公开(公告)号：US4751150A

公开(公告)日：1988-06-14

申请号：US38201

申请日：1987-04-14

申请人： Yoshinori Oogita ,  Kazuhiro Nakao

发明人： Yoshinori Oogita ,  Kazuhiro Nakao

IPC分类号： H01M2/10 ,  H01M2/22 ,  H01M2/30 ,  H01M2/34 ,  H01M6/12 ,  H01M6/16

CPC分类号： H01M2/34 ,  H01M6/12 ,  H01M6/16

摘要： A paper battery for connection to terminals protruding in same direction has positive and negative electrode plates joined together by a sealing agent therebetween formed with an insulating sheet. A hole penetrating one of the electrode plates and the insulating sheet to reach the other electrode plate and another hole penetrating the other of the electrode plates to reach the insulating sheet are provided such that not only is the battery connected properly to the terminals when it is inserted correctly but also a short circuit will be avoided even if the paper battery is inserted in upside-down direction.

摘要翻译： 用于连接到沿相同方向突出的端子的纸电池具有通过其间形成有绝缘片的密封剂连接在一起的正极板和负极板。 穿过电极板和绝缘片之一到达另一个电极板的孔，并且穿过另一个电极板以到达绝缘片的另一个孔被设置成使得不仅电池正确地连接到终端， 正确插入，即使将纸电池插入上下方向也能避免短路。

公开(公告)号：US20100289161A1

公开(公告)日：2010-11-18

申请号：US12766630

申请日：2010-04-23

申请人： Daisuke YAMADA ,  Kazuhiro Nakao

发明人： Daisuke YAMADA ,  Kazuhiro Nakao

IPC分类号： B29D11/00 ,  B29C45/02 ,  B29C45/77

CPC分类号： G02B3/0031 ,  B29C37/005 ,  B29D11/00307 ,  B29D11/00951 ,  G02B13/0085

摘要： There is provided a method of manufacturing a shaped article having a plurality of lens sections arranged one-dimensionally or two-dimensionally and a substrate section connecting the lens sections, the lens sections and the substrate section being integrally made of a resin material. The resin material is cured between a transfer surface of a first mold, which is fit to one side surface of the shaped article, and a transfer surface of a second mold which is fit to an opposite side surface of the shaped article. A space between the transfer surface of the first mold and the transfer surface of the second mold is narrowed in accordance with contraction of the resin material caused by the curing, and the transfer surface of the first mold and the transfer surface of the second mold are kept in tight contact with the resin material.

摘要翻译： 提供了一种制造具有一维或二维布置的多个透镜部分的成形制品的方法，以及将透镜部分，透镜部分和基片部分连接成一体地由树脂材料制成的基片部分。 树脂材料在与成形制品的一个侧表面配合的第一模具的转印表面和与成形制品的相对侧表面配合的第二模具的转印表面之间固化。 第一模具的转印面和第二模具的转印面之间的空间根据由固化引起的树脂材料的收缩而变窄，第一模具的转印面和第二模具的转印面为 保持与树脂材料的紧密接触。

公开(公告)号：US4762983A

公开(公告)日：1988-08-09

申请号：US783465

申请日：1985-10-03

申请人： Yoshinori Oogita ,  Katsuhide Shino ,  Kazuhiro Nakao ,  Kazuhito Ozawa ,  Shigeki Komaki

发明人： Yoshinori Oogita ,  Katsuhide Shino ,  Kazuhiro Nakao ,  Kazuhito Ozawa ,  Shigeki Komaki

IPC分类号： G06F15/02 ,  H01H13/702 ,  H05K5/00 ,  H05K5/02 ,  G06C5/02

CPC分类号： H01H13/702 ,  H05K5/0017 ,  H01H2227/01 ,  H01H2229/028 ,  H01H2229/03 ,  H01H2231/05 ,  Y10T428/2826

摘要： An electronic apparatus comprising a plurality of assembly elements and a heat-sensitive adhesive synthetic resin film tape inserted between the plurality of assembly elements and the heat adhesive synthetic resin tape to integrally bond the elements together into a composite structure which is thin in size and sufficiently elastic to resist bending and twisting.

