗蚀剂或开口，使得光致抗蚀剂或开口分别完全延伸穿过第一层，第二层和第一层。

公开(公告)号：US20060269770A1

公开(公告)日：2006-11-30

申请号：US10908883

申请日：2005-05-31

Applicant: Harry Cox ,  Hsichang Liu ,  Nike Medahunsi ,  Krystyna Semkow

Inventor： Harry Cox ,  Hsichang Liu ,  Nike Medahunsi ,  Krystyna Semkow

IPC: B32B15/02 ,  C22C32/00 ,  B32B15/20 ,  C25D5/02 ,  B22F7/04

CPC classification number: C25D5/022 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  H01L21/4867 ,  H05K3/1225 ,  H05K3/245 ,  H05K2201/09736 ,  Y10T428/12063 ,  Y10T428/12361 ,  Y10T428/12486 ,  Y10T428/1291

Abstract: A structure and associated methods of formation. The structure includes a layered configuration comprising a copper layer, a first layer, and a second layer. The copper layer consists essentially of copper. The first and second layers are disposed on opposite sides of the copper layer and are in direct mechanical contact with the copper layer. The first and second layers each consist essentially of a same alloy of nickel and cobalt having a weight percent concentration of cobalt in a range of 3% to 21%. A through hole in the layered configuration extends completely through the first layer, the copper layer, and the second layer, wherein a first opening in the layered configuration extends completely through the first layer and does not extend into any portion of the second layer.

Abstract translation: 一种结构和相关的形成方法。 该结构包括包括铜层，第一层和第二层的分层结构。 铜层基本上由铜组成。 第一层和第二层设置在铜层的相对侧上，并与铜层直接机械接触。 第一层和第二层各自主要由镍和钴的相同合金组成，钴的重量百分比浓度在3％至21％的范围内。 分层结构中的通孔完全延伸穿过第一层，铜层和第二层，其中分层结构中的第一开口完全延伸穿过第一层，并且不延伸到第二层的任何部分。

公开(公告)号：US20060157085A1

公开(公告)日：2006-07-20

申请号：US10905712

申请日：2005-01-18

Applicant: John Harmuth ,  Lester Herron ,  Krystyna Semkow

Inventor： John Harmuth ,  Lester Herron ,  Krystyna Semkow

IPC: B08B3/00 ,  B05D5/00

CPC classification number: H01L21/4867 ,  B08B3/022 ,  H05K1/0306 ,  H05K3/1216 ,  H05K3/26 ,  H05K2203/0165 ,  H05K2203/104

Abstract: A screening nest, method of screening green sheets and cleaning the mask and a mask cleaning station. The screening nest includes an electromagnet that clamps the mask to a green sheet on the nest during screening. The mask may be electromagnetically dampened during application and removal. The cleaning station electromagnetically dampens the mask during cleaning and especially during rinsing and drying.

Abstract translation: 筛选巢，筛选生菜和清洁面膜的方法和面膜清洁站。 筛选巢包括在屏蔽期间将面罩夹在嵌套上的生片上的电磁体。 掩模在施加和移除过程中可能被电磁阻尼。 清洁站在清洁期间电磁阻尼面罩，特别是在冲洗和干燥过程中。

公开(公告)号：US20050176255A1

公开(公告)日：2005-08-11

申请号：US11099161

申请日：2005-04-05

Applicant: Jon Casey ,  James Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David Long ,  Lori Maiorino ,  Arthur Merryman ,  Glenn Pomerantz ,  Robert Rita ,  Krystyna Semkow ,  Patrick Spencer ,  Brian Sundlof ,  Richard Surprenant ,  Donald Wall ,  Thomas Wassick ,  Kathleen Wiley

Inventor： Jon Casey ,  James Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David Long ,  Lori Maiorino ,  Arthur Merryman ,  Glenn Pomerantz ,  Robert Rita ,  Krystyna Semkow ,  Patrick Spencer ,  Brian Sundlof ,  Richard Surprenant ,  Donald Wall ,  Thomas Wassick ,  Kathleen Wiley

IPC: H05K3/46 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22 ,  H01L21/311 ,  H01L21/00 ,  H01L21/302 ,  H01L21/461 ,  H01L29/745 ,  H01L29/76

CPC classification number: H05K3/225 ,  H01L21/4846 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4629 ,  H05K2203/173 ,  Y10T29/49124 ,  Y10T29/49135 ,  H01L2924/00

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.