公开(公告)号：US20060220234A1

公开(公告)日：2006-10-05

申请号：US11322617

申请日：2005-12-30

申请人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

发明人： Kenneth Honer ,  Giles Humpston ,  David Tuckerman ,  Michael Nystrom

IPC分类号： H01L23/34

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

公开(公告)号：US20060109366A1

公开(公告)日：2006-05-25

申请号：US11265727

申请日：2005-11-02

申请人： Giles Humpston ,  Kenneth Honer ,  David Tuckerman

发明人： Giles Humpston ,  Kenneth Honer ,  David Tuckerman

IPC分类号： H04N5/225

CPC分类号： H01L27/14618 ,  G02B7/02 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49117 ,  H01L2924/00

摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.

摘要翻译： 电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。 光学单元（50）包括一个或多个光学元件，例如透镜（58）。 光学单元具有接合特征（64），其接合传感器单元上​​的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

公开(公告)号：US20080029879A1

公开(公告)日：2008-02-07

申请号：US11711595

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

IPC分类号： H01L23/10 ,  H01L21/58

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

摘要翻译： 提供了带芯芯片封装，其中光电子器件芯片具有在芯片的表面处暴露在其上的微电子电路，其上安装有覆盖在光电子器件和微电子电路上的盖。 不透明的膜可以附着到盖子上以覆盖微电子电路，同时暴露光电子器件。 还提供了带盖的芯片封装，其中盖子覆盖安装在芯片上的有源或无源器件。 接线迹线可以嵌入在盖子和芯片之间的粘合剂中。

公开(公告)号：US20080002460A1

公开(公告)日：2008-01-03

申请号：US11711882

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom

IPC分类号： H01L31/0232 ,  G11C11/00 ,  H01L21/02 ,  H01L21/82 ,  H01L23/02 ,  H01L23/04

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips, each packaged chip having a protective layer, e.g., a transparent lid, metallic enclosure layer, shield layer, etc., and methods are provided for manufacturing such protective layer to be incorporated into a packaged chip. Lidded chip structures, and assemblies are also provided which include lidded chips.

摘要翻译： 提供了用于制造封装芯片的方法，每个封装芯片具有保护层，例如透明盖，金属外壳层，屏蔽层等，并且提供了用于制造要并入封装芯片的保护层的方法。 还提供了包括芯片的芯片结构和组件。

公开(公告)号：US20080001241A1

公开(公告)日：2008-01-03

申请号：US11713804

申请日：2007-03-01

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Charles Goudge ,  Anita Woll

IPC分类号： H01L31/0203 ,  H01L21/50 ,  H01L23/02

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Methods are provided for fabricating packaged chips having protective layers, e.g., lids or other overlying layers having transparent, partially transparent, or opaque characteristics or a combination of such characteristics. Methods are provided for fabricating the packaged chips. Lidded chip structures and assemblies including lidded chips are also provided.

摘要翻译： 提供了用于制造具有保护层的封装芯片的方法，例如具有透明，部分透明或不透明特性的盖或其它上覆层或这些特性的组合。 提供了制造封装芯片的方法。 还提供了带芯芯片的芯片结构和组件。

公开(公告)号：US20070147816A1

公开(公告)日：2007-06-28

申请号：US11318874

申请日：2005-12-27

申请人： Giles Humpston ,  Kenneth Honer

发明人： Giles Humpston ,  Kenneth Honer

IPC分类号： G03B17/00

CPC分类号： G03B17/00 ,  G02B3/14 ,  G02B26/005 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00

摘要： An electronic camera module includes a lens or refractive element formed by a pair of immiscible liquids and having optical properties which can be varied by applying a voltage so as to deform the meniscus. One of the two liquids extends from the meniscus all the way to the front surface of the sensor, so that light passing through the meniscus does not encounter further changes in refractive index enroute to the sensor.

摘要翻译： 电子照相机模块包括由一对不混溶液体形成的具有光学特性的透镜或折射元件，该特性可以通过施加电压以使弯液面变形来改变。 两个液体中的一个液体从弯液面一直延伸到传感器的前表面，使得穿过弯月面的光不会遇到传感器的折射率的进一步变化。

公开(公告)号：US20070096311A1

公开(公告)日：2007-05-03

申请号：US11641152

申请日：2006-12-19

申请人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

发明人： Giles Humpston ,  David Tuckerman ,  Bruce McWilliams ,  Belgacem Haba ,  Craig Mitchell

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The electrical interconnects may be solid, so as to form seals extending across the through holes. In some cases, stud bumps extend from the bond pads, forming parts of the electrical interconnects. In some cases, a fusible conductive medium forms a part of the electrical interconnects.

摘要翻译： 提供了覆盖芯片和形成封盖芯片的方法，其中电互连通过至少部分地通过盖的多个通孔从芯片的焊盘延伸的导电元件制成。 电互连可以是固体的，以便形成延伸穿过通孔的密封件。 在一些情况下，螺柱凸起从接合焊盘延伸，形成电互连的部分。 在一些情况下，可熔导电介质形成电互连的一部分。

公开(公告)号：US20060027899A1

公开(公告)日：2006-02-09

申请号：US11166861

申请日：2005-06-24

申请人： Giles Humpston ,  Masud Beroz ,  David Tuckerman

发明人： Giles Humpston ,  Masud Beroz ,  David Tuckerman

IPC分类号： H01L23/495

CPC分类号： H01L21/563 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package includes a microelectronic element having faces and contacts, and a flexible substrate spaced from and overlying a first face of the microelectronic element, the flexible substrate having conductive pads facing away from the first face of the microelectronic element. The package includes a plurality of spheres attached to the conductive pads of the flexible substrate and projecting away from the first face of the microelectronic element, each sphere having a contact surface remote from the conductive pads, the contact surfaces of the spheres including a contact metal devoid of solder. The package also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element, the spheres being offset from the support elements.

摘要翻译： 微电子封装包括具有面和触点的微电子元件，以及与微电子元件的第一面间隔开并覆盖微电子元件的第一面的柔性基板，柔性基板具有背离微电子元件的第一面的导电焊盘。 该封装包括附接到柔性基板的导电焊盘并远离微电子元件的第一面突出的多个球体，每个球体具有远离导电焊盘的接触表面，球体的接触表面包括接触金属 没有焊料。 所述包装还包括多个支撑元件，其设置在所述微电子元件和所述基板之间，用于将所述柔性基板支撑在所述微电子元件上方，所述球体与所述支撑元件相抵消。

公开(公告)号：US20050189622A1

公开(公告)日：2005-09-01

申请号：US11068830

申请日：2005-03-01

申请人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

发明人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

IPC分类号： B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC分类号： B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

公开(公告)号：US20060032670A1

公开(公告)日：2006-02-16

申请号：US10917978

申请日：2004-08-13

申请人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David Tuckerman ,  Giles Humpston ,  Richard Crisp

IPC分类号： H05K1/14

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。