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公开(公告)号：US20080095985A1
公开(公告)日：2008-04-24
申请号：US11550542
申请日：2006-10-18
申请人： Matthew H. Frey , Khanh P. Nguyen
发明人： Matthew H. Frey , Khanh P. Nguyen
CPC分类号： H05K3/061 , C23F1/02 , C23F1/14 , H05B3/84 , H05B2203/017 , H05K1/0393 , H05K3/0014 , H05K3/0079 , H05K9/0096 , H05K2201/09036 , H05K2201/09045 , H05K2203/0108 , H05K2203/0528 , H05K2203/0537 , H05K2203/1545 , Y10T428/24479 , Y10T428/268
摘要： A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and etching the first material from the polymeric substrate selectively from the unfunctionalized recessed region.
摘要翻译： 描述了在聚合物基底上图案化第一材料的方法。 该方法包括提供具有主表面的聚合物膜基材，其具有包括凹陷区域和相邻凸起区域的浮雕图案，将第一材料沉积到聚合物膜基材的主表面上以形成涂覆的聚合物膜基材，形成层 选择性地在所述涂覆的聚合物膜基材的凸起区域上形成官能化材料以形成官能化的凸起区域和未功能化的凹陷区域，以及从所述非功能化凹陷区域选择性地从所述聚合物基板蚀刻所述第一材料。
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公开(公告)号：US08764996B2
公开(公告)日：2014-07-01
申请号：US11550542
申请日：2006-10-18
申请人： Matthew H. Frey , Khanh P. Nguyen
发明人： Matthew H. Frey , Khanh P. Nguyen
CPC分类号： H05K3/061 , C23F1/02 , C23F1/14 , H05B3/84 , H05B2203/017 , H05K1/0393 , H05K3/0014 , H05K3/0079 , H05K9/0096 , H05K2201/09036 , H05K2201/09045 , H05K2203/0108 , H05K2203/0528 , H05K2203/0537 , H05K2203/1545 , Y10T428/24479 , Y10T428/268
摘要： A method of patterning a first material on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern including a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively on the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and etching the first material from the polymeric substrate selectively from the unfunctionalized recessed region.
摘要翻译： 描述了在聚合物基底上图案化第一材料的方法。 该方法包括提供具有主表面的聚合物膜基材，其具有包括凹陷区域和相邻凸起区域的浮雕图案，将第一材料沉积到聚合物膜基材的主表面上以形成涂覆的聚合物膜基材，形成层 选择性地在所述涂覆的聚合物膜基材的凸起区域上形成官能化材料以形成官能化的凸起区域和未功能化的凹陷区域，以及从所述非功能化凹陷区域选择性地从所述聚合物基板蚀刻所述第一材料。
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3.发明授权公开(公告)号：US07682703B2
公开(公告)日：2010-03-23
申请号：US11564582
申请日：2006-11-29
申请人： Matthew H. Frey , Khanh P. Nguyen
发明人： Matthew H. Frey , Khanh P. Nguyen
CPC分类号： H05K3/108 , B82Y30/00 , C23C18/1603 , C23C18/1608 , C23C18/165 , C23C18/1806 , C23C18/1834 , C23C18/1889 , C23C18/208 , C23C18/31 , C23C18/405 , H01L21/288 , H05K3/184 , H05K2201/0382 , H05K2203/0195 , H05K2203/072 , H05K2203/124 , Y10T428/12 , Y10T428/12514 , Y10T428/261 , Y10T428/31544
摘要： A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Article formed from this method are also disclosed.
摘要翻译： 公开了一种选择性地和无电沉积金属到具有金属微结构化表面的基底上的方法。 该方法包括在金属微结构化表面上形成自组装单层，将自组装单层暴露于包括可溶形式的沉积金属的化学镀溶液中，并将沉积金属选择性地沉积在金属微结构化表面上。 还公开了由该方法形成的制品。
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公开(公告)号：US20080095988A1
公开(公告)日：2008-04-24
申请号：US11550626
申请日：2006-10-18
申请人： Matthew H. Frey , Khanh P. Nguyen
发明人： Matthew H. Frey , Khanh P. Nguyen
CPC分类号： C23C18/208 , C23C18/1608 , C23C18/1689 , C23C18/2013 , C23C18/31 , C23F1/02 , C23F1/14 , H05K9/0084 , H05K9/0094 , Y10T428/24612 , Y10T428/2462
摘要： A method of patterning a deposit metal on a polymeric substrate is described. The method includes providing a polymeric film substrate having a major surface with a relief pattern having a recessed region and an adjacent raised region, depositing a first material onto the major surface of the polymeric film substrate to form a coated polymeric film substrate, forming a layer of a functionalizing material selectively onto the raised region of the coated polymeric film substrate to form a functionalized raised region and an unfunctionalized recessed region, and depositing electrolessly a deposit metal selectively on the unfunctionalized recessed region.
