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公开(公告)号：US20150125667A1
公开(公告)日：2015-05-07
申请号：US14071765
申请日：2013-11-05
CPC分类号： C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/38 , C23C18/40 , G03F7/0045 , G03F7/0392 , G03F7/265 , G03F7/38 , Y10T428/24802
摘要： A pattern is formed in a polymeric layer comprising a reactive composition that comprises: (a) a polymer comprising pendant—arylene-X—C(═O)—O— t-alkyl groups that comprise a blocking group that is cleavable to provide pendant—arylene-XH groups, (b) a compound that provides a cleaving acid upon exposure to radiation having a λmax of 150 nm and to 450 nm, which cleaving acid has a pKa of 2 or less as measured in water, and (c) optionally, a photosensitizer. The polymeric layer is imagewise exposed to suitable radiation to provide non-exposed regions and exposed regions comprising a de-blocked and crosslinked polymer with pendant—arylene-XH groups. The exposed regions are contacted with electroless seed metal ions in the de-blocked and crosslinked polymer. After reduction, the corresponding electroless seed metal nuclei are electrolessly plated using a suitable metal that is the same as or different from the corresponding electroless seed metal nuclei.
摘要翻译： 在包含反应性组合物的聚合物层中形成图案，所述聚合物层包含：（a）包含侧基亚芳基-X-C（= O）-O- t-烷基的聚合物，其包含可切割以提供侧基的封闭基团 - 亚芳基-XH基团，（b）在暴露于λmax为150nm至450nm的辐射下提供裂解酸的化合物，该切割酸在水中测得的pKa为2或更小，和（c） 任选地，光敏剂。 将聚合物层成像暴露于合适的辐射以提供非暴露区域和包含具有侧链亚芳基-XH基团的去封闭和交联的聚合物的暴露区域。 暴露的区域与去封闭和交联的聚合物中的无电子种子金属离子接触。 还原后，使用与相应的无电子种子金属核相同或不同的合适金属对相应的无电子晶种金属核进行无电镀。
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公开(公告)号：US09360759B2
公开(公告)日：2016-06-07
申请号：US14484608
申请日：2014-09-12
CPC分类号： G03F7/40 , G03F7/038 , G03F7/0388
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises (i) a backbone, and (ii) pendant photosensitive non-aromatic unsaturated heterocyclic groups comprising an amide group that is conjugated with a carbon-carbon double bond. The non-aromatic unsaturated heterocyclic groups are linked to the backbone at an amide nitrogen atom. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用含有具有反应性聚合物的反应性组合物的聚合物层形成导电图案。 该反应性聚合物包含（i）主链，和（ii）包含与碳 - 碳双键结合的酰胺基的侧光敏非芳族不饱和杂环基。 非芳族不饱和杂环基团在酰胺氮原子上与主链连接。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去，但聚合物层的暴露区域与无电子种子金属离子接触，然后将其还原，然后用合适的金属进行无电镀 以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US20160077438A1
公开(公告)日：2016-03-17
申请号：US14484608
申请日：2014-09-12
CPC分类号： G03F7/40 , G03F7/038 , G03F7/0388
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises (i) a backbone, and (ii) pendant photosensitive non-aromatic unsaturated heterocyclic groups comprising an amide group that is conjugated with a carbon-carbon double bond. The non-aromatic unsaturated heterocyclic groups are linked to the backbone at an amide nitrogen atom. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用含有具有反应性聚合物的反应性组合物的聚合物层形成导电图案。 该反应性聚合物包含（i）主链，和（ii）包含与碳 - 碳双键结合的酰胺基的侧光敏非芳族不饱和杂环基。 非芳族不饱和杂环基团在酰胺氮原子上与主链连接。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去，但聚合物层的暴露区域与无电子种子金属离子接触，然后将其还原，然后用合适的金属进行无电镀 以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US09128378B2
公开(公告)日：2015-09-08
申请号：US14071765
申请日：2013-11-05
CPC分类号： C23C18/1603 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/38 , C23C18/40 , G03F7/0045 , G03F7/0392 , G03F7/265 , G03F7/38 , Y10T428/24802
摘要： A pattern is formed in a polymeric layer comprising a reactive composition that comprises: (a) a polymer comprising pendant -arylene-X—C(═O)—O— t-alkyl groups that comprise a blocking group that is cleavable to provide pendant -arylene-XH groups, (b) a compound that provides a cleaving acid upon exposure to radiation having a λmax of 150 nm and to 450 nm, which cleaving acid has a pKa of 2 or less as measured in water, and (c) optionally, a photosensitizer. The polymeric layer is imagewise exposed to suitable radiation to provide non-exposed regions and exposed regions comprising a de-blocked and crosslinked polymer with pendant -arylene-XH groups. The exposed regions are contacted with electroless seed metal ions in the de-blocked and crosslinked polymer. After reduction, the corresponding electroless seed metal nuclei are electrolessly plated using a suitable metal that is the same as or different from the corresponding electroless seed metal nuclei.
