公开(公告)号：US08940834B2

公开(公告)日：2015-01-27

申请号：US13179177

申请日：2011-07-08

Applicant: Andreas Bayer ,  Manfred Hewel

Inventor： Andreas Bayer ,  Manfred Hewel

IPC: C08L77/00 ,  C08G69/26 ,  C08L77/06 ,  C08K3/00 ,  C08K5/00 ,  C08K5/51 ,  C08L23/08

CPC classification number: C08G69/265 ,  C08K3/016 ,  C08K5/0066 ,  C08K5/51 ,  C08L23/0876 ,  C08L77/06 ,  C08L2666/06

Abstract: An unreinforced, halogen-free polyamide moulding composition having the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270° C. to 320° C. and made up of 100% by weight of diacid fraction composed of: 50-100% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 0-50% by weight of isophthalic acid (IPA), and 100% by weight of diamine fraction; (B) 5-15% by weight of ionomer; (C) 8-18% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.

Abstract translation: 具有以下组成的未增强的无卤素聚酰胺模塑组合物：（A）62-87重量％的部分芳族部分结晶的共聚酰胺，其熔点为270℃至320℃，并由100 二酸成分的重量百分比由50-100％（重量）对苯二甲酸（TPA）和/或萘二甲酸组成; 0-50重量％的间苯二甲酸（IPA）和100重量％的二胺组分; （B）5-15重量％的离聚物; （C）8-18重量％的阻燃剂; （D）0-5重量％的添加剂; 其中组分（A） - （D）加起来为100重量％。

公开(公告)号：US20110281990A1

公开(公告)日：2011-11-17

申请号：US13096374

申请日：2011-04-28

Applicant: Nikolai LAMBERTS ,  Andreas BAYER ,  Manfred HEWEL ,  Heinz HOFF

Inventor： Nikolai LAMBERTS ,  Andreas BAYER ,  Manfred HEWEL ,  Heinz HOFF

IPC: C08L77/06 ,  C08K13/04

CPC classification number: C08K3/26 ,  C08K3/22 ,  C08K7/14 ,  C08L77/06

Abstract: What is described is a polyamide moulding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components(A) 40 to 80% by weight of at least one semiaromatic polyamide based on at least 70 mol % of aromatic dicarboxylic acids and at least 70 mol % of aliphatic diamines having 4 to 18 carbon atoms and having a melting temperature in the range from 270° C. to 340° C.(B) 10 to 30% by weight of titanium dioxide particles(C) 5 to 20% by weight of glass fibres(D) 5-30% by weight of calcium carbonate.The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.5, where the polyamide moulding material may optionally comprise customary additives (E) in addition to components (A) to (D), and where the amount thereof is in addition to the sum of components (A) to (D).

Abstract translation: 描述的是用于生产具有高强度，高长期反射率和低起泡倾向的LED壳体或壳体部件的半结晶聚酰胺的聚酰胺模塑材料。 提出的聚酰胺成型材料由以下组分（A）40至80重量％的至少一种基于至少70摩尔％的芳族二羧酸和至少70摩尔％的具有4至18个碳原子的脂族二胺的半芳族聚酰胺 原子并且具有在270℃至340℃范围内的熔融温度。（B）10至30重量％的二氧化钛颗粒（C）5至20重量％的玻璃纤维（D）5-30 重量％的碳酸钙。 组分（A）至（D）的重量百分比一起加起来为100％，条件是组分（B），（C）和（D）满足以下条件：（B）+（C）+（ D）= 20〜60重量％ （C）/（D）的重量比在0.25至1.5的范围内，其中除了组分（A）至（D）之外，聚酰胺模塑材料可任选地包含常规添加剂（E），并且其量在 （A）至（D）的总和除外。

公开(公告)号：US20080274355A1

公开(公告)日：2008-11-06

申请号：US12115268

申请日：2008-05-05

Applicant: Manfred HEWEL

Inventor： Manfred HEWEL

IPC: B32B5/16 ,  C08L77/06 ,  C08K3/40 ,  C08K3/04

CPC classification number: C08G69/265 ,  B33Y70/00 ,  C08J3/12 ,  C08J2377/06 ,  C08L77/06 ,  Y10T428/2982 ,  Y10T428/31725 ,  Y10T428/31739 ,  C08L2666/02

