公开(公告)号：US20110120754A1

公开(公告)日：2011-05-26

申请号：US12674803

申请日：2007-09-13

申请人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

发明人： Masayoshi Kondo ,  Masaaki Kato ,  Toshiaki Chuma ,  Toshio Komiyatani ,  Takahisa Iida ,  Kenichi Kanemasa

IPC分类号： H05K1/02

CPC分类号： H01L23/49833 ,  H01L23/14 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/068 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multilayer wiring board includes: a rigid portion including a first base member having flexibility and surfaces, the first base member having a first insulating layer and a first conductor layer, and a second base member bonded on at least one of the surfaces of the first base member and having rigidity higher than that of the first base member, the second base member having a second insulating layer and a second conductor layer; and a flexible portion provided so as to be continuously extended from the rigid portion, the flexible portion constituted from the first base member, wherein in the case where a coefficient of thermal expansion of the second insulating layer is measured by a thermal mechanical analysis based on JIS C 6481 at a predetermined temperature, the coefficient of thermal expansion of the second insulating layer in a plane direction thereof is 13 ppm/° C. or lower and the coefficient of thermal expansion of the second insulating layer in a thickness direction thereof is 20 ppm/° C. or lower.

摘要翻译： 多层布线板包括：刚性部分，其包括具有柔性和表面的第一基底构件，所述第一基底构件具有第一绝缘层和第一导体层，以及第二基底构件，其接合在所述第一和第二基底构件的至少一个表面上 所述第二基底构件具有比所述第一基底构件的刚性更高的刚性，所述第二基底构件具有第二绝缘层和第二导体层; 以及柔性部，其设置成从所述刚性部分连续延伸，所述柔性部分由所述第一基底构件构成，其中在通过基于以下的热机械分析来测量所述第二绝缘层的热膨胀系数的情况下 JIS C 6481在规定的温度下，第二绝缘层的面方向的热膨胀系数为13ppm /℃以下，第二绝缘层的厚度方向的热膨胀系数为20 ppm /℃以下。

公开(公告)号：US08042263B2

公开(公告)日：2011-10-25

申请号：US12160718

申请日：2007-02-08

申请人： Masayoshi Kondo ,  Toshio Komiyatani

发明人： Masayoshi Kondo ,  Toshio Komiyatani

IPC分类号： H01R43/00

CPC分类号： H05K3/4617 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/423 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2203/068 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

摘要： According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.

摘要翻译： 根据本发明，提供了一种制造电路板的方法，其中具有导体柱的第一基板和具有用于接纳导体柱的导体焊盘的第二基板通过层间粘合剂层压，并且导体柱和 电导体焊盘电连接，包括作为第一步骤，在预定的第一条件下通过热压接将导体焊盘与导体柱接合，同时布置第一和第二基板，使得导体焊盘通过层间粘合剂面对导体柱; 在导体焊盘与导体柱接合的同时，在预定的第二条件下热压第一衬底和第二衬底; 以及在所述导体焊盘与所述导体柱接合的同时在预定的第三条件下热压所述第一基板和所述第二基板，其中所述第一，第二和第三条件彼此不同。

公开(公告)号：US20100326712A1

公开(公告)日：2010-12-30

申请号：US12865731

申请日：2009-02-20

申请人： Masayoshi Kondo ,  Toshio Komiyatani

发明人： Masayoshi Kondo ,  Toshio Komiyatani

IPC分类号： H05K1/09 ,  H05K3/36

CPC分类号： H05K3/4635 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4617 ,  H05K2201/0133 ,  H05K2201/09827 ,  Y10T29/49126

摘要： There are provided a circuit board, which has little outflow of an interlayer adhesive to be used for a multilayer lamination while keeping a connection reliability, and a method for manufacturing the circuit board. The circuit board (68) is characterized in that a first substrate (16) having a first base (12) and a conductor post (45) composed of a protrusion (14) projecting from the first base (12) and a metallic cover layer (15) covering the protrusion (14), and a second substrate (18) having a second base (19) and a conductor circuit (17) are laminated and adhered through an interlayer adhesive (13) and are alloyed at a bonding face (43) between the metallic cover layer (15) and the conductor circuit (17), and in that the cross-section, as viewed in the cross-section of the bonding face (43), of the metallic cover layer (15) has a shape which becomes wider from the bonding face (43) of the conductor circuit (17) toward the first substrate (16).

