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    ELECTRONIC COMPONENT
    2.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20120314336A1

    公开(公告)日：2012-12-13

    申请号：US13479397

    申请日：2012-05-24

    申请人： Makoto OGAWA ,  Akihiro MOTOKI ,  Atsuko SAITO ,  Kenji MASUKO ,  Toshinobu FUJIWARA

    发明人： Makoto OGAWA ,  Akihiro MOTOKI ,  Atsuko SAITO ,  Kenji MASUKO ,  Toshinobu FUJIWARA

    IPC分类号： H01G4/008

    CPC分类号： H01G4/008 ,  C25D3/12 ,  C25D3/30 ,  C25D5/12

    摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

    摘要翻译： 抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。 端子电极的外部电极位于电子元件的第一和第二端面上。 包含电镀Ni的第一电镀膜位于外部电极的表面上。 第二镀膜位于第一镀膜的表面上。 第二镀膜具有包括第一镀层和第二镀层的堆叠结构。 第二镀层比第一镀层具有较低的致密化程度。

    ELECTRONIC COMPONENT
    4.
    发明申请
    ELECTRONIC COMPONENT 审中-公开
    电子元件

    公开(公告)号：US20120288724A1

    公开(公告)日：2012-11-15

    申请号：US13456326

    申请日：2012-04-26

    申请人： Makoto OGAWA ,  Akihiro MOTOKI ,  Atsuko SAITO ,  Kenji MASUKO ,  Toshinobu FUJIWARA

    发明人： Makoto OGAWA ,  Akihiro MOTOKI ,  Atsuko SAITO ,  Kenji MASUKO ,  Toshinobu FUJIWARA

    IPC分类号： B32B15/01

    CPC分类号： C23C26/00 ,  C23C28/023 ,  H01G4/232 ,  H01G4/30 ,  Y10T428/31678

    摘要： An electronic component that prevents or minimizes whiskers or has good solder wettability includes a rectangular solid-shaped electronic component element and external electrodes of terminal electrodes provided at opposed end surfaces of the electronic component element. First plated films including Ni are provided on the surfaces of the external electrodes. Second plated films including Sn defining an outermost layer are arranged so as to cover the first plated films. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are provided at a Sn crystal grain boundary. Intermetallic compound layers including Ni3Sn4 are provided at interfaces between the first plated films and the second plated films.

    摘要翻译： 防止或最小化晶须或具有良好焊料润湿性的电子部件包括矩形固体形电子元件和设置在电子元件的相对端面处的端子电极的外部电极。 包括Ni的第一电镀膜设置在外部电极的表面上。 包括限定最外层的Sn的第二镀膜被布置成覆盖第一镀膜。 第二电镀膜具有多晶结构，并且在Sn晶粒边界处提供片状Sn-Ni合金晶粒。 包含Ni3Sn4的金属间化合物层设置在第一镀膜和第二镀膜之间的界面处。

    Electronic component
    5.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号：US09165714B2

    公开(公告)日：2015-10-20

    申请号：US13479397

    申请日：2012-05-24

    申请人： Makoto Ogawa ,  Akihiro Motoki ,  Atsuko Saito ,  Kenji Masuko ,  Toshinobu Fujiwara

    发明人： Makoto Ogawa ,  Akihiro Motoki ,  Atsuko Saito ,  Kenji Masuko ,  Toshinobu Fujiwara

    IPC分类号： H01G4/228 ,  H01G2/20 ,  H01G4/008 ,  C25D5/12 ,  C25D3/30 ,  C25D3/12

    CPC分类号： H01G4/008 ,  C25D3/12 ,  C25D3/30 ,  C25D5/12

    摘要： An electronic component, preferably in the form of a laminated ceramic capacitor, which suppresses the growth of whiskers and has excellent solderability, includes an electronic component element in the shape of, for example, a rectangular parallelepiped. External electrodes of terminal electrodes are located on first and second end surfaces of the electronic component element. First plated films including plated Ni are located on the surfaces of the external electrodes. Second plated films are located on the surfaces of the first plated films. The second plated films have stacked structures including first plated layers and second plated layers. The second plated layers have lower degrees of densification than the first plated layers.

    摘要翻译： 抑制晶须生长并且具有优异的可焊性的电子部件优选为层叠陶瓷电容器，包括例如长方体形状的电子部件元件。 端子电极的外部电极位于电子元件的第一和第二端面上。 包含电镀Ni的第一电镀膜位于外部电极的表面上。 第二镀膜位于第一镀膜的表面上。 第二镀膜具有包括第一镀层和第二镀层的堆叠结构。 第二镀层比第一镀层具有较低的致密化程度。