摘要翻译： 描述了在聚合物基底上图案化沉积金属的方法。 该方法包括提供具有主表面的聚合物膜基底，具有凹陷区域和相邻凸起区域的浮雕图案，将第一材料沉积到聚合物膜基材的主表面上以形成涂覆的聚合物膜基材，形成层 的官能化材料选择性地涂覆到涂覆的聚合物膜基材的凸起区域上以形成官能化的凸起区域和未功能化的凹陷区域，并且将沉积金属选择性地沉积在未功能化的凹陷区域上。
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5.发明授权公开(公告)号：US07160583B2
公开(公告)日：2007-01-09
申请号：US11003233
申请日：2004-12-03
申请人： Matthew H. Frey , Khanh P. Nguyen
发明人： Matthew H. Frey , Khanh P. Nguyen
CPC分类号： H05K3/108 , B82Y30/00 , C23C18/1603 , C23C18/1608 , C23C18/165 , C23C18/1806 , C23C18/1834 , C23C18/1889 , C23C18/208 , C23C18/31 , C23C18/405 , H01L21/288 , H05K3/184 , H05K2201/0382 , H05K2203/0195 , H05K2203/072 , H05K2203/124 , Y10T428/12 , Y10T428/12514 , Y10T428/261 , Y10T428/31544
摘要： A method of selectively and electrolessly depositing a metal onto a substrate having a metallic microstructured surface is disclosed. The method includes forming a self-assembled monolayer on the metallic microstructured surface, exposing the self-assembled monolayer to an electroless plating solution including a soluble form of a deposit metal, and depositing electrolessly the deposit metal selectively on the metallic microstructured surface. Articles formed from this method are also disclosed.
摘要翻译： 公开了一种选择性地和无电沉积金属到具有金属微结构化表面的基底上的方法。 该方法包括在金属微结构化表面上形成自组装单层，将自组装单层暴露于包括可溶形式的沉积金属的化学镀溶液中，并将沉积金属选择性地沉积在金属微结构化表面上。 还公开了由该方法形成的制品。
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6.发明授权Microfabrication using replicated patterned topography and self-assembled monolayers 有权使用复制图案形貌和自组装单层的微加工公开(公告)号：US07871670B2
公开(公告)日：2011-01-18
申请号：US11200551
申请日：2005-08-10
申请人： Khanh P. Nguyen , Matthew H. Frey , Haiyan Zhang , Jun-Ying Zhang
发明人： Khanh P. Nguyen , Matthew H. Frey , Haiyan Zhang , Jun-Ying Zhang
IPC分类号： B05D1/36 , B05D3/00 , B05D3/10 , C23C18/18 , C23C18/31 , C23C18/34 , C23C18/40 , C23C18/44 , C23C18/48 , C23C18/50
CPC分类号： C23C18/208 , B82Y30/00 , C23C18/1608 , C23C18/31 , C25D1/10 , Y10T428/24917
摘要： A method of selectively and electrolessly depositing a metal onto a substrate having a metallic patterned-nanostructure surface is disclosed. The method includes providing a tool having a patterned-nanostructure surface, the patterned-nanostructure surface having surface regions having a nanostructured surface, replicating the tool patterned-nanostructure surface onto a substrate to form a substrate patterned-nanostructure surface, disposing a metal layer on the substrate patterned-nanostructure surface to form a metallic patterned-nanostructure surface region, forming a self-assembled monolayer on the metallic patterned-nanostructure surface region, exposing the self-assembled monolayer to an electroless plating solution comprising a deposit metal, and depositing electrolessly the deposit metal selectively on the surface regions having a metallic nanostructured surface. Articles formed from this method are also disclosed.
摘要翻译： 公开了一种选择性地和无电沉积金属到具有金属图案化纳米结构表面的基底上的方法。 该方法包括提供具有图案化纳米结构表面的工具，所述图案化纳米结构表面具有具有纳米结构化表面的表面区域，将工具图案化纳米结构表面复制到衬底上以形成衬底图案化纳米结构表面，将金属层设置在 衬底图案化纳米结构表面以形成金属图案化纳米结构表面区域，在金属图案化纳米结构表面区域上形成自组装单层，将自组装单层暴露于包含沉积金属的化学镀溶液中，并将无电沉积 选择性地在具有金属纳米结构表面的表面区域上沉积金属。 还公开了由该方法形成的制品。
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公开(公告)号：US08941395B2
公开(公告)日：2015-01-27
申请号：US12767884
申请日：2010-04-27
申请人： Billy L. Weaver , Matthew H. Frey , Lijun Zu , Cristin E. Moran
发明人： Billy L. Weaver , Matthew H. Frey , Lijun Zu , Cristin E. Moran
CPC分类号： G01B7/003 , C23F1/02 , C23F1/14 , G01R27/2605 , G06F3/0418 , G06F3/044 , G06F2203/04107 , G06F2203/04112 , H03K2017/9602 , Y10T29/49124
摘要： Capacitive sensing devices are provided that include a sensing pattern of conductive traces disposed upon the surface of a substrate and a first passive circuit element that includes a metallic conductor disposed upon the same surface of the substrate. In some embodiments, the first passive circuit element is a component of an electronic circuit that can be, for example, a low pass filter. Provided capacitive sensing devices are useful, for example, when incorporated into projected touch screen display panels for use on electronic devices.
