公开(公告)号：US20050176255A1

公开(公告)日：2005-08-11

申请号：US11099161

申请日：2005-04-05

申请人： Jon Casey ,  James Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David Long ,  Lori Maiorino ,  Arthur Merryman ,  Glenn Pomerantz ,  Robert Rita ,  Krystyna Semkow ,  Patrick Spencer ,  Brian Sundlof ,  Richard Surprenant ,  Donald Wall ,  Thomas Wassick ,  Kathleen Wiley

发明人： Jon Casey ,  James Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David Long ,  Lori Maiorino ,  Arthur Merryman ,  Glenn Pomerantz ,  Robert Rita ,  Krystyna Semkow ,  Patrick Spencer ,  Brian Sundlof ,  Richard Surprenant ,  Donald Wall ,  Thomas Wassick ,  Kathleen Wiley

IPC分类号： H05K3/46 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/22 ,  H01L21/311 ,  H01L21/00 ,  H01L21/302 ,  H01L21/461 ,  H01L29/745 ,  H01L29/76

CPC分类号： H05K3/225 ,  H01L21/4846 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4629 ,  H05K2203/173 ,  Y10T29/49124 ,  Y10T29/49135 ,  H01L2924/00

摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

公开(公告)号：US06823585B2

公开(公告)日：2004-11-30

申请号：US10249305

申请日：2003-03-28

申请人： Mark J. LaPlante ,  Jon A. Casey ,  Thomas A. Wassick ,  David C. Long ,  Krystyna W. Semkow ,  Patrick E. Spencer ,  Robert A. Rita ,  Richard F. Indyk ,  Kathleen M. Wiley ,  Brian R. Sundlof ,  James Balz ,  Lori A. Maiorino ,  Donald R. Wall ,  Glenn A. Pomerantz

发明人： Mark J. LaPlante ,  Jon A. Casey ,  Thomas A. Wassick ,  David C. Long ,  Krystyna W. Semkow ,  Patrick E. Spencer ,  Robert A. Rita ,  Richard F. Indyk ,  Kathleen M. Wiley ,  Brian R. Sundlof ,  James Balz ,  Lori A. Maiorino ,  Donald R. Wall ,  Glenn A. Pomerantz

IPC分类号： H01R4300

CPC分类号： H05K3/242 ,  H05K1/0306 ,  H05K3/0035 ,  H05K3/048 ,  H05K3/184 ,  H05K3/225 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49721 ,  Y10T29/49732 ,  Y10T29/49737 ,  Y10T29/49746

摘要： A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.

摘要翻译： 在基板上形成表面电镀金属化的方法和结构。 将两层胶带施加到基材的表面。 通过暴露衬底表面的两层带切割第一路径。 第一路径在衬底的顶表面上连接至少一个导电通孔。 通过暴露第一层胶带的第二层胶带切割第二条路径。 第二路径从第一路径路由到衬底的边缘。种子层沉积在第二层带的表面上，从而在第一路径中形成种子电镀路径，并在第二路径中形成牺牲种子传导路径。 将牺牲种子传导路径连接到衬底边缘处的电镀电位在衬底的表面上产生电镀路径。 去除胶带时，去除牺牲路径。