摘要翻译： 一种电子设备，包括多个组装元件和插入在所述多个组件之间的热敏粘合剂合成树脂薄膜带和所述热粘合成树脂带，以将所述元件一体地结合在一起，形成为尺寸小且足够的复合结构 弹性抵抗弯曲和扭曲。

公开(公告)号：US4758689A

公开(公告)日：1988-07-19

申请号：US893935

申请日：1986-08-06

申请人： Kazuhiro Nakao ,  Yoshinori Oogita ,  Shigeki Komaki ,  Kazuhito Ozawa ,  Katsuhide Shino

发明人： Kazuhiro Nakao ,  Yoshinori Oogita ,  Shigeki Komaki ,  Kazuhito Ozawa ,  Katsuhide Shino

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K5/06 ,  H05K13/04

CPC分类号： G06K19/07745 ,  H01L2924/0002

摘要： A card-type thin electronic device in which the upper and lower panels are bonded to flanges projecting from a side-wall forming frame between the two panels, while a number of grooves are formed by a half-etching process on the surfaces of both panels bonded against the side-wall forming frame.

摘要翻译： 一种卡式薄型电子设备，其中上和下面板结合到从两个面板之间的侧壁形成框架突出的凸缘，同时通过半蚀刻工艺在两个面板的表面上形成多个凹槽 粘合在侧壁形成框架上。

公开(公告)号：US4744850A

公开(公告)日：1988-05-17

申请号：US805420

申请日：1985-12-09

申请人： Yoshitugu Imano ,  Kazuhito Ozawa ,  Yoshitomo Kitanishi ,  Katsuhide Shino ,  Yukihiro Inoue ,  Yoshinori Oogita ,  Kazuhiro Nakao ,  Shigeki Komaki

发明人： Yoshitugu Imano ,  Kazuhito Ozawa ,  Yoshitomo Kitanishi ,  Katsuhide Shino ,  Yukihiro Inoue ,  Yoshinori Oogita ,  Kazuhiro Nakao ,  Shigeki Komaki

IPC分类号： H05K3/32 ,  H01B1/22 ,  H01L21/60 ,  H01L23/482 ,  B29C65/02 ,  B29C65/30 ,  B29C65/48 ,  B29C65/54

CPC分类号： H01L23/4828 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  Y10T156/1062 ,  Y10T156/1077 ,  Y10T156/1089

摘要： A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.

摘要翻译： 一种用于在具有电极的布线基底上结合具有端子的LSI芯片的方法，包括以下步骤：在形成多个LSI芯片的晶片的表面上涂布热敏粘合剂，在其上撒上导电颗粒，掺杂导电颗粒， 将要分割成每个LSI芯片的晶片划片，将LSI芯片的每个端子和布线基板的每个电极面对面地定位，并将LSI芯片接合在布线基板上。

公开(公告)号：US4666254A

公开(公告)日：1987-05-19

申请号：US695288

申请日：1985-01-28

申请人： Yoshiro Itoh ,  Yoshinori Oogita ,  Shigeki Komaki ,  Kazuhiro Nakao

发明人： Yoshiro Itoh ,  Yoshinori Oogita ,  Shigeki Komaki ,  Kazuhiro Nakao

IPC分类号： G09F9/00 ,  G02F1/13 ,  G02F1/1335 ,  G02F1/1345

CPC分类号： G02F1/133308 ,  G02F1/133553

摘要： A liquid crystal display panel to electrically and mechanically be connected to a substrate of an electronic apparatus comprises a liquid crystal display, a terminal connection member, and a metal plate such as a stainless. The terminal connection member is provided for electrically and mechanically coupling the liquid crystal display with the substrate of the electronic apparatus at a terminal connection portion. The metal plate is positioned at the terminal connection portion to shield a hard and fragile substrate of the liquid crystal display.

摘要翻译： 电气和机械地连接到电子设备的基板的液晶显示面板包括液晶显示器，端子连接构件和诸如不锈钢的金属板。 端子连接部件用于在端子连接部分处将液晶显示器与电子设备的基板电连接和机械耦合。 金属板位于端子连接部分处以屏蔽液晶显示器的硬且易碎的基板。

公开(公告)号：US20100290123A1

公开(公告)日：2010-11-18

申请号：US12766685

申请日：2010-04-23

申请人： Daisuke YAMADA ,  Kazuhiro Nakao

发明人： Daisuke YAMADA ,  Kazuhiro Nakao

IPC分类号： G02B27/12 ,  B29D11/00

CPC分类号： G02B3/0031 ,  B29C43/021 ,  B29C2033/0005 ,  B29C2043/3438 ,  B29L2011/0016 ,  G02B3/0056 ,  G02B13/0085 ,  H01L27/14625