摘要翻译： 提供了一种电路板，其在保持连接可靠性的同时几乎没有用于多层叠层的层间粘合剂的流出，以及制造电路板的方法。 电路板（68）的特征在于，具有第一基座（12）的第一基板（16）和由从第一基座（12）突出的突起（14）构成的导体柱（45）和金属覆盖层 覆盖所述突起（14）的第一基板（15）和具有第二基座（19）和导体电路（17）的第二基板（18）通过层间粘合剂（13）层压并粘合在合金面 金属覆盖层（15）与导体电路（17）之间的截面如图43（b）所示，并且金属覆盖层（15）的接合面（43）的截面所示的横截面为 从导体电路（17）的接合面（43）朝向第一基板（16）变宽的形状。

公开(公告)号：US20110031000A1

公开(公告)日：2011-02-10

申请号：US12922852

申请日：2009-03-24

申请人： Toshio Komiyatani ,  Masayoshi Kondo

发明人： Toshio Komiyatani ,  Masayoshi Kondo

IPC分类号： H05K1/03 ,  C08K5/09 ,  B32B27/38

CPC分类号： H05K1/0326 ,  C08G59/32 ,  C08G59/621 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K3/4617 ,  H05K3/4658 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2203/0733 ,  Y10T428/31511 ,  Y10T428/31529 ,  H01L2924/00

摘要： There is disclosed a resin composition used for forming a resin layer in a sheet-formed carrier material with a resin, comprising a polyfunctional epoxy resin (a) having three or more glycidyl ether groups with an epoxy equivalent of 100 to 300, a compound (b) having one or more carboxyl groups with a melting point of equal to or more than 50 degrees C. and equal to or less than 230 degrees C., and a curing agent (c).

摘要翻译： 公开了一种树脂组合物，用于在具有树脂的片状载体材料中形成树脂层，其包含具有三个或更多个环氧当量为100至300的缩水甘油醚基团的多官能环氧树脂（a），化合物（ b）具有一个或多个熔点等于或大于50℃且等于或小于230℃的羧基和固化剂（c）。

公开(公告)号：US20100212937A1

公开(公告)日：2010-08-26

申请号：US12160718

申请日：2006-02-13

申请人： Masayoshi Kondo ,  Toshio Komiyatani

发明人： Masayoshi Kondo ,  Toshio Komiyatani

IPC分类号： H05K1/00 ,  H05K13/00

CPC分类号： H05K3/4617 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/423 ,  H05K2201/0195 ,  H05K2201/0394 ,  H05K2203/068 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165

摘要： According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from each other.

摘要翻译： 根据本发明，提供了一种制造电路板的方法，其中具有导体柱的第一基板和具有用于接纳导体柱的导体焊盘的第二基板通过层间粘合剂层压，并且导体柱和 电导体焊盘电连接，包括作为第一步骤，在预定的第一条件下通过热压接将导体焊盘与导体柱接合，同时布置第一和第二基板，使得导体焊盘通过层间粘合剂面对导体柱; 在导体焊盘与导体柱接合的同时，在预定的第二条件下热压第一衬底和第二衬底; 以及在所述导体焊盘与所述导体柱接合的同时在预定的第三条件下热压所述第一基板和所述第二基板，其中所述第一，第二和第三条件彼此不同。

公开(公告)号：US08597785B2

公开(公告)日：2013-12-03

申请号：US12095530

申请日：2007-09-28

申请人： Toshio Komiyatani ,  Takashi Hirano ,  Kenzou Maejima ,  Satoru Katsurayama ,  Tomoe Yamashiro

发明人： Toshio Komiyatani ,  Takashi Hirano ,  Kenzou Maejima ,  Satoru Katsurayama ,  Tomoe Yamashiro

IPC分类号： C09J7/00 ,  C09J113/00 ,  C09J163/00

CPC分类号： H05K3/4614 ,  C08L33/10 ,  C08L33/20 ,  C08L2666/04 ,  C09D133/06 ,  C09D133/20 ,  C09J7/10 ,  C09J163/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2203/0191 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511

摘要： The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.

摘要翻译： 本发明提供一种包含具有羧基和/或酚羟基的助熔剂活性化合物，热固性树脂和成膜树脂的胶带。 在本发明的粘合带中，热固性树脂可以是环氧树脂，并且可以含有固化剂。 固化剂可以是咪唑化合物和/或磷化合物。 本发明的胶带可以用作电路板和多层柔性印刷电路板的中间层材料。

公开(公告)号：US08062558B2

公开(公告)日：2011-11-22

申请号：US12518157

申请日：2007-12-20

申请人： Hiroshi Obata ,  Toshio Komiyatani

发明人： Hiroshi Obata ,  Toshio Komiyatani

IPC分类号： H01B1/02 ,  H01B1/22

CPC分类号： H01B1/22 ,  C08K5/134 ,  C08L61/06 ,  C08L101/12 ,  H05K1/095

摘要： This is to provide a conductive paste with higher electroconductivity containing, as raw materials: a metallic powder; a thermosetting resin; and a flux-activating compound having a carboxyl group and a phenolic hydroxyl group, which is applicable to the fine pitch-utilization.

