摘要:
The present invention provides a pressure-sensitive adhesive tape for a flexible printed circuit, from which a release liner can be released without being torn off even after being subjected to a high temperature process such as a solder reflow process. The pressure-sensitive adhesive tape of the present invention includes: a pressure-sensitive adhesive layer; and a release liner on at least one surface of the pressure-sensitive adhesive layer, wherein a tensile strength of the release liner in a machine direction is 50 MPa to 150 MPa, and a tensile strength of the release liner in a machine direction after heating at 280° C. for 5 min is 20 MPa to 120 MPa.
摘要:
The present invention provides a thermosetting adhesive or pressure-sensitive adhesive tape or sheet including: a thermosetting adhesive or pressure-sensitive adhesive layer formed of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) constituted of, as essential monomer components, an alkyl (meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b), and a phenol resin (Y); and provided on at least one surface of the thermosetting adhesive or pressure-sensitive adhesive layer, a release liner including a plastic film substrate and a release layer provided on at least one side of the plastic film substrate, the release layer containing low density polyethylene as a major component and having a thickness of 5 μm or more and less than 20 μm.
摘要:
A conductive adhesive tape includes a conductive layer, and an adhesive layer formed on the surface of the conductive layer. In the adhesive layer, an adhesive layer through-hole penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer includes a conductive layer passage portion formed in the adhesive layer through-hole. A low melting point metal layer is provided at an end face of the conductive layer passage portion, the end face reaching surface of the adhesive layer.
摘要:
The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.
摘要:
The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer as a main component, in which the double-sided pressure-sensitive adhesive tape or sheet has an amount of total outgas of 250 μg/g or less and a diffusion amount of toluene of 10 μg/g or less. The double-sided pressure-sensitive adhesive tape or sheet has a small generating amount of VOC as well as excellent punching processing property and anti-repulsion property.
摘要:
Disclosed is a conductive adhesive tape which can exhibit extremely stable electroconductivity upon use over a long duration and/or use under severe environmental conditions even when applied in a small area. The conductive thermosetting adhesive tape includes a metallic foil; and a thermosetting adhesive layer on one side of the metallic foil. The thermosetting adhesive layer has a bond strength before curing of 2 N/20 mm or more and a bond strength after curing of 10 N/20 mm or more. The conductive thermosetting adhesive tape is preferably one including the metallic foil; the thermosetting adhesive layer on one side of the metallic foil; and a terminal exposed from the surface of the thermosetting adhesive layer, in which the conductive thermosetting adhesive tape has a total area of the terminal present per 30 mm2 of the surface of the thermosetting adhesive layer of from 0.1 to 5 mm2.
摘要:
The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.
摘要:
A conductive adhesive tape includes a conductive layer; an adhesive layer formed at one side in the thickness direction of the conductive layer and containing an adhesive and a conductive filler; and a metal layer interposed between the conductive layer and the adhesive layer. The maximum resistance value in the first cycle measured in a heat cycle test is 0.1Ω or less, and the resistance value increase rate is 100% or less.
摘要:
A conductive adhesive member includes a conductive region continuously exposed along one direction, and an adhesive region exposed along the conductive region.