公开(公告)号：US20070152025A1

公开(公告)日：2007-07-05

申请号：US10591724

申请日：2004-03-02

申请人： Kozo Fujimoto ,  Kazutaka Ikemi ,  Hirohiko Watanabe ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

发明人： Kozo Fujimoto ,  Kazutaka Ikemi ,  Hirohiko Watanabe ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

IPC分类号： B23K31/02

CPC分类号： H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H05K3/328 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.

摘要翻译： 本发明提供一种能够在低温和短时间内接合电极的电子部件安装方法，可以获得高可靠性，并且还能够以细间距进行接合。 在电子部件安装方法中，将形成在电路板上的电路电极和形成在电子部件上的电极部分上的电极部件连接起来，从而将电子部件安装在电路板上，将低熔点金属层预先形成在 电路电极和/或管芯电极，然后将电路电极和管芯电极配置成彼此面对并被加热和加压以熔化低熔点金属，从而将低熔点金属扩散到电路中 电极和芯片电极通过固液扩散。

公开(公告)号：US20070197017A1

公开(公告)日：2007-08-23

申请号：US10591723

申请日：2004-03-02

申请人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

发明人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

IPC分类号： H01L21/44

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/84825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.

摘要翻译： 本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。 半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极 以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电 一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电 部分彼此连接。

公开(公告)号：US07670879B2

公开(公告)日：2010-03-02

申请号：US10591723

申请日：2004-03-02

申请人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

发明人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

IPC分类号： H01L21/50 ,  H01L21/44

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/84825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.

摘要翻译： 本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。 半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极 以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电 一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电 部分彼此连接。

公开(公告)号：US20070001313A1

公开(公告)日：2007-01-04

申请号：US10544234

申请日：2004-02-04

申请人： Kozo Fujimoto ,  Kiyokazu Yasuda ,  Jong-Min Kim

发明人： Kozo Fujimoto ,  Kiyokazu Yasuda ,  Jong-Min Kim

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/29 ,  H01L24/11 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/818 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/157 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.

摘要翻译： 提供了一种互连端子的方法，以便在诸如相对电极的端子之间获得优异的电连接以及使用该连接方法的半导体器件的安装方法。 半导体芯片20的电极焊盘21和设置在基板10上以与电极焊盘21对应的焊盘11以彼此之间的导电粘合剂彼此相对地放置。 然后，将导电性粘接剂加热到高于导电性粘接剂中所含的导电性粒子的熔点，树脂未完全固化的温度，导电性粒子彼此接合。 然后，通过使导电粘合剂中的树脂完全固化来固定半导体芯片20和基板10。

公开(公告)号：US07524748B2

公开(公告)日：2009-04-28

申请号：US10544234

申请日：2004-02-04

申请人： Kozo Fujimoto ,  Kiyokazu Yasuda ,  Jong-Min Kim

发明人： Kozo Fujimoto ,  Kiyokazu Yasuda ,  Jong-Min Kim

IPC分类号： H01L21/44

CPC分类号： H01L24/29 ,  H01L24/11 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/73204 ,  H01L2224/818 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/83886 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/157 ,  H05K3/321 ,  H05K2201/10674 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.

摘要翻译： 提供了一种互连端子的方法，以便在诸如相对电极的端子之间获得优异的电连接以及使用该连接方法的半导体器件的安装方法。 半导体芯片20的电极焊盘21和设置在基板10上以与电极焊盘21对应的焊盘11以彼此之间的导电粘合剂彼此相对地放置。 然后，将导电性粘接剂加热到高于导电性粘接剂中所含的导电性粒子的熔点，树脂未完全固化的温度，导电性粒子彼此接合。 然后，通过使导电粘合剂中的树脂完全固化来固定半导体芯片20和基板10。