摘要翻译： 这是为了提供具有较高导电性的导电膏，其中含有作为原料的金属粉末; 热固性树脂; 和具有羧基和酚羟基的助熔剂活化化合物，其可适用于细间距利用。

公开(公告)号：US20100012362A1

公开(公告)日：2010-01-21

申请号：US12090628

申请日：2006-10-18

申请人： Tomoyuki Abe ,  Toshio Komiyatani

发明人： Tomoyuki Abe ,  Toshio Komiyatani

IPC分类号： H05K1/02 ,  B32B27/04 ,  B32B7/06 ,  B32B7/12 ,  H05K1/03 ,  C08G77/04 ,  C08L79/08 ,  C08L83/04 ,  C08K3/22

CPC分类号： C09J179/08 ,  C08G59/4042 ,  C08L63/00 ,  H05K1/0346 ,  H05K3/281 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10T428/1476 ,  Y10T428/2852 ,  Y10T428/31663

摘要： The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance.

摘要翻译： 本发明提供一种用作印刷电路板的粘合剂材料的树脂组合物，其包含聚酰亚胺硅氧烷树脂。 本发明还提供了防止加热/加压期间流出的树脂组合物，树脂膜，覆盖膜，层间粘合剂，覆金属层压板和多层印刷电路板，并且提供优异的粘合强度 。 本发明还提供耐热性优异的树脂组合物，树脂膜，覆盖膜，层间粘合剂，覆金属层压板和多层印刷电路板。

公开(公告)号：US5571365A

公开(公告)日：1996-11-05

申请号：US340327

申请日：1994-11-14

申请人： Eiji Maehata ,  Toshio Komiyatani

发明人： Eiji Maehata ,  Toshio Komiyatani

IPC分类号： C09J201/00 ,  C09J7/02 ,  C09J163/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

CPC分类号： H05K3/387 ,  C09J163/00 ,  H05K2201/0212 ,  H05K2203/0773 ,  H05K3/181 ,  H05K3/426

摘要： An adhesive for a printed circuit board which consists essentially of a dispersion of a resin which is soluble in an alkaline oxidizing agent after curing in a resin matrix which is sparingly soluble in an alkaline oxidizing agent after curing, and a process for producing a printed circuit board using the above adhesive.

摘要翻译： 一种用于印刷电路板的粘合剂，其基本上由在固化后可溶于碱性氧化剂的树脂基质中固化后可溶于碱性氧化剂的树脂的分散体组成，以及印刷电路的制造方法 使用上述胶粘剂。

公开(公告)号：US20100203307A1

公开(公告)日：2010-08-12

申请号：US12095530

申请日：2007-09-28

申请人： Toshio Komiyatani ,  Takashi Hirano ,  Kenzou Maejima ,  Satoru Katsurayama ,  Tomoe Yamashiro

发明人： Toshio Komiyatani ,  Takashi Hirano ,  Kenzou Maejima ,  Satoru Katsurayama ,  Tomoe Yamashiro

IPC分类号： C08K5/09 ,  B32B7/12

CPC分类号： H05K3/4614 ,  C08L33/10 ,  C08L33/20 ,  C08L2666/04 ,  C09D133/06 ,  C09D133/20 ,  C09J7/10 ,  C09J163/00 ,  C09J2461/00 ,  C09J2463/00 ,  H05K3/3489 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2203/0191 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511

摘要： Disclosed is an adhesive tape containing a flux activation compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In this adhesive tape, the thermosetting resin may be an epoxy resin, and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorus compound. This adhesive tape can be used as an interlayer material for circuit boards or multilayer flexible printed wiring boards.

摘要翻译： 公开了含有具有羧基和/或酚羟基的助熔剂活化化合物的粘合带，热固性树脂和成膜树脂。 在该粘合带中，热固性树脂可以是环氧树脂，并且可以含有固化剂。 固化剂可以是咪唑化合物和/或磷化合物。 该胶带可以用作电路板或多层柔性印刷电路板的中间层材料。