公开(公告)号：US20070197017A1

公开(公告)日：2007-08-23

申请号：US10591723

申请日：2004-03-02

申请人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

发明人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

IPC分类号： H01L21/44

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/84825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.

摘要翻译： 本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。 半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极 以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电 一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电 部分彼此连接。

公开(公告)号：US07670879B2

公开(公告)日：2010-03-02

申请号：US10591723

申请日：2004-03-02

申请人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

发明人： Kozo Fujimoto ,  Hirohiko Watanabe ,  Kazutaka Ikemi ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

IPC分类号： H01L21/50 ,  H01L21/44

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45032 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/84825 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium. The manufacturing method of a semiconductor module includes a first joining step for joining first circuit electrodes which are formed on a circuit board and back-surface-side die electrodes of a semiconductor die, a second joining step for joining the front-surface-side electrodes of the semiconductor die and one ends of lead frames, and a third joining step for joining another ends of the lead frame and second circuit electrodes which are formed on the circuit board, wherein a low-melting-temperature metal layer is formed on one conductive portion of a pair of conductive portions to be joined and, thereafter, the low-melting-temperature metal layer is heated and pressurized thus diffusing the low-melting-temperature metal layer into the pair of conductive portions by solid-liquid diffusion whereby the conductive portions are joined to each other.

摘要翻译： 本发明提供一种半导体模块的制造方法，其能够在短时间内在低温下进行接合，并且可以通过在不使用焊料接合介质的情况下进行接合而获得更可靠的接合部。 半导体模块的制造方法包括：第一接合步骤，用于接合形成在电路板上的第一电路电极和半导体管芯的背表面侧管芯电极;第二接合步骤，用于将前表面侧电极 以及第三接合步骤，用于接合引线框架的另一端和形成在电路板上的第二电路电极，其中低熔点金属层形成在一个导电 一部分要接合的导电部分的部分，然后将低熔点金属层加热和加压，从而通过固液扩散将低熔点金属层扩散到一对导电部分中，由此导电 部分彼此连接。

公开(公告)号：US20070152025A1

公开(公告)日：2007-07-05

申请号：US10591724

申请日：2004-03-02

申请人： Kozo Fujimoto ,  Kazutaka Ikemi ,  Hirohiko Watanabe ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

发明人： Kozo Fujimoto ,  Kazutaka Ikemi ,  Hirohiko Watanabe ,  Keiichi Matsumura ,  Masayoshi Shimoda ,  Katsumi Taniguchi ,  Tomoaki Goto

IPC分类号： B23K31/02

CPC分类号： H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/81825 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H05K3/328 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.

摘要翻译： 本发明提供一种能够在低温和短时间内接合电极的电子部件安装方法，可以获得高可靠性，并且还能够以细间距进行接合。 在电子部件安装方法中，将形成在电路板上的电路电极和形成在电子部件上的电极部分上的电极部件连接起来，从而将电子部件安装在电路板上，将低熔点金属层预先形成在 电路电极和/或管芯电极，然后将电路电极和管芯电极配置成彼此面对并被加热和加压以熔化低熔点金属，从而将低熔点金属扩散到电路中 电极和芯片电极通过固液扩散。

公开(公告)号：US08431659B2

公开(公告)日：2013-04-30

申请号：US13311700

申请日：2011-12-06

申请人： Tomoaki Goto ,  Yoshimitsu Onodera

发明人： Tomoaki Goto ,  Yoshimitsu Onodera

IPC分类号： C08F4/02 ,  C08F4/6592 ,  C08F4/642

CPC分类号： C08F10/00 ,  C08F4/65912 ,  C08F4/65927 ,  C08F110/02 ,  C08F210/16 ,  Y10S526/943 ,  C08F4/65916 ,  C08F4/6492 ,  C08F2500/12 ,  C08F2500/24 ,  C08F210/14

摘要： A method of producing a prepolymerized catalyst for olefin polymerization comprising a fine powder removal step of removing fine particles from olefin-prepolymerized catalyst particles for olefin polymerization. The prepolymerized catalyst having a low fine particle content is applicable suitably to the field of continuous polymerization of olefins.

摘要翻译： 一种制备用于烯烃聚合的预聚合催化剂的方法，包括从用于烯烃聚合的烯烃预聚催化剂颗粒中除去细颗粒的细粉末除去步骤。 具有低细颗粒含量的预聚合催化剂适用于烯烃的连续聚合领域。

公开(公告)号：US07485687B2

公开(公告)日：2009-02-03

申请号：US11528444

申请日：2006-09-28

申请人： Yuki Iseki ,  Tomoaki Goto ,  Yasutoyo Kawashima

发明人： Yuki Iseki ,  Tomoaki Goto ,  Yasutoyo Kawashima

IPC分类号： C08F4/42

CPC分类号： C08F10/00 ,  C08F4/65912 ,  C08F4/65927 ,  C08F210/16 ,  C08L23/0815 ,  C08L2205/02 ,  Y10S526/943 ,  C08F4/6492 ,  C08F4/65916 ,  C08L2666/06 ,  C08F210/14 ,  C08F2500/12 ,  C08F2500/04 ,  C08F2500/20 ,  C08F2500/17

摘要： An ethylene-α-olefin copolymer containing monomer units derived from ethylene and monomer units of an α-olefin having 3 to 20 carbon atoms and having a melt flow rate of from 0.01 to 100 g/10 min, an activation energy of flow of 50 kJ/mol or more, a molecular weight distribution measured by a gel permeation chromatography of 3 or more and minute defects of 2000/m2 or less in number, a process for producing the copolymer, and a molding of the copolymer.