Abstract: A polyamide molding composition with the following constitution is described: (A) from 30 to 100% by weight of at least one 10T/6T copolyamide, where this is composed of (A1) from 40 to 95 mol % of 10T units, formed from the monomers 1,10-decanediamine and terephthalic acid (A2) from 5 to 60 mol % of 6T units, formed from the monomers 1,6-hexanediamine and terephthalic acid (B) from 0 to 70% by weight of reinforcing materials and/or fillers (C) from 0 to 50% by weight of additives and/or further polymers where the entirety of components A to C is 100%, with the proviso that in component (A) up to 30 mol %, based on the entirety of the dicarboxylic acids, of the terephthalic acid can have been replaced by other aromatic, aliphatic, or cycloaliphatic dicarboxylic acids, and with the proviso that in component (A) up to 30 mol % of 1,10-decanediamine and respectively 1,6-hexanediamine, based on the entirety of the diamines, can have been replaced by other diamines, and with the proviso that not more than 30 mol % in component (A), based on the entirety of the monomers, can have been formed via lactams or amino acids. Uses of this polyamide molding composition are moreover described, as also are processes for the preparation of these polyamide molding compositions.

Abstract translation: 描述了具有以下结构的聚酰胺模塑组合物：（A）30至100重量％的至少一种10T / 6T共聚酰胺，其由（A1）40至95摩尔％的10T单元组成，由 由单体1,6-己二胺和对苯二甲酸（B）形成的单体1,10-癸二胺和5至60摩尔％的6T单元的对苯二甲酸（A2），0至70重量％的增强材料和/ 或填充剂（C）0至50重量％的添加剂和/或其中组分A至C的全部为100％的其它聚合物，条件是在组分（A）中至多30摩尔％，基于全部 二羧酸的对苯二甲酸可以被其它芳族，脂族或脂环族二羧酸代替，条件是在组分（A）中，高达30摩尔％的1,10-癸二胺和1,6 - 己二胺基于全部二胺可以被其他二胺替代，并且条件是 组分（A）中不超过30mol％，基于全部单体，可以通过内酰胺或氨基酸形成。 此外，还描述了这种聚酰胺模塑组合物的用途，以及制备这些聚酰胺模塑组合物的方法。

公开(公告)号：US20070123632A1

公开(公告)日：2007-05-31

申请号：US11594249

申请日：2006-11-08

Applicant: Ornulf Rexin ,  Jean-Jacques Linster ,  Manfred Hewel

Inventor： Ornulf Rexin ,  Jean-Jacques Linster ,  Manfred Hewel

IPC: C08K3/40 ,  C08K3/04

CPC classification number: C08L77/02 ,  C08G69/26 ,  C08K7/14 ,  C08L77/00 ,  C08L77/06 ,  C08L77/10 ,  C08L2205/02 ,  C08L2666/20

Abstract: The present invention relates to reinforced polyamide moulding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibres or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide moulding materials according to the invention are suitable for the production of mouldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection moulding, direct methods or direct compounding, in which the compounded polyamide moulding material is processed directly by injection moulding, or other deformation techniques.

Abstract translation: 本发明涉及增强的聚酰胺成型材料，其可以由聚酰胺共混物制备，例如通过在双螺杆挤出机上与切割的纤维或连续长丝混合并且具有通常彼此不相容的机械性质，即 组合极高的刚度和强度，同时具有良好的韧性。 此外，根据本发明实现了高热变形温度（HDT）。 根据本发明的热塑性聚酰胺成型材料适用于生产可通过例如挤出，注射成型，直接方法或直接混合来制备的模制品或其他半成品或成品，其中复合聚酰胺模制品 材料通过注射成型或其他变形技术直接加工。

公开(公告)号：USRE39207E1

公开(公告)日：2006-07-25

申请号：US10430651

申请日：2003-05-06

Applicant: Georg Stöppelmann ,  Manfred Hewel

Inventor： Georg Stöppelmann ,  Manfred Hewel

IPC: C08J3/00 ,  C08K3/04 ,  C08L67/00 ,  C08L77/00 ,  C08L79/00

CPC classification number: F16L11/118 ,  B32B27/20 ,  B32B27/34 ,  B32B27/36 ,  C08K3/04 ,  C08K5/20 ,  C08K5/526 ,  F16L9/12 ,  C08L77/00 ,  C08L67/00

Abstract: The invention concerns anti-static, peroxide-stable molding compounds on the basis of polyamides and/or polyesters, whereby the molding compounds are modified with very pure conductive carbon black with a low specific surface area. These anti-static molding compounds can be used for the production of injection-molded or extruded parts and the production of sheets or multi-layer hoses and tubes.

