摘要:
When a built-in nonvolatile memory in a microcomputer is tested, a control program prestored in a boot ROM is run upon entering a test command from an external communication device; a test program is transferred from the external communication device to a built-in RAM through a communication circuit; a control of a CPU is switched to the built-in RAM after the test program has been transferred and a test is conducted on the nonvolatile memory; and a test result and a fail log are transferred to the external communication device through the communication circuit. Consequently, the built-in nonvolatile memory in the microcomputer can be checked without leaving the test program on the chip.
摘要:
A MEMS device includes a mirror substrate (200), an electrode substrate (301) arranged so as to face the mirror substrate (200), a mirror (230) serving as a movable member rotatably supported in an opening portion of the mirror substrate (200) via support members, a driving electrode (101) arranged on an insulating film (104) on a surface of the electrode substrate (301) facing the mirror substrate (200) so as to face the mirror (230) across a gap and drive the mirror (230), and a lower electrode (103) made of a metal or a semiconductor and formed under the insulating film (104) exposed to the gap so as to be in contact with the insulating film (104).
摘要:
A semiconductor device includes an interlevel film constituted by a first dielectrics film containing dangling bonds and a bonded group of Si and hydrogen, and a second dielectrics film formed on the first dielectrics film.
摘要:
A semiconductor device includes an interlevel film constituted by a first dielectrics film containing dangling bonds and a bonded group of Si and hydrogen, and a second dielectrics film formed on the first dielectrics film.
摘要:
A MEMS device includes a mirror substrate (200), an electrode substrate (301) arranged so as to face the mirror substrate (200), a mirror (230) serving as a movable member rotatably supported in an opening portion of the mirror substrate (200) via support members, a driving electrode (101) arranged on an insulating film (104) on a surface of the electrode substrate (301) facing the mirror substrate (200) so as to face the mirror (230) across a gap and drive the mirror (230), and a lower electrode (103) made of a metal or a semiconductor and formed under the insulating film (104) exposed to the gap so as to be in contact with the insulating film (104).
摘要:
A semiconductor device includes an interlevel film constituted by a first dielectrics film containing dangling bonds and a bonded group of Si and hydrogen, and a second dielectrics film formed on the first dielectrics film.