摘要： Provided is a wafer level lens array, in which a plurality of lens sections arranged one-dimensionally or two-dimensionally and a substrate section connecting the lens sections are integrally made of a resin material, capable of preventing the substrate section from being deformed. A wafer level lens array includes: a plurality of lens sections that are two-dimensionally arranged; a substrate section that connects the lens sections to each other; and a rib that is disposed on the substrate section and extends along the surface of the substrate section. The lens sections, the substrate section, and the rib are integrally made of a resin material.

摘要翻译： 提供了一种晶片级透镜阵列，其中一维或二维布置的多个透镜部分和连接透镜部分的基板部分由树脂材料整体制成，能够防止基板部分变形。 晶片级透镜阵列包括：二维布置的多个透镜部分; 将透镜部彼此连接的基板部; 以及设置在所述基板部上并沿着所述基板部的表面延伸的肋。 透镜部分，基板部分和肋部由树脂材料一体制成。

公开(公告)号：US20050039946A1

公开(公告)日：2005-02-24

申请号：US10912633

申请日：2004-08-05

申请人： Kazuhiro Nakao

发明人： Kazuhiro Nakao

IPC分类号： H05K1/11 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K9/00

CPC分类号： H05K1/0218 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/19105 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/0355 ,  H01L2224/81 ,  H01L2924/00014

摘要： An electronic circuit unit includes a circuit substrate having electronic components mounted on the component mounting side thereof, an insulating layer which is layered and crimped onto the component mounting side so as to cover a wiring pattern and electronic components, and a shield layer, made of a metal foil, which is formed on the insulating layer. Since the shield layer conducts with a grounding pattern via columnar conductive sections provided at the four corners, a shield case made of a metal plate is not required. A large number of electronic circuit units is obtained by dividing a large-area laminate, and each columnar conductive section is formed by dividing a through hole filled with a conductive material into four portions. The insulating layer is formed by heat-crimping a semi-cured prepreg material.

摘要翻译： 电子电路单元包括具有安装在其部件安装侧的电子部件的电路基板，层叠并压接在部件安装侧上以覆盖布线图案和电子部件的绝缘层，以及屏蔽层，由 金属箔，其形成在绝缘层上。 由于屏蔽层通过设置在四个角处的柱状导电部分以接地图案传导，所以不需要由金属板制成的屏蔽壳。 通过分割大面积层叠体获得大量的电子电路单元，并且通过将填充有导电材料的通孔分成四部分形成每个柱状导电部分。 绝缘层通过热压缩半固化预浸料材料而形成。

公开(公告)号：US06800862B2

公开(公告)日：2004-10-05

申请号：US10314117

申请日：2002-12-09

申请人： Takao Matsumoto ,  Kohichi Orihira ,  Kazuhiro Nakao ,  Mitsunori Nakamura

发明人： Takao Matsumoto ,  Kohichi Orihira ,  Kazuhiro Nakao ,  Mitsunori Nakamura

IPC分类号： B01D5444

CPC分类号： H01J37/3171 ,  H01J2237/304

摘要： The ion implanting apparatus is provided with a control device which controls the operating state thereof in a period during which ion implantation is not carried out for a substrate in the state in any mode selected from the above (a) twilight mode in which the flow rate of the raw gas supplied to an ion source and the power supplied from a plasma producing power source are reduced to values capable of keeping plasma production in the ion source, (b) magnet-off mode in which in addition to the state in the twilight mode, the outputs from an energy separating magnet power source, scanning magnet power source and beam paralleling magnet power source are stopped, and (c) shut-down mode in which the supply of the raw gas is stopped and the outputs from the power sources are stopped.

摘要翻译： 离子注入装置设置有控制装置，该控制装置在从上述（a）暮光模式中选择的任何模式的状态下对基板进行离子注入的时间段期间控制其操作状态，其中流量 提供给离子源的原料气体和从等离子体产生电源供给的功率被降低到能够在离子源中保持等离子体生成的值，（b）除了暮色状态之外的磁体断开模式 停止从能量分离磁体电源，扫描磁体电源和光束平行磁体电源的输出，以及（c）原料气体的供给停止的停止模式和电源的输出 被停止