摘要翻译： 在包含反应性组合物的聚合物层中形成图案，所述聚合物层包含：（a）包含侧链 - 亚芳基-X-C（= O）-O- t-烷基的聚合物，其包含可切割以提供侧基的封闭基团 - 亚芳基-XH基团，（b）在暴露于λmax为150nm至450nm的辐射下提供裂解酸的化合物，该切割酸在水中测得的pKa为2或更小，和（c） 任选地，光敏剂。 将聚合物层成像暴露于合适的辐射以提供非暴露区域和包含具有侧链 - 亚芳基-XH基团的去封闭和交联的聚合物的暴露区域。 暴露的区域与去封闭和交联的聚合物中的无电子种子金属离子接触。 还原后，使用与相应的无电子种子金属核相同或不同的合适金属对相应的无电子晶种金属核进行无电镀。
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公开(公告)号：US09081282B1
公开(公告)日：2015-07-14
申请号：US14187423
申请日：2014-02-24
CPC分类号： G03F7/0388 , G03F7/00 , G03F7/40 , G03F7/405
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition that comprises a reactive polymer that is metal ion-complexing, water-soluble, and crosslinkable. This reactive polymer comprises pendant groups comprising crosslinkable —C(═O)—CR═CR1—Y— groups wherein R and R1 are defined in the disclosure, as well as metal ion-complexing and water solubilizing groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced. The resulting electroless seed metal nuclei are electrolessly plated with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用包含反应性组合物的聚合物层形成导电图案，所述反应性组合物包含金属离子络合，水溶性和可交联的反应性聚合物。 该反应性聚合物包括包含可交联的-C（= O）-CR = CR 1 -Y-基团的侧基，其中R和R 1在本公开内定义，以及金属离子络合和水溶性基团。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被去除，但是聚合物层的暴露区域与无电晶种金属离子接触，然后将其还原。 所得无电子种子金属核用无电镀的合适金属镀以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US20150125674A1
公开(公告)日：2015-05-07
申请号：US14071879
申请日：2013-11-05
CPC分类号： G03F7/40 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/38 , G03F7/039 , G03F7/16 , G03F7/20 , H05K3/185 , H05K2201/0166 , H05K2201/0236 , H05K2203/0759 , Y10T428/24917
摘要： A conductive pattern is prepared in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a λmax of at least 150 nm and up to and including 450 nm, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The pattern of electroless seed metal ions is then reduced to provide a pattern of corresponding electroless seed metal nuclei. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.
摘要翻译： 在聚合物层中制备导电图案，该聚合物层具有（a）包含叔烷基酯基侧基的反应性聚合物，（b）在暴露于λmax为至少150nm并且包括 450nm，（c）交联剂。 图案化地暴露聚合物层以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 然后减少无电子种子金属离子的图案以提供相应的无电子种子金属核的图案。 然后将相应的无电子种子金属核用导电金属无电镀。
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公开(公告)号：US20160091793A1
公开(公告)日：2016-03-31
申请号：US14501206
申请日：2014-09-30
CPC分类号： G03F7/031 , G03F7/0388 , G03F7/32 , G03F7/38 , G03F7/40
摘要： A conductive pattern can be formed using a polymeric layer that contains a reactive composition having a reactive polymer. This reactive polymer comprises pendant photosensitive 1,2-diarylethylene groups. The reactive composition can be patternwise exposed to suitable radiation to induce crosslinking within the reactive polymer. The reactive composition and reactive polymer in the non-exposed regions can be removed due to their aqueous solubility, but the exposed regions of the polymeric layer are contacted with electroless seed metal ions, which are then reduced, followed by electrolessly plating with a suitable metal to form the desired conductive pattern. Various articles can be prepared during this process, and the product article can be incorporated into various electronic devices.
摘要翻译： 可以使用含有具有反应性聚合物的反应性组合物的聚合物层形成导电图案。 该反应性聚合物包括侧光敏1,2-二亚乙基。 反应性组合物可以图案化地暴露于合适的辐射以诱导反应性聚合物内的交联。 非暴露区域中的反应性组合物和反应性聚合物可以由于其水溶性而被除去，但聚合物层的暴露区域与无电子种子金属离子接触，然后将其还原，然后用合适的金属进行无电镀 以形成所需的导电图案。 在该过程中可以制备各种物品，并且产品可以并入各种电子设备中。
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公开(公告)号：US20160046748A1
公开(公告)日：2016-02-18
申请号：US14457477
申请日：2014-08-12
IPC分类号： C08F220/68
CPC分类号： C08F220/68 , C08F20/38 , C08F28/02 , C08F120/38 , C08F122/24 , C08F128/02 , C08F220/38 , C08F2220/382 , C08F2220/385 , C08F2220/387
摘要： Crosslinkable polymers comprise recurring units represented by: wherein R, R′, and R″ are independently hydrogen or an alkyl, cyano, or halo group; R1 is hydrogen or a halo, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, cyano, hydroxy, alkoxy, carboxy, or ester group; L is an organic linking group; EWG represents an electron withdrawing group having a Hammett-sigma value greater than or equal to 0.35 such that the oxygen-carbon bond in O—C(EWG)(R1) is cleavable in the presence of a cleaving acid having a pKa of 2 or less as measured in water; Ar is a substituted or unsubstituted arylene group; X is NR2 or oxygen; R2 is hydrogen or an alkyl group; t-alkyl represents a tertiary alkyl group having 4 to 6 carbon atoms, and m represents at least 1 mol % and up to and including 100 mol %, based on the total recurring units in the polymer.
