CROSSLINKABLE POLYMERS
    1.
    发明申请
    CROSSLINKABLE POLYMERS 有权
    可交联聚合物

    公开(公告)号:US20160046748A1

    公开(公告)日:2016-02-18

    申请号:US14457477

    申请日:2014-08-12

    IPC分类号: C08F220/68

    摘要: Crosslinkable polymers comprise recurring units represented by: wherein R, R′, and R″ are independently hydrogen or an alkyl, cyano, or halo group; R1 is hydrogen or a halo, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, cyano, hydroxy, alkoxy, carboxy, or ester group; L is an organic linking group; EWG represents an electron withdrawing group having a Hammett-sigma value greater than or equal to 0.35 such that the oxygen-carbon bond in O—C(EWG)(R1) is cleavable in the presence of a cleaving acid having a pKa of 2 or less as measured in water; Ar is a substituted or unsubstituted arylene group; X is NR2 or oxygen; R2 is hydrogen or an alkyl group; t-alkyl represents a tertiary alkyl group having 4 to 6 carbon atoms, and m represents at least 1 mol % and up to and including 100 mol %, based on the total recurring units in the polymer.

    摘要翻译: 可交联聚合物包含由下式表示的重复单元:其中R,R'和R“独立地为氢或烷基,氰基或卤代基; R 1是氢或卤素,取代或未取代的烷基,取代或未取代的环烷基,氰基,羟基,烷氧基,羧基或酯基; L是有机连接基团; EWG表示具有大于或等于0.35的哈米特 - 西格玛值的吸电子基团,使得O-C(EWG)(R1)中的氧 - 碳键可在pKa为2的裂解酸存在下裂解,或 较少在水中测量; Ar是取代或未取代的亚芳基; X为NR2或氧; R2是氢或烷基; 基于聚合物中的总重复单元,t-烷基表示具有4-6个碳原子的叔烷基,m表示至少1mol%且至多且包括100mol%。

    Crosslinkable polymers
    2.
    发明授权
    Crosslinkable polymers 有权
    可交联聚合物

    公开(公告)号:US09249248B1

    公开(公告)日:2016-02-02

    申请号:US14457477

    申请日:2014-08-12

    摘要: Crosslinkable polymers comprise recurring units represented by: wherein R, R′, and R″ are independently hydrogen or an alkyl, cyano, or halo group; R1 is hydrogen or a halo, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, cyano, hydroxy, alkoxy, carboxy, or ester group; L is an organic linking group; EWG represents an electron withdrawing group having a Hammett-sigma value greater than or equal to 0.35 such that the oxygen-carbon bond in O—C(EWG)(R1) is cleavable in the presence of a cleaving acid having a pKa of 2 or less as measured in water; Ar is a substituted or unsubstituted arylene group; X is NR2 or oxygen; R2 is hydrogen or an alkyl group; t-alkyl represents a tertiary alkyl group having 4 to 6 carbon atoms, and m represents at least 1 mol % and up to and including 100 mol %, based on the total recurring units in the polymer.

    摘要翻译: 可交联聚合物包含由下式表示的重复单元:其中R,R'和R“独立地为氢或烷基,氰基或卤代基; R 1是氢或卤素,取代或未取代的烷基,取代或未取代的环烷基,氰基,羟基,烷氧基,羧基或酯基; L是有机连接基团; EWG表示具有大于或等于0.35的哈米特 - 西格玛值的吸电子基团,使得O-C(EWG)(R1)中的氧 - 碳键可在pKa为2的裂解酸存在下裂解,或 较少在水中测量; Ar是取代或未取代的亚芳基; X为NR2或氧; R2是氢或烷基; 基于聚合物中的总重复单元,t-烷基表示具有4-6个碳原子的叔烷基,m表示至少1mol%且至多且包括100mol%。

    Electroless plating method
    3.
    发明授权
    Electroless plating method 有权
    无电镀法

    公开(公告)号:US09081281B2

    公开(公告)日:2015-07-14

    申请号:US14084732

    申请日:2013-11-20

    IPC分类号: G03F7/26 G03F7/16 G03F7/20

    摘要: A conductive metal pattern is formed in a polymeric layer that has a polymer that comprises (1) pendant groups that are capable of providing pendant sulfonic acid groups upon exposure of the reactive polymer to radiation, and (2) pendant groups that are capable of reacting in the presence of the sulfonic acid groups to provide crosslinking. The polymeric layer is patternwise exposed to form non-exposed regions and exposed regions, which are contacted with a reducing agent to incorporate reducing agent therein. These exposed regions are then contacted with electroless seed metal ions to oxidize the reducing agent to form corresponding electroless seed metal nuclei that can be then electrolessly plated with a conductive metal.