摘要翻译： 提供了电容感测装置，其包括设置在基板表面上的导电迹线的感测图案和包括布置在基板的相同表面上的金属导体的第一无源电路元件。 在一些实施例中，第一无源电路元件是电子电路的组件，其可以是例如低通滤波器。 所提供的电容式感测装置例如在并入用于电子装置的投影式触摸屏显示面板中时是有用的。
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8.发明授权Method of making inorganic, metal oxide spheres using microstructured molds 有权使用微结构模具制备无机，金属氧化物球体的方法公开(公告)号：US08701441B2
公开(公告)日：2014-04-22
申请号：US11465848
申请日：2006-08-21
申请人： David C. Kramlich , John L. Vandenberg , Matthew H. Frey , Scott R. Culler , Kathleen M. Schakel-Carlson
发明人： David C. Kramlich , John L. Vandenberg , Matthew H. Frey , Scott R. Culler , Kathleen M. Schakel-Carlson
IPC分类号： C03B19/10
CPC分类号： C03C12/02 , C03B19/10 , C03B19/102 , C03B19/108 , C08K3/22 , C08K3/26 , C08K3/34 , C08K3/36 , C08K3/38 , C08K2003/2241 , C08K2003/265 , C08K2003/387 , G02B5/128 , Y10T428/24421
摘要： A process for making inorganic, metal oxide spheres that includes exposing solidified, molded microparticles that include a glass precursor composition to a temperature sufficient to transform the molded microparticles into molten glass and cooling the molten glass to form inorganic, metal oxide spheres.
摘要翻译： 一种制备无机金属氧化物球体的方法，其包括使包含玻璃前体组合物的固化的模塑微粒暴露于足以将模制的微粒转化为熔融玻璃的温度，并冷却熔融玻璃以形成无机的金属氧化物球体。
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9.发明授权Methods of wet etching a self-assembled monolayer patterned substrate and metal patterned articles 有权湿式蚀刻自组装单层图案化衬底和金属图案制品的方法公开(公告)号：US08647522B2
公开(公告)日：2014-02-11
申请号：US13319704
申请日：2010-06-17
申请人： Lijun Zu , Matthew H. Frey , Myungchan Kang , Jeffrey H. Tokie
发明人： Lijun Zu , Matthew H. Frey , Myungchan Kang , Jeffrey H. Tokie
CPC分类号： C23F1/02 , C23F1/08 , G03F7/40 , H05K3/061 , H05K3/068 , H05K2203/086 , H05K2203/122
摘要： Method of patterning a substrate are described including a method of providing a substrate comprising a metalized surface having a self-assembled monolayer patterned region and unpatterned region; and wet etching the metalized surface in a liquid etchant agitated with bubbling gas to remove metal from the unpatterned regions to form a metal pattern. Also described are metal patterned article including an article comprising a substrate and an etched microcontact printed metal pattern disposed on the substrate wherein the pattern has a thickness of at least 100 nanometers and a pattern feature uniformity of at least 50% for an area of at least 25 cm2.
摘要翻译： 描述图案化衬底的方法包括提供包括具有自组装单层图案区域和未图案化区域的金属化表面的衬底的方法; 并在用鼓泡气体搅拌的液体蚀刻剂中湿蚀刻金属化表面，以从未图案化的区域去除金属以形成金属图案。 还描述了金属图案化的制品，其包括一种包括衬底和设置在衬底上的经蚀刻的微接触印刷金属图案的制品，其中图案具有至少100纳米的厚度，并且对于至少一个区域的图案特征均匀度至少为50％ 25 cm2。
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公开(公告)号：US08553400B2
公开(公告)日：2013-10-08
申请号：US13321185
申请日：2010-06-18
申请人： Cristin E. Moran , Matthew H. Frey
发明人： Cristin E. Moran , Matthew H. Frey
IPC分类号： H05K5/00
摘要： Electronic displays and metal micropatterned substrates are described comprising a graphic defined by a contrasting area adjacent the graphic. In one embodiment, the graphic is visible when the display is viewed with reflected light and the graphic is substantially less visible or invisible when viewed with backlighting transmitted through the metal micropatterned substrate. The graphic and contrasting area have a total metal micropattern density that differs by no greater than about 5% and more preferably by no greater than 2%.
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