公开(公告)号：US06296920B1

公开(公告)日：2001-10-02

申请号：US09385656

申请日：1999-08-27

Applicant: Friedrich Buehler ,  Manfred Hewel

Inventor： Friedrich Buehler ,  Manfred Hewel

IPC: B32B500

CPC classification number: C08L55/02 ,  C08G63/181 ,  C08G64/04 ,  C08L51/003 ,  C08L53/00 ,  C08L77/00 ,  Y10T428/24 ,  Y10T428/24025 ,  Y10T428/24355 ,  Y10T428/249921 ,  Y10T428/29 ,  Y10T428/31504 ,  Y10T428/31725 ,  Y10T428/31786 ,  C08L2666/02 ,  C08L2666/04

Abstract: The invention relates to a reversible thermotropic plastics molding compound. Thermotropic molding compounds of this kind are used, amongst other things, for glass and coverings for shading and light/heat regulation in houses, cars, etc. The molding compound according to the invention consists of two compounds which are not thermodynamically miscible with one another. The first component consists of a plastics material, while the second component is not liquid-crystalline and has a refractive index which is the same as the first component in the transparent range and the temperature dependency of which is different from the temperature dependency of the refractive index of the first component. On raising the temperature, the transmission of the molding compound is thus altered.

Abstract translation: 本发明涉及一种可逆热致塑性模塑料。 除了别的以外，还使用这种热致变模塑料，用于房屋，汽车等中的玻璃和遮光物以及遮光和轻/热调节。根据本发明的模塑料由两种不能在热力学上彼此混溶的化合物组成 。 第一组分由塑料材料组成，而第二组分不是液晶的，并且具有与透明范围中的第一组分相同的折射率，其温度依赖性不同于折射率的温度依赖性 第一个组件的索引。 在提高温度的同时，改变模塑料的透过性。

公开(公告)号：US6153677A

公开(公告)日：2000-11-28

申请号：US555934

申请日：1995-11-09

Applicant: Hans Dalla Torre ,  Daniel Capaul ,  Manfred Hewel

Inventor： Hans Dalla Torre ,  Daniel Capaul ,  Manfred Hewel

IPC: C08K5/5357 ,  C08K5/49

CPC classification number: C08K5/5357

Abstract: A polyamide composition which is flame-retardant, includes several polyamides; and at least one flame-retarding additive which is at least one alkyl phosphonic acid compound having general formula (I):

Abstract translation: 阻燃剂的聚酰胺组合物包括几种聚酰胺; 和至少一种阻燃添加剂，其是至少一种具有通式（I）的烷基膦酸化合物：

公开(公告)号：US5990270A

公开(公告)日：1999-11-23

申请号：US182424

申请日：1998-10-30

Applicant: Hans Dalla Torre ,  Manfred Hewel

Inventor： Hans Dalla Torre ,  Manfred Hewel

IPC: C08K5/5357 ,  C08G69/26 ,  C08G69/28

CPC classification number: C08K5/5357

Abstract: A polyamide composition which is amorphous and transparent, which has reduced flammability, and which has reduced migration of flame-retardant additive so that it is film-free, includes at least one polyamide which contains cycloaliphatic monomer units and which is amorphous and transparent; and a flame-retardant additive which is present in an amount effective to reduced flammability of the polyamide composition, which is dissolved in the at least one polyamide, and which is at least one alkyl phosphonic acid compound having a general formula: ##STR1## wherein R and R' each represent, independent of each other, an alkyl group having from 1 to 4 carbon atoms, and x=0 or 1. An article molded from this composition is transparent, has reduced flammability, and has reduced migration of flame-retardant additive so that it is film-free.