    摘要翻译: 在具有聚合物的聚合物层中形成导电金属图案,所述聚合物包含(1)当将反应性聚合物暴露于辐射时能够提供侧链磺酸基的侧基,和(2)能够反应的侧基 在磺酸基存在下提供交联。 聚合物层被图案化地暴露以形成非暴露区域和暴露区域,其与还原剂接触以在其中引入还原剂。 然后将这些暴露的区域与无电子种子金属离子接触以氧化还原剂,以形成相应的无电子种子金属核,然后可以用导电金属进行无电镀。

    ELECTROLESS PLATING METHOD USING HALIDE
    4.
    发明申请
    ELECTROLESS PLATING METHOD USING HALIDE 有权
    使用半导体的电镀方法

    公开(公告)号:US20150140495A1

    公开(公告)日:2015-05-21

    申请号:US14084969

    申请日:2013-11-20

    IPC分类号: G03F7/16 G03F7/11 G03F7/20

    摘要: A conductive metal pattern is formed using a reactive polymer that can provide pendant sulfonic acid groups upon exposure to radiation, and (2) pendant groups that are capable of providing crosslinking. The polymeric layer is patternwise exposed to radiation to provide first exposed regions that are then contacted with electroless seed metal ions to form a pattern of electroless seed metal ions, followed by contact with a halide. At least some of the electroless seed metal halide can be exposed to form second exposed regions. The polymeric layer can be contacted with a reducing agent either: (i) to develop the electroless seed metal image in the second exposed regions, or (ii) to develop all of the electroless seed metal halide in the first exposed regions, and optionally contacted with a fixing agent. The electroless seed metal nuclei in the first exposed regions can be electrolessly plated with a conductive metal.

    摘要翻译: 使用可以在暴露于辐射时提供侧链磺酸基团的反应性聚合物形成导电金属图案,和(2)能够提供交联的侧基。 将聚合物层图案地暴露于辐射以提供第一暴露区域,然后与无电晶种金属离子接触以形成无电子种子金属离子的图案,然后与卤化物接触。 至少一些无电子种子金属卤化物可以暴露以形成第二暴露区域。 聚合物层可以与还原剂接触,即:(i)在第二暴露区域中显影无电子种子金属图像,或(ii)在第一曝光区域中显影所有无电子种子金属卤化物,并任选地接触 用固定剂。 第一暴露区域中的无电晶种金属核可以用导电金属无电镀。

    Electroless plating method using non-reducing agent
    5.
    发明授权
    Electroless plating method using non-reducing agent 有权
    无电镀法使用非还原剂

    公开(公告)号:US09023560B1

    公开(公告)日:2015-05-05

    申请号:US14072049

    申请日:2013-11-05

    IPC分类号: C23C18/20 G03F7/26 G03F7/40

    摘要: A conductive pattern is formed in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to radiation to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. This pattern of electroless seed metal ions can be contacted with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40. This bound electroless seed metal compound is then electrolessly plated with a suitable conductive metal.

    摘要翻译: 导电图案形成在聚合物层中,该聚合物层具有(a)包含叔烷基酯基侧基的反应性聚合物,(b)暴露于辐射时提供酸的化合物,和(c)交联剂。 将聚合物层图案地暴露于辐射以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 无电子种子金属离子的这种图案可以与非还原试剂接触,其与无电子种子金属离子反应形成pKsp小于40的化学金属化合物。然后将该结合的无电子种子金属化合物无电镀 具有合适的导电金属。

    Iodide containing high bromide tabular grain emulsions exhibiting
improved photoefficiency
    6.
    发明授权
    Iodide containing high bromide tabular grain emulsions exhibiting improved photoefficiency 失效
    碘化物含有表现出改进的光效率的高溴化物片状颗粒乳剂

    公开(公告)号:US5728515A

    公开(公告)日:1998-03-17

    申请号:US639449

    申请日:1996-04-29

    IPC分类号: G03C1/005 G03C1/035

    CPC分类号: G03C1/0051

    摘要: A photographically useful high bromide tabular grain silver halide emulsion is disclosed in which iodide is incorporated in a tabular grain central region to lower contrast and in a peripheral region zone to increase photoefficiency. A further increase in photoefficiency is provided by an annular spacer region interposed between the central region and peripheral region zone having a lower iodide content than either.