摘要翻译： 可交联聚合物包含由下式表示的重复单元：其中R，R'和R“独立地为氢或烷基，氰基或卤代基; R 1是氢或卤素，取代或未取代的烷基，取代或未取代的环烷基，氰基，羟基，烷氧基，羧基或酯基; L是有机连接基团; EWG表示具有大于或等于0.35的哈米特 - 西格玛值的吸电子基团，使得O-C（EWG）（R1）中的氧 - 碳键可在pKa为2的裂解酸存在下裂解，或 较少在水中测量; Ar是取代或未取代的亚芳基; X为NR2或氧; R2是氢或烷基; 基于聚合物中的总重复单元，t-烷基表示具有4-6个碳原子的叔烷基，m表示至少1mol％且至多且包括100mol％。
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公开(公告)号：US09249248B1
公开(公告)日：2016-02-02
申请号：US14457477
申请日：2014-08-12
IPC分类号： C08F220/38 , C08F220/68 , C08F222/24 , C08F20/38 , C08F28/02 , C08F120/38 , C08F122/24 , C08F128/02
CPC分类号： C08F220/68 , C08F20/38 , C08F28/02 , C08F120/38 , C08F122/24 , C08F128/02 , C08F220/38 , C08F2220/382 , C08F2220/385 , C08F2220/387
摘要： Crosslinkable polymers comprise recurring units represented by: wherein R, R′, and R″ are independently hydrogen or an alkyl, cyano, or halo group; R1 is hydrogen or a halo, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, cyano, hydroxy, alkoxy, carboxy, or ester group; L is an organic linking group; EWG represents an electron withdrawing group having a Hammett-sigma value greater than or equal to 0.35 such that the oxygen-carbon bond in O—C(EWG)(R1) is cleavable in the presence of a cleaving acid having a pKa of 2 or less as measured in water; Ar is a substituted or unsubstituted arylene group; X is NR2 or oxygen; R2 is hydrogen or an alkyl group; t-alkyl represents a tertiary alkyl group having 4 to 6 carbon atoms, and m represents at least 1 mol % and up to and including 100 mol %, based on the total recurring units in the polymer.
摘要翻译： 可交联聚合物包含由下式表示的重复单元：其中R，R'和R“独立地为氢或烷基，氰基或卤代基; R 1是氢或卤素，取代或未取代的烷基，取代或未取代的环烷基，氰基，羟基，烷氧基，羧基或酯基; L是有机连接基团; EWG表示具有大于或等于0.35的哈米特 - 西格玛值的吸电子基团，使得O-C（EWG）（R1）中的氧 - 碳键可在pKa为2的裂解酸存在下裂解，或 较少在水中测量; Ar是取代或未取代的亚芳基; X为NR2或氧; R2是氢或烷基; 基于聚合物中的总重复单元，t-烷基表示具有4-6个碳原子的叔烷基，m表示至少1mol％且至多且包括100mol％。
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公开(公告)号：US09023560B1
公开(公告)日：2015-05-05
申请号：US14072049
申请日：2013-11-05
CPC分类号： C23C18/204 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/2033 , C23C18/206 , C23C18/285 , C23C18/30 , G03F7/038 , G03F7/0392 , G03F7/265 , G03F7/38 , G03F7/40 , G03F7/405 , Y10T428/24802
摘要： A conductive pattern is formed in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to radiation to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. This pattern of electroless seed metal ions can be contacted with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40. This bound electroless seed metal compound is then electrolessly plated with a suitable conductive metal.
摘要翻译： 导电图案形成在聚合物层中，该聚合物层具有（a）包含叔烷基酯基侧基的反应性聚合物，（b）暴露于辐射时提供酸的化合物，和（c）交联剂。 将聚合物层图案地暴露于辐射以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 无电子种子金属离子的这种图案可以与非还原试剂接触，其与无电子种子金属离子反应形成pKsp小于40的化学金属化合物。然后将该结合的无电子种子金属化合物无电镀 具有合适的导电金属。
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