Abstract:
Disclosed is a thermosetting resin composition including a thermosetting aromatic oligomer represented by the following Chemical Formula 1, a hollow particle, and solvent, and a board comprising the same. In the above Chemical Formula 1, wherein B, L1, L2, Z1 and Z2 are the same as in defined in the specification.
Abstract:
An aerogel including a polymerization product of a first monomer selected from an aryl polyol compound including at least two aryl groups linked to each other by a linker, an aryl polyol compound including at least two aryl groups fused to each other, or a combination thereof, and a second monomer including a benzene substituted with at least two hydroxyl groups.
Abstract:
An aerogel-foam composite includes an open cell foam and an aerogel matrix polymer disposed in the open cell foam. The aerogel-foam composite has compression strength of about 15 megaPascals (MPa) or more. The open cell foam may be a polyurethane foam including a carbonate group (—OC(O)O—).
Abstract:
An organic aerogel includes a polymer prepared from a substituted or unsubstituted maleimide compound and a compound having at least two vinyl groups. A composition for the organic aerogel includes a substituted or unsubstituted maleimide compound and a compound having at least two vinyl groups.
Abstract:
Disclosed is a composition for forming a board. The composition includes a maleimide-based compound including at least three maleimide groups and a liquid crystalline polymer or oligomer. A prepreg and a board are each fabricated using the composition.
Abstract:
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
Abstract:
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
Abstract:
An aerogel including a polymeric reaction product of (a) a first monomer including an aromatic compound having at least two unsaturated functional groups, and (b) a second monomer represented by the following Chemical Formula 1 and including at least two groups independently chosen from (meth)acrylate groups and NR″R′ (where R″ and R′ are the same or different and are (meth)acryloyl groups) is provided. Each substituent is as defined in the specification.
Abstract:
Disclosed is a composition for forming a board including a benzoxazine-based compound and a liquid crystal polymer or oligomer, and a board fabricated using the same. A board comprising the composition including the benzoxazine-based compound and the liquid crystal compound, and a prepreg comprising the cured composition, are also disclosed.
Abstract:
A method of forming a nano-particle array by convective assembly and a convective assembly apparatus for the same are provided. The method of forming nano-particle array comprises: coating a plurality of nano-particles by forming a coating layer; performing a first convective assembly by moving a first substrate facing, in parallel to and spaced apart from a second substrate at a desired distance such that a colloidal solution including the coated nano-particles is between the first and second substrate; and performing a second convective assembly for evaporating a solvent by locally heating a surface of the colloidal solution drawn when the first substrate is moved in parallel relative to the second substrate. The present invention provides the method of forming the nano-particle array where nano-particles having a particle size from a few to several tens of nanometers are uniformly arrayed on a large area substrate at a low cost, and the convective assembly apparatus for the same.