    摘要翻译: 公开了一种摄影有用的高溴化物片状卤化银乳剂,其中将碘化物并入片状晶粒中心区域以降低对比度,并在周边区域加入光效率。 光效率的进一步提高是由中间区域和周边区域之间的环状间隔区提供的,碘化物含量低于其中之一。

    Radiation-sensitive silver halide grains internally containing a
discontinuous crystal phase
    7.
    发明授权
    Radiation-sensitive silver halide grains internally containing a discontinuous crystal phase 失效
    内部含有不连续结晶相的辐射敏感卤化银颗粒

    公开(公告)号:US5695923A

    公开(公告)日:1997-12-09

    申请号:US707814

    申请日:1996-08-30

    IPC分类号: G03C1/035

    CPC分类号: G03C1/035

    摘要: A photographic emulsion is disclosed in which radiation-sensitive silver halide grains are present containing (a) a continuous silver halide phase of a face centered cubic rock salt crystal lattice structure and (b) a discontinuous phase in the form of discrete islands separated by and surrounded by the continuous phase, each of the islands exhibiting a silver iodide crystal lattice structure.

    摘要翻译: 公开了一种照相乳剂,其中存在辐射敏感卤化银颗粒,其包含(a)面心立方岩盐晶格结构的连续卤化银相和(b)以离散岛形式分离的不连续相, 被连续相包围,每个岛呈现碘化银晶格结构。

    Forming conductive metal patterns using water-soluble polymers
    8.
    发明授权
    Forming conductive metal patterns using water-soluble polymers 有权
    使用水溶性聚合物形成导电金属图案

    公开(公告)号:US09389512B2

    公开(公告)日:2016-07-12

    申请号:US14501206

    申请日:2014-09-30

    IPC分类号: G03C5/58 G03F7/16 G03F7/20

    摘要: A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises pendant photosensitive 1,2-diarylethylene groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

    摘要翻译: 可以使用含有具有反应性聚合物的反应性组合物的聚合物层形成导电图案。 该反应性聚合物包括侧光敏1,2-二亚乙基。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去,但聚合物层的暴露区域与无电子种子金属离子接触,然后将其还原,然后用合适的金属进行无电镀 以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。

    Forming conductive metal patterns using water-soluble polymers
    9.
    发明授权
    Forming conductive metal patterns using water-soluble polymers 有权
    使用水溶性聚合物形成导电金属图案

    公开(公告)号:US09360759B2

    公开(公告)日:2016-06-07

    申请号:US14484608

    申请日:2014-09-12

    IPC分类号: G03F7/00 G03F7/40 G03F7/038

    CPC分类号: G03F7/40 G03F7/038 G03F7/0388

    摘要: A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises (i) a backbone, and (ii) pendant photosensitive non-aromatic unsaturated heterocyclic groups comprising an amide group that is conjugated with a carbon-carbon double bond. The non-aromatic unsaturated heterocyclic groups are linked to the backbone at an amide nitrogen atom. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.

    摘要翻译: 可以使用含有具有反应性聚合物的反应性组合物的聚合物层形成导电图案。 该反应性聚合物包含(i)主链,和(ii)包含与碳 - 碳双键结合的酰胺基的侧光敏非芳族不饱和杂环基。 非芳族不饱和杂环基团在酰胺氮原子上与主链连接。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去,但聚合物层的暴露区域与无电子种子金属离子接触,然后将其还原,然后用合适的金属进行无电镀 以形成所需的导电图案。 在该过程中可以制备各种物品,并且产品可以并入各种电子设备中。

    Electroless plating method using halide
    10.
    发明授权
    Electroless plating method using halide 有权
    使用卤化物的无电镀法

    公开(公告)号:US09005854B1

    公开(公告)日:2015-04-14

    申请号:US14071993

    申请日:2013-11-05

    摘要: A conductive pattern is formed using a reactive polymer comprising pendant tertiary alkyl ester groups, a compound that provides an acid upon exposure to radiation, and a crosslinking agent. A polymeric layer is patternwise exposed to form first exposed regions with a polymer comprising carboxylic acid groups that are contacted with electroless seed metal ions, and then contacted with a halide to form corresponding electroless seed metal halide. Another exposure converts electroless seed metal halide to electroless seed metal nuclei and forms second exposed regions. A reducing agent is used to develop the electroless seed metal nuclei in the second exposed regions, or to develop the electroless seed metal halide in the first exposed regions. Fixing is used to remove any remaining electroless seed metal halide. The electroless seed metal nuclei are then electrolessly plated in various exposed regions.

    摘要翻译: 导电图案使用包含叔烷基叔酯基团的反应性聚合物,暴露于辐射时提供酸的化合物和交联剂形成。 聚合物层被图案化地暴露以形成第一暴露区域,其中聚合物包含与无电子种子金属离子接触的羧酸基团,然后与卤化物接触以形成相应的无电子种子金属卤化物。 另一种曝光将无电子种子金属卤化物转化为无电子种子金属核并形成第二暴露区域。 还原剂用于在第二暴露区域中开发无电子种子金属核,或者在第一暴露区域中开发无电晶种金属卤化物。 固定用于除去剩余的无电子种子金属卤化物。 然后将无电子种子金属核无电镀在各种暴露区域中。