利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.013 秒)

    METHODS OF PATTERNING A DEPOSIT METAL ON A POLYMERIC SUBSTRATE
    1.
    发明申请
    METHODS OF PATTERNING A DEPOSIT METAL ON A POLYMERIC SUBSTRATE 审中-公开
    在聚合物基体上沉积金属的方法

    公开(公告)号：US20080095988A1

    公开(公告)日：2008-04-24

    申请号：US11550626

    申请日：2006-10-18

    申请人： Matthew H. Frey ,  Khanh P. Nguyen

    发明人： Matthew H. Frey ,  Khanh P. Nguyen

    IPC分类号： B05D5/00 ,  B05D1/36 ,  B05D7/00 ,  B32B3/00

    CPC分类号： C23C18/208 ,  C23C18/1608 ,  C23C18/1689 ,  C23C18/2013 ,  C23C18/31 ,  C23F1/02 ,  C23F1/14 ,  H05K9/0084 ,  H05K9/0094 ,  Y10T428/24612 ,  Y10T428/2462

    摘要： A method of patterning a deposit metal on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern having a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively onto the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and depositing electrolessly a deposit metal selectively on the unfunctionalized recessed region.

    摘要翻译： 描述了在聚合物基底上图案化沉积金属的方法。 该方法包括提供具有主表面的聚合物膜基底，具有凹陷区域和相邻凸起区域的浮雕图案，将第一材料沉积到聚合物膜基材的主表面上以形成涂覆的聚合物膜基材，形成层 的官能化材料选择性地涂覆到涂覆的聚合物膜基材的凸起区域上以形成官能化的凸起区域和未功能化的凹陷区域，并且将沉积金属选择性地沉积在未功能化的凹陷区域上。

    METHODS OF PATTERNING A DEPOSIT METAL ON A POLYMERIC SUBSTRATE
    3.
    发明申请
    METHODS OF PATTERNING A DEPOSIT METAL ON A POLYMERIC SUBSTRATE 审中-公开
    在聚合物基体上沉积金属的方法

    公开(公告)号：US20100203248A1

    公开(公告)日：2010-08-12

    申请号：US12767496

    申请日：2010-04-26

    申请人： MATTHEW H. FREY ,  Khanh P. Nguyen

    发明人： MATTHEW H. FREY ,  Khanh P. Nguyen

    IPC分类号： B05D1/36

    CPC分类号： C23C18/208 ,  C23C18/1608 ,  C23C18/1689 ,  C23C18/2013 ,  C23C18/31 ,  C23F1/02 ,  C23F1/14 ,  H05K9/0084 ,  H05K9/0094 ,  Y10T428/24612 ,  Y10T428/2462

    摘要： A method of patterning a deposit metal on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern having a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively onto the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and depositing electrolessly a deposit metal selectively on the unfunctionalized recessed region.

    摘要翻译： 描述了在聚合物基底上图案化沉积金属的方法。 该方法包括提供具有主表面的聚合物膜基底，具有凹陷区域和相邻凸起区域的浮雕图案，将第一材料沉积到聚合物膜基材的主表面上以形成涂覆的聚合物膜基材，形成层 的官能化材料选择性地涂覆到涂覆的聚合物膜基材的凸起区域上以形成官能化的凸起区域和未功能化的凹陷区域，并且将沉积金属选择性地沉积在未功能化的凹陷区域上。

    METHODS OF PATTERNING A MATERIAL ON POLYMERIC SUBSTRATES
    6.
    发明申请
    METHODS OF PATTERNING A MATERIAL ON POLYMERIC SUBSTRATES 有权
    在聚合物基体上形成材料的方法

    公开(公告)号：US20080095985A1

    公开(公告)日：2008-04-24

    申请号：US11550542

    申请日：2006-10-18

    申请人： Matthew H. Frey ,  Khanh P. Nguyen

    发明人： Matthew H. Frey ,  Khanh P. Nguyen

    IPC分类号： B32B3/00 ,  B05D3/00

    CPC分类号： H05K3/061 ,  C23F1/02 ,  C23F1/14 ,  H05B3/84 ,  H05B2203/017 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/0079 ,  H05K9/0096 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/0528 ,  H05K2203/0537 ,  H05K2203/1545 ,  Y10T428/24479 ,  Y10T428/268

    摘要： A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and etching the first material from the polymeric substrate selectively from the unfunctionalized recessed region.

    摘要翻译： 描述了在聚合物基底上图案化第一材料的方法。 该方法包括提供具有主表面的聚合物膜基材，其具有包括凹陷区域和相邻凸起区域的浮雕图案，将第一材料沉积到聚合物膜基材的主表面上以形成涂覆的聚合物膜基材，形成层 选择性地在所述涂覆的聚合物膜基材的凸起区域上形成官能化材料以形成官能化的凸起区域和未功能化的凹陷区域，以及从所述非功能化凹陷区域选择性地从所述聚合物基板蚀刻所述第一材料。

    Microfabrication using replicated patterned topography and self-assembled monolayers
    7.
    发明授权
    Microfabrication using replicated patterned topography and self-assembled monolayers 有权
    使用复制图案形貌和自组装单层的微加工

    公开(公告)号：US07871670B2

    公开(公告)日：2011-01-18

    申请号：US11200551

    申请日：2005-08-10

    申请人： Khanh P. Nguyen ,  Matthew H. Frey ,  Haiyan Zhang ,  Jun-Ying Zhang

    发明人： Khanh P. Nguyen ,  Matthew H. Frey ,  Haiyan Zhang ,  Jun-Ying Zhang

    IPC分类号： B05D1/36 ,  B05D3/00 ,  B05D3/10 ,  C23C18/18 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/48 ,  C23C18/50

    CPC分类号： C23C18/208 ,  B82Y30/00 ,  C23C18/1608 ,  C23C18/31 ,  C25D1/10 ,  Y10T428/24917

    摘要： A method of selectively and electrolessly depositing a metal onto a substrate having a metallic patterned-nanostructure surface is disclosed. The method includes providing a tool having a patterned-nanostructure surface, the patterned-nanostructure surface having surface regions having a nanostructured surface, replicating the tool patterned-nanostructure surface onto a substrate to form a substrate patterned-nanostructure surface, disposing a metal layer on the substrate patterned-nanostructure surface to form a metallic patterned-nanostructure surface region, forming a self-assembled monolayer on the metallic patterned-nanostructure surface region, exposing the self-assembled monolayer to an electroless plating solution comprising a deposit metal, and depositing electrolessly the deposit metal selectively on the surface regions having a metallic nanostructured surface. Articles formed from this method are also disclosed.

    摘要翻译： 公开了一种选择性地和无电沉积金属到具有金属图案化纳米结构表面的基底上的方法。 该方法包括提供具有图案化纳米结构表面的工具，所述图案化纳米结构表面具有具有纳米结构化表面的表面区域，将工具图案化纳米结构表面复制到衬底上以形成衬底图案化纳米结构表面，将金属层设置在 衬底图案化纳米结构表面以形成金属图案化纳米结构表面区域，在金属图案化纳米结构表面区域上形成自组装单层，将自组装单层暴露于包含沉积金属的化学镀溶液中，并将无电沉积 选择性地在具有金属纳米结构表面的表面区域上沉积金属。 还公开了由该方法形成的制品。