摘要翻译： 包含衍生自乙烯的单体单元和具有3至20个碳原子且具有0.01至100g / 10min的熔体流动速率的α-烯烃的单体单元的乙烯-α-烯烃共聚物，流动的活化能为50 kJ / mol以上，通过3次以上的凝胶渗透色谱法测定的分子量分布，数量为2000个/ m 2以下的微小缺陷，共聚物的制造方法和共聚物的成型。

公开(公告)号：US20050152628A1

公开(公告)日：2005-07-14

申请号：US11032321

申请日：2005-01-10

申请人： Masaki Egami ,  Mitsunari Asao ,  Tomoaki Goto

发明人： Masaki Egami ,  Mitsunari Asao ,  Tomoaki Goto

IPC分类号： F16C19/00

CPC分类号： F16C33/7853 ,  F16C19/06 ,  F16C33/6607 ,  F16C33/6633 ,  F16C2300/02

摘要： A rolling bearing for use in a vehicle, particularly in an electric device on said vehicle, said bearing having a sealing member for sealing urea compound-containing grease, in which an elastic body deteriorates to a low extent when the rolling bearing is subjected to a high temperature and which is capable of maintaining a preferable sealing performance. The grease-sealing member has a rubber molding which contacts the grease. The rubber molding is formed by molding a curable fluororubber composition consisting of a copolymer containing tetrafluoroethylene, propylene, and a crosslinkable monomer consisting of unsaturated hydrocarbon, having two to four carbon atoms, in which a part of hydrogen atoms is substituted with fluorine atoms.

摘要翻译： 一种用于车辆的滚动轴承，特别是在所述车辆上的电气装置中，所述轴承具有用于密封含脲化合物的润滑脂的密封构件，其中当所述滚动轴承经受 并且能够保持优选的密封性能。 油脂密封构件具有与油脂接触的橡胶成型体。 通过将由含有四氟乙烯，丙烯的共聚物和由一部分氢原子被氟原子取代的碳原子数为2〜4的不饱和烃构成的交联性单体组成的可固化氟橡胶组合物成型，形成橡胶成型体。

公开(公告)号：US08750584B2

公开(公告)日：2014-06-10

申请号：US13497447

申请日：2010-09-17

申请人： Seiji Matsuba ,  Tetsutaro Ono ,  Tomoaki Goto ,  Kunihiko Kasahara ,  Hiroshi Matsuda

发明人： Seiji Matsuba ,  Tetsutaro Ono ,  Tomoaki Goto ,  Kunihiko Kasahara ,  Hiroshi Matsuda

IPC分类号： G06K9/00 ,  A61B5/05 ,  A61B5/04

CPC分类号： A61B5/0263 ,  A61B5/055 ,  A61B5/4064 ,  G01R33/4838 ,  G01R33/5608 ,  G01R33/56366 ,  G06T7/0014 ,  G06T7/11 ,  G06T2207/10088 ,  G06T2207/20221 ,  G06T2207/30016 ,  G06T2207/30104

摘要： When brain images are inputted through MRI (Magnetic Resonance Imaging) and subjected to image processing to assist the diagnosis of brain diseases, functional and morphological images in an ASL coordinate system are inputted from the head of a subject by an ASL (Arterial Spin Labeling) imaging method using an MRI device. The inputted functional images are subjected to mask processing to extract only the region of cerebral parenchyma, and functional images of only the extracted region of the cerebral parenchyma are thereby produced and displayed to be overlaid on the morphological images. In this manner, a functional image such as a perfusion weighted image of only the region of the cerebral parenchyma can be extracted and displayed overlaid on a morphological image.

摘要翻译： 当通过MRI（磁共振成像）输入脑图像并进行图像处理以辅助脑疾病的诊断时，ASL坐标系中的功能和形态图像通过ASL（动脉自旋标记）从受试者的头部输入， 使用MRI装置的成像方法。 输入的功能图像进行掩模处理以仅提取脑实质区域，由此产生并显示仅提取的脑实质区域的功能图像以覆盖在形态图像上。 以这种方式，可以提取并显示覆盖在形态学图像上的功能图像，例如仅仅脑实质区域的灌注加权图像。

公开(公告)号：US08333516B2

公开(公告)日：2012-12-18

申请号：US12785288

申请日：2010-05-21

申请人： Chikara Ohki ,  Tomoaki Goto

发明人： Chikara Ohki ,  Tomoaki Goto

IPC分类号： F16C33/30

CPC分类号： F16C33/62 ,  F16C19/00 ,  F16C19/06 ,  F16C33/30 ,  F16C33/32 ,  F16C33/64 ,  F16C2204/66 ,  F16C2223/16 ,  F16C2240/90 ,  F16C2380/26 ,  Y10S148/906 ,  Y10S384/912

摘要： A bearing for alternators and a bearing for pulleys for reducing hydrogen embrittlement or cracking is used when the bearing is in an environment having a severe condition, such as, when hydrogen is generated from grease or the like. The bearing includes a rolling element, an inner ring and an outer ring, and at least one of the rolling element, where the inner and outer rings have a nitrogen enriched layer containing austenite crystal grains having a grain size number exceeding 10.

