公开(公告)号：US20110226513A1

公开(公告)日：2011-09-22

申请号：US13128338

申请日：2009-11-19

申请人： Toshiaki Chuma ,  Masayoshi Kondo ,  Satoshi Tanaka ,  Kenichi Kanemasa

发明人： Toshiaki Chuma ,  Masayoshi Kondo ,  Satoshi Tanaka ,  Kenichi Kanemasa

IPC分类号： H05K1/09 ,  H05K3/00 ,  H05K1/18 ,  H05K1/02

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68336 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10T29/49124 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2924/00

摘要： Disclosed is an electronic component package 100 including a circuit board 10, an electronic component 20, and an adhesive layer 30. The circuit board 10 is provided with an electrically-conductive conductor post 16 which is buried in a base member 12, and a solder layer 18 which is provided at the front end 13 of the conductor post 16 while exposed from a surface 121 of the base member 12. An electrode pad 24 having a metal layer 22 mounted thereon is provided on the main surface 26 of the electronic component 20. The adhesive layer 30 contains a flux activating compound, and bonds the surface 121 of the base member 12 and the main surface 26 of the electronic component 20. Then, the metal layer 22 and the solder layer 18 are metal-bonded.

摘要翻译： 本发明公开了一种电子部件，其包括一个电路板10，电子部件20和粘合层30的电路基板10上设置有导电性导体柱16，其被埋设在基体构件12，和焊料封装100 其在导体柱16的前端部13设置在从基体部件12具有22个安装在其上的金属层的电极焊盘24的表面121露出的层18设置在电子部件20的主表面26上 该粘合剂层30含有焊剂活化化合物，和债券基体部件12和电子部件20的主表面26然后的表面121，该金属层22和焊料层18金属结合。

公开(公告)号：US20110120754A1

公开(公告)日：2011-05-26

申请号：US12674803

申请日：2007-09-13

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

IPC分类号： H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/14 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower.

摘要翻译： 多层布线板包括：刚性部分，其包括具有柔性和表面的第一基底构件，所述第一基底构件具有第一绝缘层和第一导体层，以及第二基底构件，其接合在所述第一和第二基底构件的至少一个表面上 所述第二基底构件具有比所述第一基底构件的刚性更高的刚性，所述第二基底构件具有第二绝缘层和第二导体层; 以及柔性部，其设置成从所述刚性部分连续延伸，所述柔性部分由所述第一基底构件构成，其中在通过基于以下的热机械分析来测量所述第二绝缘层的热膨胀系数的情况下 JIS C 6481在规定的温度下，第二绝缘层的面方向的热膨胀系数为13ppm /℃以下，第二绝缘层的厚度方向的热膨胀系数为20 ppm /℃以下。

公开(公告)号：US08748751B2

公开(公告)日：2014-06-10

申请号：US13128338

申请日：2009-11-19

申请人： Toshiaki Chuma ,  Masayoshi Kondo ,  Satoshi Tanaka ,  Kenichi Kanemasa

发明人： Toshiaki Chuma ,  Masayoshi Kondo ,  Satoshi Tanaka ,  Kenichi Kanemasa

IPC分类号： H05K1/16

CPC分类号： H01L24/16 ,  H01L23/49816 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68336 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/351 ,  Y10T29/49124 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2924/00

摘要： Disclosed is an electronic component package (100) including a circuit board (10), an electronic component (20), and an adhesive layer (30). The circuit board (10) is provided with an electrically-conductive conductor post (16) which is buried in a base member (12), and a solder layer (18) which is provided at the front end (13) of the conductor post (16) while exposed from a surface (121) of the base member (12). An electrode pad (24) having a metal layer (22) mounted thereon is provided on the main surface (26) of the electronic component (20). The adhesive layer (30) contains a flux activating compound, and bonds the surface (121) of the base member (12) and the main surface (26) of the electronic component (20). Then, the metal layer (22) and the solder layer (18) are metal-bonded.

摘要翻译： 公开了一种电子部件封装（100），包括电路板（10），电子部件（20）和粘合剂层（30）。 电路板（10）设置有埋设在基底构件（12）中的导电导体柱（16），以及设置在导体柱的前端（13）处的焊料层（18） （16），同时从所述基底构件（12）的表面（121）暴露。 在电子部件（20）的主表面（26）上设置有安装有金属层（22）的电极焊盘（24）。 粘合剂层（30）含有助焊剂活化化合物，并与基体（12）的表面（121）和电子部件（20）的主表面（26）结合。 然后，金属层（22）和焊料层（18）金属结合。

公开(公告)号：US20110270229A1

公开(公告)日：2011-11-03

申请号：US13142390

申请日：2009-12-24

申请人： Hayao Tanaka ,  Kenichi Kanemasa ,  Yoichi Sakata

发明人： Hayao Tanaka ,  Kenichi Kanemasa ,  Yoichi Sakata

IPC分类号： A61M25/00

CPC分类号： A61M25/0147 ,  A61B1/0057 ,  A61M25/005 ,  A61M25/0053 ,  A61M25/0141 ,  A61M25/0152 ,  A61M2025/0161

摘要： A catheter (10) has a main lumen (20), and sub-lumens (30) each of which having a diameter smaller than that of the main lumen (20). The plurality of sub-lumens (30) are arranged along a circumference of the main lumen (20) in a discrete manner, and each of the sub-lumens (30) has an operating wire (40), fixed to the distal end section (15) of the catheter (10), laid therethrough in a freely slidable manner. By pulling the operating wire(s) (40) respectively laid through the sub-lumens (30), the distal end section (15) of the catheter (10) may be bent towards the pulled operating wire(s) (40) laid therethrough.

摘要翻译： 导管（10）具有主管腔（20）和子腔（30），每个管腔的直径小于主管腔（20）的直径。 多个子腔（30）以离散的方式沿着主腔（20）的圆周布置，并且每个子腔（30）具有操作线（40），固定到远端部 （10）的导管（15）以可自由滑动的方式穿过其中。 通过拉动分别铺设通过子腔（30）的操作线（40），导管（10）的远端部分（15）可以朝向被铺设的拉动的操作线（40）弯曲 通过。