Gas sensor and protection member for gas sensor

    公开(公告)号:US12247944B2

    公开(公告)日:2025-03-11

    申请号:US17769575

    申请日:2020-09-28

    Abstract: A gas sensor (1) including a sensor element (10); a metallic shell (138); a tubular outer surface member (190) attached directly or indirectly to the metallic shell, constitutes an outer surface of the gas sensor, and extends toward a rear end side in relation to the metallic shell; and a tubular protection member (210, 220) which is detachably fixed to a fixation region C1, C2 of an outer circumference of the outer surface member. The protection member includes a first arc portion (212), a second arc portion (222), and a fixation portion (214,224) brought into contact with and is fixed to the fixation region. When the protection member fixed to the outer circumference of the outer surface member by fixing the fixation portion to the fixation region is viewed in the axial O direction, the first arc portion and the second arc portion cover in total at least 90% of the entire circumference of the outer surface of the outer surface member.

    Method for manufacturing holding device and holding device

    公开(公告)号:US12027406B2

    公开(公告)日:2024-07-02

    申请号:US17052634

    申请日:2019-01-08

    Abstract: A holding device manufacturing method includes a step of preparing a first joined body which includes a pre-machining ceramic member having a first surface and a fifth surface located opposite the first surface and approximately parallel to the first surface, a base member, and a joining portion disposed between the first surface of the pre-machining ceramic member and a third surface of the base member and joining the pre-machining ceramic member and the base member together. The thickness of the joining portion of the first joined body in a first direction, in which the first surface and the third surface face each other via the joining portion, increases from one end side toward the other end side of the joining portion in a second direction perpendicular to the first direction. The method includes a step of machining the fifth surface of the pre-machining ceramic member in the first joined body.

    Electrode-embedded member and method for manufacturing same, electrostatic chuck, and ceramic heater

    公开(公告)号:US11869796B2

    公开(公告)日:2024-01-09

    申请号:US17416127

    申请日:2020-03-19

    Inventor: Masaki Yabuhana

    CPC classification number: H01L21/6833 H01L21/67103 H02N13/00

    Abstract: An electrode-embedded member 1 includes a ceramic-made substrate 2, an electrode 3, a connection member 4 containing at least one of tungsten and molybdenum and embedded in the substrate 2 in a state in which a first principal surface 4a faces the electrode 3 and is electrically connected to the electrode 3, and a hole portion 5 extending from an outer surface of the substrate 2 to a second principal surface 4b of the connection member 4. A buffer member 10 embedded in the substrate 2 contains at least a ceramic material forming the substrate 2 and a conductive material containing at least one of tungsten and molybdenum as a constituent element. The buffer member 10 covers at least part of an edge of the connection member 4.

    Light-emitting apparatus and light-emitting element housing

    公开(公告)号:US11824325B2

    公开(公告)日:2023-11-21

    申请号:US17463714

    申请日:2021-09-01

    Inventor: Shingo Totani

    CPC classification number: H01S5/0611 H01S5/0087 H01S5/0225

    Abstract: A multilayer wiring substrate includes a first wiring substrate including a plurality of stacked layers made of a thermo setting resin and having a wiring layer formed between each adjacent layer of the layers in a state in contact with the adjacent layers, a second wiring substrate made of a ceramic, and a joining layer disposed between a back surface of the first wiring substrate and a front surface of the second wiring substrate and configured to join the first wiring substrate and the second wiring substrate to each other, wherein at least a surface of the joining layer adjacent to the second wiring substrate is made of a thermo plastic resin.

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