Abstract translation: 无定形和透明的聚酰胺组合物具有降低的可燃性，并且减少了阻燃添加剂的迁移使其不含膜，包括至少一种含有脂环族单体单元并且是无定形和透明的聚酰胺; 和阻燃添加剂，其以有效降低溶解在至少一种聚酰胺中的聚酰胺组合物的可燃性的量存在，并且是至少一种具有以下通式的烷基膦酸化合物：其中R和R 各自独立地表示具有1至4个碳原子的烷基，x = 0或1.由该组合物模制的制品是透明的，具有降低的可燃性，并且阻止阻燃添加剂的迁移减少 这是无电影的。

公开(公告)号：US5700900A

公开(公告)日：1997-12-23

申请号：US528860

申请日：1995-09-15

Applicant: Manfred Hewel ,  Hans Dalla Torre

Inventor： Manfred Hewel ,  Hans Dalla Torre

IPC: C08G69/02 ,  C08G69/00 ,  C08G69/26 ,  C08G69/36

CPC classification number: C08G69/26 ,  C08G69/265 ,  C08G69/36

Abstract: A copolyamide composition and article molded therefrom, the molded article being transparent, being especially rigid, tough and cold impact resistant, having good resistance to solvents, and exhibiting negligible changes in mechanical properties in the conditioned state due to very low water absorption. The copolyamide composition including long-chain monomer building blocks and being comprised of from about 30 to about 96 parts by weight of at least one long-chain monomer which is suitable as a long-chain building block for a polyamide and which has from 9 to 12 carbon atoms; and from about 4 to about 70 parts by weight of precursor monomers for semiaromatic polyamides, which precursor monomers comprise at least one diamine, H.sub.2 N--R--NH.sub.2, and at least one aromatic dicarboxylic acid in an approximately equimolar ratio with one another, wherein R is a radical selected from the group consisting of a straight-chain radical having 2 to 12 carbon atoms, an aliphatic radical having 2 to 12 carbon atoms, an araliphatic radical having 7 to 12 carbon atoms, and a cycloaliphatic radical having 6 to 42 carbon atoms. Advantageously, up to about 15 mole percent of the at least one aromatic dicarboxylic acid can be replaced by a long-chain aliphatic dicarboxylic acid having 9 to 36 carbon atoms.

Abstract translation: 共聚酰胺组合物和由其模制的制品，模制品是透明的，特别是刚性，坚韧和耐冷冲击，具有良好的耐溶剂性，并且由于非常低的吸水性而在调理状态下的机械性能变化可忽略。 所述共聚酰胺组合物包括长链单体结构单元，并且由约30至约96重量份的至少一种长链单体组成，所述长链单体适合作为聚酰胺的长链结构单元，并且具有9至 12个碳原子; 和约4至约70重量份的用于半芳族聚酰胺的前体单体，该前体单体包含至少一种二胺，H 2 N-R-NH 2和至少一种彼此近似等摩尔比的芳族二羧酸，其中R 是选自具有2至12个碳原子的直链基团，具有2至12个碳原子的脂族基团，具有7至12个碳原子的芳脂族基团和具有6至42个碳原子的脂环族基团的基团 原子 有利地，至多约15摩尔％的至少一种芳族二羧酸可被具有9至36个碳原子的长链脂族二羧酸代替。

公开(公告)号：US08383244B2

公开(公告)日：2013-02-26

申请号：US13481451

申请日：2012-05-25

Applicant: Andreas Bayer ,  Nikolai Lamberts ,  Botho Hoffmann ,  Manfred Hewel

Inventor： Andreas Bayer ,  Nikolai Lamberts ,  Botho Hoffmann ,  Manfred Hewel

IPC: B32B27/08

CPC classification number: C08L77/06 ,  C08G69/36 ,  C08K3/014 ,  C08K5/005 ,  C08K7/14 ,  C08L77/02 ,  C08L2205/02 ,  Y10T428/1352 ,  Y10T428/1372 ,  Y10T428/139 ,  Y10T428/24994 ,  Y10T428/249945 ,  Y10T428/249946 ,  Y10T428/31725 ,  Y10T428/31739

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract translation: 公开了一种具有耐热老化性的聚酰胺模塑料，其用作汽车或电气部件，并由以下组成：（A）由（A1）至少一种半芳族半结晶聚酰胺组成的聚酰胺混合物27-84.99重量％ 255℃至330℃，（A2）不同于（A1）并且具有至少50重量％的己内酰胺含量的至少一种含己内酰胺的聚酰胺，其中总己内酰胺含量为22-30重量％ ％，相对于聚酰胺混合物，（B）15-65重量％的至少一种填料和增强剂，（C）0.01-3.0重量％的至少一种热稳定剂，和（D）0-5.0重量％ 的至少一种添加剂，其中组分（A） - （D）加到100重量％。