摘要翻译： 当轴承处于严酷状态的环境中时，例如当从油脂等产生氢时，使用用于交流发电机的轴承和用于减少氢脆或裂纹的滑轮的轴承。 所述轴承包括滚动元件，内圈和外圈，以及所述滚动元件中的至少一个，所述内圈和所述外圈具有包含粒径数超过10的奥氏体晶粒的富氮层。

公开(公告)号：US07999048B2

公开(公告)日：2011-08-16

申请号：US11882984

申请日：2007-08-08

申请人： Tomoaki Goto

发明人： Tomoaki Goto

IPC分类号： C08F4/44 ,  C08F210/00 ,  B01J31/00 ,  B01J37/00

CPC分类号： C08F10/00 ,  C08F4/65912 ,  C08F4/65927 ,  C08F210/16 ,  C08F4/6492 ,  C08F4/65916 ,  C08F210/14

摘要： There is provided a process for producing a prepolymerization catalyst for polymerization of an olefin, said process comprising the steps of feeding, to a polymerization reactor, an olefin and a solid catalyst component in which a catalyst component for polymerization of the olefin is carried on a fine particle support, and prepolymerizing the olefin in the presence of the solid catalyst component in the polymerization reactor, to thereby obtain the prepolymerization catalyst in which the olefin is prepolymerized on the solid catalyst component, characterized in that said solid catalyst component is pressure-fed to the polymerization reactor from a catalyst feeder connected to the polymerization reactor, and in that the inner pressure of the catalyst feeder at the start of the pressure-feeding is set at (Pr+0.0001) to (Pr+1) (MPa in unit) (in which Pr represents the inner pressure of the polymerization reactor (MPa in unit) at the start of the pressure-feeding).

摘要翻译： 提供了一种制备烯烃聚合预聚合催化剂的方法，所述方法包括以下步骤：向聚合反应器中加入烯烃和固体催化剂组分，其中烯烃聚合用催化剂组分在 在聚合反应器中的固体催化剂组分存在下，预聚合烯烃，从而得到其中烯烃在固体催化剂组分上预聚合的预聚合催化剂，其特征在于所述固体催化剂组分被加压 从与聚合反应器连接的催化剂进料到聚合反应器，并且在加压开始时催化剂进料器的内部压力设定为（Pr + 0.0001）至（Pr + 1）（单位为MPa ）（其中Pr表示压力开始时聚合反应器的内部压力（单位：MPa））。

公开(公告)号：US20070105711A1

公开(公告)日：2007-05-10

申请号：US11528445

申请日：2006-09-28

申请人： Tomoaki Goto ,  Yoshiya Okado

发明人： Tomoaki Goto ,  Yoshiya Okado

IPC分类号： B01J31/00 ,  C08F4/44

CPC分类号： C08F10/00 ,  C08F4/65912 ,  C08F4/65927 ,  C08F210/16 ,  C08F4/65916 ,  C08F4/6492 ,  C08F210/14 ,  C08F2500/12 ,  C08F210/08

摘要： A process for producing a prepolymerization catalyst component which contains contacting a co-catalyst support (A), a metallocene compound (B) and an organoaluminum compound (C) to obtain a contact-treated product, and prepolymerizing an olefin in the presence of the said contact-treated product, the process containing the following steps (1), (2) and (3): step (1): a step of subjecting a saturated aliphatic hydrocarbon compound solvent containing the metallocene compound (B) to a heat treatment at 40° C. or higher; step (2): a step of subjecting the heat treatment product obtained by the heat treatment in the step (1) to a contact treatment with the co-catalyst support (A); and step (3): a step of subjecting the contact treatment product obtained by the contact treatment in the step (2) to a contact treatment with the organoaluminum compound (C).

摘要翻译： 一种制备预聚合催化剂组分的方法，其包括使助催化剂载体（A），茂金属化合物（B）和有机铝化合物（C）接触以获得接触处理的产物，并在烯烃的存在下预聚烯烃 所述接触处理产物，所述方法包括以下步骤（1），（2）和（3）：步骤（1）：将含有茂金属化合物（B）的饱和脂族烃化合物溶剂进行热处理 在40℃以上; 步骤（2）：使步骤（1）中通过热处理获得的热处理产物与助催化剂载体（A）进行接触处理的步骤; 和步骤（3）：在步骤（2）中通过接触处理获得的接触处理产物与有机铝化合物（C）进行接触处理的步骤。