摘要:
A method determines a bias reduced noise and interference estimation in a binaural microphone configuration with a right and a left microphone signal at a time-frame with a target speaker active. The method includes a determination of the auto power spectral density estimate of the common noise formed of noise and interference components of the right and left microphone signals and a modification of the auto power spectral density estimate of the common noise by using an estimate of the magnitude squared coherence of the noise and interference components contained in the right and left microphone signals determined at a time frame without a target speaker active. An acoustic signal processing system and a hearing aid implement the method for determining the bias reduced noise and interference estimation. The noise reduction performance of speech enhancement algorithms is improved by the invention. Further, distortions of the target speech signal and residual noise and interference components are reduced.
摘要:
A method determines a bias reduced noise and interference estimation in a binaural microphone configuration with a right and a left microphone signal at a time-frame with a target speaker active. The method includes a determination of the auto power spectral density estimate of the common noise formed of noise and interference components of the right and left microphone signals and a modification of the auto power spectral density estimate of the common noise by using an estimate of the magnitude squared coherence of the noise and interference components contained in the right and left microphone signals determined at a time frame without a target speaker active. An acoustic signal processing system and a hearing aid implement the method for determining the bias reduced noise and interference estimation. The noise reduction performance of speech enhancement algorithms is improved by the invention. Further, distortions of the target speech signal and residual noise and interference components are reduced.
摘要:
A pure aluminum outer layer is provided to facilitate bonding with aluminum bonding wires having a diameter of 50 .mu.m or greater without formation of troublesome slivers upon bonding. Beneath that a copper-bearing aluminum layer with 1 to 4% copper content is provided. A third layer beneath the copper-bearing layer containing up to 1% silicon can be added below the copper-bearing layer to promote adhesion at contact window edges.
摘要:
A metal semiconductor diode with a first insulating layer, arranged on a semiconductor body and provided with a first contact window, a second insulating layer, which is thinner than the first insulating layer, has a second contact window which is smaller than the first contact window. The second insulating layer covers the edge of the surface of the semiconductor body which emerges through the first contact window and contact metal is provided in the first and in the second contact window.