摘要:
A conductive adhesive tape includes a conductive layer, and an adhesive layer formed on the surface of the conductive layer. In the adhesive layer, an adhesive layer through-hole penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer includes a conductive layer passage portion formed in the adhesive layer through-hole. A low melting point metal layer is provided at an end face of the conductive layer passage portion, the end face reaching surface of the adhesive layer.
摘要:
Disclosed is a double-coated pressure-sensitive adhesive sheet which includes at least a pressure-sensitive adhesive unit including a plastic base film and, present on or above both surfaces thereof, pressure-sensitive adhesive layers; and non-silicone release liners present on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive layers are each formed from an acrylic polymer containing, as essential monomer components, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms and a polar-group-containing monomer. The pressure-sensitive adhesive unit has a thickness of 60 to 160 μm, and each of the two pressure-sensitive adhesive layers of the pressure-sensitive adhesive unit has a thickness of 20 μm or more. The adhesive sheet excels in processability and fittability around bumps and is usable for fixing a flexible printed circuit board or for fixing a hard disk drive component.
摘要:
The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.
摘要:
Provided is an electroconductive pressure-sensitive adhesive tape which can exhibit stable electrical conductivity even when used over a long duration and/or used under severe environmental conditions. The electroconductive pressure-sensitive adhesive tape has a metallic foil and, on one side thereof, a pressure-sensitive adhesive layer, in which the electroconductive pressure-sensitive adhesive tape has a maximum resistance in the first cycle of 1 Ω or less and has a maximum resistance in the 200th cycle being 5 times or less the maximum resistance in the first cycle, as measured in a thermo-cycle test.
摘要:
Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.
摘要:
A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board.
摘要:
Disclosed is a double-coated pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which includes at least a pressure-sensitive adhesive unit including a plastic base film having a thickness of 13 μm or less, and pressure-sensitive adhesive layers on both sides of the plastic base film. The pressure-sensitive adhesive layers are formed from an acrylic polymer containing, as essential monomer components, a polar-group-containing monomer and an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm2 or less when heated at 120° C. for 10 minutes, and shows a split distance (lifting) of 1.5 mm or less.
摘要翻译:公开了一种用于固定柔性印刷电路板的双面压敏粘合片,其包括至少包括具有13μm或更小厚度的塑料基膜的压敏粘合剂单元和压敏粘合剂层 塑料底片两侧。 压敏粘合剂层由含有极性基团的单体和烷基部分为具有2〜14个碳原子的直链或支链烷基的(甲基)丙烯酸烷基酯作为必需单体成分的丙烯酸类聚合物形成, 原子 压敏粘合剂单元的厚度为60μm以下时,在120℃下加热10分钟时,双面粘合片的脱气量为1μg/ cm 2以下,显示出分割距离 (提升)为1.5mm以下。
摘要:
The present invention provides a pressure-sensitive adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process such as a solder reflow process. The pressure-sensitive adhesive tape of the present invention includes: a pressure-sensitive adhesive layer; and a release liner on at least one surface of the pressure-sensitive adhesive layer, wherein a tensile strength of the release liner in a machine direction is 50 MPa to 150 MPa, and a tensile strength of the release liner in a machine direction after heating at 280° C. for 5 min is 20 MPa to 120 MPa.
摘要:
The present invention provides a thermosetting adhesive tape or sheet having a thermosetting adhesive layer, which can be stored stably at room temperature, and, when thermally cured, can exert excellent adhesiveness and high thermal stability after exposure to heat and moist, because the resin in the adhesive rapidly reacts upon curing. The thermosetting adhesive tape or sheet according to the present invention includes a thermosetting adhesive layer which has a gel fraction of less than 70%, a difference in gel fraction between before and after storage at 40° C. for 7 days [(gel fraction after storage at 40° C. for 7 days)−(gel fraction before storage at 40° C. for 7 days)] of 15% or less, and a gel fraction after curing at 150° C. for 1 hour of 90% or more.
摘要:
The present invention has an object to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting. In particular, it is an object of the present invention to provide an electroconductive pressure-sensitive adhesive tape that does not cause separator lifting even when the tape is wound into a roll shape or has a long length and that has excellent protective properties for the pressure-sensitive adhesive layer and excellent handling properties. The electroconductive pressure-sensitive adhesive tape of the present invention includes an electroconductive pressure-sensitive adhesive tape main body having a pressure-sensitive adhesive layer on one side of a metal foil and a terminal formed on the metal foil and penetrating the pressure-sensitive adhesive layer, and includes a separator provided on a surface of the pressure-sensitive adhesive layer and having an elongation of 600% or more in the longitudinal direction.