公开(公告)号：US08065797B2

公开(公告)日：2011-11-29

申请号：US11896774

申请日：2007-09-05

申请人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

发明人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

IPC分类号： H01K3/10 ,  H05K3/36 ,  H05K3/02 ,  H05K3/10 ,  H05K1/00 ,  H05K1/09

CPC分类号： H05K3/0017 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/20 ,  H05K3/205 ,  H05K3/426 ,  H05K3/4614 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2203/0278 ,  H05K2203/0384 ,  H05K2203/0582 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

摘要翻译： 公开了一种制造印刷电路板的方法。 一种制造印刷电路板的方法，包括：在形成有内部电路的芯层的至少一个表面上堆叠绝缘层，并形成外部电路图案; 将外部电路图案埋在绝缘层中; 去除外部电路图案以形成微小凹槽并固化绝缘层; 通过在金属槽中填充金属而形成外部电路，可以容易地形成高分辨率的细线电路，并且能够降低制造成本并提高生产率。

公开(公告)号：US20080052905A1

公开(公告)日：2008-03-06

申请号：US11896774

申请日：2007-09-05

申请人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

发明人： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

IPC分类号： H05K3/02

CPC分类号： H05K3/0017 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/20 ,  H05K3/205 ,  H05K3/426 ,  H05K3/4614 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2203/0278 ,  H05K2203/0384 ,  H05K2203/0582 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

摘要翻译： 公开了一种制造印刷电路板的方法。 一种制造印刷电路板的方法，包括：在形成有内部电路的芯层的至少一个表面上堆叠绝缘层，并形成外部电路图案; 将外部电路图案埋在绝缘层中; 去除外部电路图案以形成微小凹槽并固化绝缘层; 通过在金属槽中填充金属而形成外部电路，能够容易地形成高分辨率的细线电路，并且能够降低制造成本并提高生产率。